Development and experimental analysis of a micromachined Resonant Gyrocope

This thesis is concerned with the development and experimental analysis of a resonant gyroscope. Initially, this involved the development of a fabrication process suitable for the construction of metallic microstructures, employing a combination of nickel electroforming and sacrificial layer techniques to realise free-standing and self-supporting mechanical elements. This was undertaken and achieved. Simple beam elements of typically 2.7mm x 1mm x 40µm dimensions have been constructed and subject to analysis using laser doppler interferometry. This analysis tool was used to implement a fill modal analysis in order to experimentally derive dynamic parameters. The characteristic resonance frequencies of these cantilevers have been measured, with 3.14kHz, 23.79kHz, 37.94kHz and 71.22kHz being the typical frequencies of the first four resonant modes. Q-factors of 912, 532, 1490 and 752 have been measured for these modes respectively at 0.01mbar ambient pressure. Additionally the mode shapes of each resonance was derived experimentally and found to be in excellent agreement with finite element predictions. A 4mm nickel ring gyroscope structure has been constructed and analysed using both optical analysis tools and electrical techniques. Using laser doppler interferometry the first four out-of-plane modes of the ring structure were found to be typically 9.893 kHz, 11.349 kHz, 11.418 kHz and 13.904 kHz with respective Q-factors of 1151, 1659, 1573 and 1407 at 0.01 mbar ambient pressure. Although electrical measurements were found to be obscured through cross coupling between drive and detection circuitry, the in-plane operational modes of the gyroscope were sucessfully determined. The Cos2Ө and Sin2Ө operational modes were measured at 36.141 kHz and 36.346 kHz, highlighting a frequency split of 205kHz. Again all experimentally derived modal parameters were in good agreement with finite element predictions. Furthermore, using the analysis model, the angular resolution of the gyroscope has been predicted to be approximately 4.75º/s

Balance-approach For Mechanical Properties Test of Micro Fabricated Structure

Copyright 1997 Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.A simple and effective method using a balance to measure micro force and corresponding deflection is presented. The method is proved to be very practical in testing the force-deflection behavior of silicon cantilever, in which the Young’s modulus of the material can be calculated, and in investigating the static performance of bulk micromachined capacitive accelerometers. The balance approach for micro force-displacement measurement is very attractive for its easiness in operation, low cost and higher resolution.http://dx.doi.org/10.1117/12.28449

Integration of micromachined thermal thermal shear stress sensors with microchannels - design, fabrication and testing

Rochester Institute of Technology, 2005 Includes bibliographical references (leaves 91-96) The emerging picture of microvascular flow strongly suggests that local gradients in shear rate along the arteriole walls play an integral role in the ability of a microvascular network to regulate and modify blood flow. The methods to estimate shear stress from approximations of the velocity profiles determined by in vivo particle tracking experiments in the hamster and computational simulation are limited by assumptions made about the flow and experimental techniques. Right now, our ability to relate wall shear stress in microvessels to corresponding biological function is limited by our ability to accurately determine shear stress. A three dimensional computational model was created to simulate the system\u27s thermal response to the constant temperature control circuit. The model geometry included all fabricated layers in thermal shear stress sensor and the microchannel structure (17 microns x 17 microns). This computational technique was used to optimize the dimensions of the system in order to reduce the amount of heat lost to the substrate and maximize the signal response. Hot film thermal shear stress sensors were successfully integrated with microchannel using surface micromachining technique. The entire device was fabricated and tested at Semiconductor Microsystems Fabrication Laboratory (SMFL) at RIT. This thesis discusses the design and optimization of a thermal shear stress sensor using computational techniques to simulate the sensor\u27s performance in microchannel models of arteriole bifurcations. An attempt has been made to verify thermal-transfer principle of hot film shear stress sensors in microchannel

