A novel deep submicron bulk planar sizing strategy for low energy subthreshold standard cell libraries

Engineering andPhysical Science ResearchCouncil (EPSRC) and Arm Ltd for providing funding in the form of grants and studentshipsThis work investigates bulk planar deep submicron semiconductor physics in an attempt to improve standard cell libraries aimed at operation in the subthreshold regime and in Ultra Wide Dynamic Voltage Scaling schemes. The current state of research in the field is examined, with particular emphasis on how subthreshold physical effects degrade robustness, variability and performance. How prevalent these physical effects are in a commercial 65nm library is then investigated by extensive modeling of a BSIM4.5 compact model. Three distinct sizing strategies emerge, cells of each strategy are laid out and post-layout parasitically extracted models simulated to determine the advantages/disadvantages of each. Full custom ring oscillators are designed and manufactured. Measured results reveal a close correlation with the simulated results, with frequency improvements of up to 2.75X/2.43X obs erved for RVT/LVT devices respectively. The experiment provides the first silicon evidence of the improvement capability of the Inverse Narrow Width Effect over a wide supply voltage range, as well as a mechanism of additional temperature stability in the subthreshold regime. A novel sizing strategy is proposed and pursued to determine whether it is able to produce a superior complex circuit design using a commercial digital synthesis flow. Two 128 bit AES cores are synthesized from the novel sizing strategy and compared against a third AES core synthesized from a state-of-the-art subthreshold standard cell library used by ARM. Results show improvements in energy-per-cycle of up to 27.3% and frequency improvements of up to 10.25X. The novel subthreshold sizing strategy proves superior over a temperature range of 0 °C to 85 °C with a nominal (20 °C) improvement in energy-per-cycle of 24% and frequency improvement of 8.65X. A comparison to prior art is then performed. Valid cases are presented where the proposed sizing strategy would be a candidate to produce superior subthreshold circuits

Monolithically Integrated Acoustic Resonators on CMOS for Radio-Frequency Circuit Applications

Wireless communication circuits rely on the use of high-quality passive elements (inductor-capacitor resonant tanks) for the implementation of selective filters and high-purity frequency references (oscillators). Typically available CMOS, on-chip passives suffer from high losses, primarily inductors, and consume large areas that cannot be populated by transistors leading to a significant area penalty. Mechanical resonators exhibit significantly lower losses than their electrical counterparts due to the reduced parasitic loss mechanisms in the mechanical domain. Efficient transduction schemes such as the piezoelectric effect allow for simple electrical actuation and read-out of such mechanical resonators. Piezoelectric thin-film bulk acoustic resonators (FBARs) are currently among the most promising and widely used mechanical resonator structures. However, FBARs are currently only available as off-chip components, which must be connected to CMOS circuitry through wire-bonding and flip-chip schemes. The use of off-chip interfaces introduces considerable parasitics and significant limitations on integration density. Monolithic integration with CMOS substrates alleviates interconnect parasitics, increases integration density and allows for area sharing whereby FBARs reside atop active CMOS circuitry. Close integration of FBARs and CMOS transistors can also enable new circuit paradigms, which simultaneously leverage the strengths of both components. Described here, is a body of work conducted to integrate FBAR resonators with active CMOS substrates (180nm and 65nm processes). A monolithic fabrication method is described which allows for FBAR devices to be constructed atop the backend small CMOS dies through low thermal-budget (< 300°C) post-processing. Stand-alone fabricated devices are characterized and the extracted electrical model is used to design two oscillator chips. The chips comprise amplifier circuitry that functions along with the integrated FBARs to achieve oscillation in the 0.8-2 GHz range. The chips also include test structures to assess the performance of the underlying CMOS transistors before and after the resonator post-processing. A successful FBAR-CMOS oscillator is demonstrated in 65nm CMOS along with characterization of FBARs built on CMOS. The approach presented here can be used for experimenting with more complex circuits leveraging the co-integration of piezoelectric resonators and CMOS transistors

Characterization of process variability and robust optimization of analog circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 161-174).Continuous scaling of CMOS technology has enabled dramatic performance enhancement of CMOS devices and has provided speed, power, and density improvement in both digital and analog circuits. CMOS millimeter-wave applications operating at more than 50GHz frequencies has become viable in sub-100nm CMOS technologies, providing advantages in cost and high density integration compared to other heterogeneous technologies such as SiGe and III-V compound semiconductors. However, as the operating frequency of CMOS circuits increases, it becomes more difficult to obtain sufficiently wide operating ranges for robust operation in essential analog building blocks such as voltage-controlled oscillators (VCOs) and frequency dividers. The fluctuations of circuit parameters caused by the random and systematic variations in key manufacturing steps become more significant in nano-scale technologies. The process variation of circuit performance is quickly becoming one of the main concerns in high performance analog design. In this thesis, we show design and analysis of a VCO and frequency divider operating beyond 70GHz in a 65nm SOI CMOS technology. The VCO and frequency divider employ design techniques enlarging frequency operating ranges to improve the robustness of circuit operation. Circuit performance is measured from a number of die samples to identify the statistical properties of performance variation. A back-propagation of variation (BPV) scheme based on sensitivity analysis of circuit performance is proposed to extract critical circuit parameter variation using statistical measurement results of the frequency divider. We analyze functional failure caused by performance variability, and propose dynamic and static optimization methods to improve parametric yield. An external bias control is utilized to dynamically tune the divider operating range and to compensate for performance variation. A novel time delay model of a differential CML buffer is proposed to functionally approximate the maximum operating frequency of the frequency divider, which dramatically reduces computational cost of parametric yield estimation. The functional approximation enables the optimization of the VCO and frequency divider parametric yield with a reasonable amount of simulation time.by Daihyun Lim.Ph.D