Teaching MEMS Curriculum in Electrical Engineering Graduate Program

© ASEE 2010Microelectromechanical Systems (MEMS) refer to devices and systems in the size range of 1 micron (1 micron=10-6m) to 1000 microns. Due to their small size, MEMS technology has the advantages of low weight, low cost, low power consumption and high resolution. MEMS have found broad applications in automobile, inertial navigation, light display, optical and RF communications, biomedicine, etc. World’s MEMS market is growing rapidly each year. To meet the strong market demands on MEMS engineers and researchers, we developed MEMS curriculum in our master program in School of Engineering since Fall 2005. In this paper, we shared our experience in teaching the MEMS curriculum in master program of Electrical Engineering department. Three core courses have been developed for MEMS curriculum. The course description, goals, prerequisites, as well as the topics covered in these courses are discussed. Multimedia technology is used in the teaching to enhance the teaching results. Several MEMS course projects using ANSYS simulation are designed to help student accumulate experience in MEMS device design and simulation. Students are fascinated by the MEMS field and continue their master project/thesis research in MEMS. The MEMS curriculum attracted tremendous interest among students, and the students’ feedback on the course have been excellent. This is part of our efforts to prepare students for the future need of economy revival

Degree-per-hour mode-matched micromachined silicon vibratory gyroscopes

The objective of this research dissertation is to design and implement two novel micromachined silicon vibratory gyroscopes, which attempt to incorporate all the necessary attributes of sub-deg/hr noise performance requirements in a single framework: large resonant mass, high drive-mode oscillation amplitudes, large device capacitance (coupled with optimized electronics), and high-Q resonant mode-matched operation. Mode-matching leverages the high-Q (mechanical gain) of the operating modes of the gyroscope and offers significant improvements in mechanical and electronic noise floor, sensitivity, and bias stability. The first micromachined silicon vibratory gyroscope presented in this work is the resonating star gyroscope (RSG): a novel Class-II shell-type structure which utilizes degenerate flexural modes. After an iterative cycle of design optimization, an RSG prototype was implemented using a multiple-shell approach on (111) SOI substrate. Experimental data indicates sub-5 deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 30,000 at 23ºC (in vacuum). The second micromachined silicon vibratory gyroscope presented in this work is the mode-matched tuning fork gyroscope (M2-TFG): a novel Class-I tuning fork structure which utilizes in-plane non-degenerate resonant flexural modes. Operated under vacuum, the M2-TFG represents the first reported high-Q perfectly mode-matched operation in Class-I vibratory microgyroscope. Experimental results of device implemented on (100) SOI substrate demonstrates sub-deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 50,000 at 23ºC. In an effort to increase capacitive aspect ratio, a new fabrication technology was developed that involved the selective deposition of doped-polysilicon inside the capacitive sensing gaps (SPD Process). By preserving the structural composition integrity of the flexural springs, it is possible to accurately predict the operating-mode frequencies while maintaining high-Q operation. Preliminary characterization of vacuum-packaged prototypes was performed. Initial results demonstrated high-Q mode-matched operation, excellent thermal stability, and sub-deg/hr Allan variance bias instability.Ph.D.Committee Chair: Dr. Farrokh Ayazi; Committee Member: Dr. Mark G. Allen; Committee Member: Dr. Oliver Brand; Committee Member: Dr. Paul A. Kohl; Committee Member: Dr. Thomas E. Michael

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Thin-Film AlN-on-Silicon Resonant Gyroscopes: Design, Fabrication, and Eigenmode Operation

Resonant MEMS gyroscopes have been rapidly adopted in various consumer, industrial, and automotive applications thanks to the significant improvements in their performance over the past decade. The current efforts in enhancing the performance of high-precision resonant gyroscopes are mainly focused on two seemingly contradictory metrics, larger bandwidth and lower noise level, to push the technology towards navigation applications. The key enabling factor for the realization of low-noise high-bandwidth resonant gyroscopes is the utilization of a strong electromechanical transducer at high frequencies. Thin-film piezoelectric-on-silicon technology provides a very efficient transduction mechanism suitable for implementation of bulk-mode resonant gyroscopes without the need for submicron capacitive gaps or large DC polarization voltages. More importantly, in-air operation of piezoelectric devices at moderate Q values allows for the cointegration of mode-matched gyroscopes and accelerometers on a common substrate for inertial measurement units. This work presents the design, fabrication, characterization, and method of mode matching of piezoelectric-on-silicon resonant gyroscopes. The degenerate in-plane flexural vibration mode shapes of the resonating structure are demonstrated to have a strong gyroscopic coupling as well as a large piezoelectric transduction coefficient. Eigenmode operation of resonant gyroscopes is introduced as the modal alignment technique for the piezoelectric devices independently of the transduction mechanism. Controlled displacement feedback is also employed as the frequency matching technique to accomplish complete mode matching of the piezoelectric gyroscopes.Ph.D

High performance 3-folded symmetric decoupled MEMS gyroscopes

This thesis reports, for the first time, on a novel design and architecture for realizing inertial grade gyroscope based on Micro-Electro-Mechanical Systems (MEMS) technology. The proposed device is suitable for high-precision Inertial Navigation Systems (INS). The new design has been investigated analytically and numerically by means of Finite Element Modeling (FEM) of the shapes, resonance frequencies and decoupling of the natural drive and sense modes of the various implementations. Also, famous phenomena known as spring softening and spring hardening are studied. Their effect on the gyroscope operation is modeled numerically in Matlab/Simulink platform. This latter model is used to predict the drive/sense mode matching capability of the proposed designs. Based on the comparison with the best recently reported performance towards inertial grade operation, it is expected that the novel architecture further lowers the dominant Brownian (thermo-mechanical) noise level by more than an order of magnitude (down to 0.08º/hr). Moreover, the gyroscope\u27s figure of merit, such as output sensitivity (150 mV/º/s), is expected to be improved by more than two orders of magnitude. This necessarily results in a signal to noise ratio (SNR) which is up to three orders of magnitude higher (up to 1,900mV/ º/hr). Furthermore, the novel concept introduced in this work for building MEMS gyroscopes allows reducing the sense parasitic capacitance by up to an order of magnitude. This in turn reduces the drive mode coupling or quadrature errors in the sensor\u27s output signal. The new approach employs Silicon-on-Insulator (SOI) substrates that allows the realization of large mass (\u3e1.6mg), large sense capacitance (\u3e2.2pF), high quality factors (\u3e21,000), large drive amplitude (~2-4 µm) and low resonance frequency (~3-4 KHz) as well as the consequently suppressed noise floor and reduced support losses for high-performance vacuum operation. Several challenges were encountered during fabrication that required developing high aspect ratio (up to 1:20) etching process for deep trenches (up to 500 µm). Frequency Response measurement platform was built for devices characterization. The measurements were performed at atmospheric pressures causing huge drop of the devices performance. Therefore, various MEMS gyroscope packaging technologies are studied. Wafer Level Packaging (WLP) is selected to encapsulate the fabricated devices under vacuum by utilizing wafer bonding. Through Silicon Via (TSV) technology was developed (as connections) to transfer the electrical signals (of the fabricated devices) outside the cap wafers

Sensing Movement: Microsensors for Body Motion Measurement

Recognition of body posture and motion is an important physiological function that can keep the body in balance. Man-made motion sensors have also been widely applied for a broad array of biomedical applications including diagnosis of balance disorders and evaluation of energy expenditure. This paper reviews the state-of-the-art sensing components utilized for body motion measurement. The anatomy and working principles of a natural body motion sensor, the human vestibular system, are first described. Various man-made inertial sensors are then elaborated based on their distinctive sensing mechanisms. In particular, both the conventional solid-state motion sensors and the emerging non solid-state motion sensors are depicted. With their lower cost and increased intelligence, man-made motion sensors are expected to play an increasingly important role in biomedical systems for basic research as well as clinical diagnostics

Design, Fabrication and Levitation Experiments of a Micromachined Electrostatically Suspended Six-Axis Accelerometer

A micromachined electrostatically suspended six-axis accelerometer, with a square plate as proof mass housed by a top stator and bottom stator, is presented. The device structure and related techniques concerning its operating principles, such as calculation of capacitances and electrostatic forces/moments, detection and levitation control of the proof mass, acceleration measurement, and structural parameters design, are described. Hybrid MEMS manufacturing techniques, including surface micromachining fabrication of thin film electrodes and interconnections, integration fabrication of thick nickel structures about 500 μm using UV-LIGA by successful removal of SU-8 photoresist mold, DRIE of silicon proof mass in thickness of 450 μm, microassembly and solder bonding, were employed to fabricate this prototype microdevice. A levitation experiment system for the fabricated microaccelerometer chip is introduced, and levitation results show that fast initial levitation within 10 ms and stable full suspension of the proof mass have been successfully demonstrated