Robust Design With Increasing Device Variability In Sub-Micron Cmos And Beyond: A Bottom-Up Framework

My Ph.D. research develops a tiered systematic framework for designing process-independent and variability-tolerant integrated circuits. This bottom-up approach starts from designing self-compensated circuits as accurate building blocks, and moves up to sub-systems with negative feedback loop and full system-level calibration. a. Design methodology for self-compensated circuits My collaborators and I proposed a novel design methodology that offers designers intuitive insights to create new topologies that are self-compensated and intrinsically process-independent without external reference. It is the first systematic approaches to create "correct-by-design" low variation circuits, and can scale beyond sub-micron CMOS nodes and extend to emerging non-silicon nano-devices. We demonstrated this methodology with an addition-based current source in both 180nm and 90nm CMOS that has 2.5x improved process variation and 6.7x improved temperature sensitivity, and a GHz ring oscillator (RO) in 90nm CMOS with 65% reduction in frequency variation and 85ppm/oC temperature sensitivity. Compared to previous designs, our RO exhibits the lowest temperature sensitivity and process variation, while consuming the least amount of power in the GHz range. Another self-compensated low noise amplifiers (LNA) we designed also exhibits 3.5x improvement in both process and temperature variation and enhanced supply voltage regulation. As part of the efforts to improve the accuracy of the building blocks, I also demonstrated experimentally that due to "diversification effect", the upper bound of circuit accuracy can be better than the minimum tolerance of on-chip devices (MOSFET, R, C, and L), which allows circuit designers to achieve better accuracy with less chip area and power consumption. b. Negative feedback loop based sub-system I explored the feasibility of using high-accuracy DC blocks as low-variation "rulers-on-chip" to regulate high-speed high-variation blocks (e.g. GHz oscillators). In this way, the trade-off between speed (which can be translated to power) and variation can be effectively de-coupled. I demonstrated this proposed structure in an integrated GHz ring oscillators that achieve 2.6% frequency accuracy and 5x improved temperature sensitivity in 90nm CMOS. c. Power-efficient system-level calibration To enable full system-level calibration and further reduce power consumption in active feedback loops, I implemented a successive-approximation-based calibration scheme in a tunable GHz VCO for low power impulse radio in 65nm CMOS. Events such as power-up and temperature drifts are monitored by the circuits and used to trigger the need-based frequency calibration. With my proposed scheme and circuitry, the calibration can be performed under 135pJ and the oscillator can operate between 0.8 and 2GHz at merely 40[MICRO SIGN]W, which is ideal for extremely power-and-cost constraint applications such as implantable biomedical device and wireless sensor networks

Millimeter-Wave CMOS Digitally Controlled Oscillators for Automotive Radars

All-Digital-Phase-Locked-Loops (ADPLLs) are ideal for integrated circuit implementations and effectively generate frequency chirps for Frequency-Modulated-Continuous-Wave (FMCW) radar. This dissertation discusses the design requirements for integrated ADPLL, which is used as chirp synthesizer for FMCW automotive radar and focuses on an analysis of the ADPLL performance based on the Digitally-Controlled-Oscillator (DCO) design parameters and the ADPLL configuration. The fundamental principles of the FMCW radar are reviewed and the importance of linear DCO for reliable operation of the synthesizer is discussed. A novel DCO, which achieves linear frequency tuning steps is designed by arranging the available minimum Metal-Oxide-Metal (MoM) capacitor in unique confconfigurations. The DCO prototype fabricated in 65 nm CMOS fullls the requirements of the 77 GHz automotive radar. The resultant linear DCO characterization can effectively drive a chirp generation system in complete FMCW automotive radar synthesizer

Dynamically Controllable Integrated Radiation and Self-Correcting Power Generation in mm-Wave Circuits and Systems

This thesis presents novel design methodologies for integrated radiators and power generation at mm-wave frequencies that are enabled by the continued integration of various electronic and electromagnetic (EM) structures onto the same substrate. Beginning with the observation that transistors and their connections to EM radiating structures on an integrated substrate are essentially free, the concept of multi-port driven (MPD) radiators is introduced, which opens a vast design space that has been generally ignored due to the cost structure associated with discrete components that favors fewer transistors connected to antennas through a single port. From Maxwell's equations, a new antenna architecture, the radial MPD antennas based on the concept of MPD radiators, is analyzed to gain intuition as to the important design parameters that explain the wide-band nature of the antenna itself. The radiator is then designed and implemented at 160 GHz in a 0.13 um SiGe BiCMOS process, and the single element design has a measured effective isotropic radiated power (EIRP) of +4.6 dBm with a total radiated power of 0.63 mW. Next, the radial MPD radiator is adapted to enable dynamic polarization control (DPC). A DPC antenna is capable of controlling its radiated polarization dynamically, and entirely electronically, with no mechanical reconfiguration required. This can be done by having multiple antennas with different polarizations, or within a single antenna that has multiple drive points, as in the case of the MPD radiator with DPC. This radiator changes its polarization by adjusting the relative phase and amplitude of its multiple ports to produce polarizations with any polarization angle, and a wide range of axial ratios. A 2x1 MPD radiator array with DPC at 105 GHz is presented whose measurements show control of the polarization angle throughout the entire 0 degree through 180 degree range while in the linear polarization mode and maintaining axial ratios above 10 dB in all cases. Control of the axial ratio is also demonstrated with a measured range from 2.4 dB through 14 dB, while maintaining a fixed polarization angle. The radiator itself has a measured maximum EIRP of +7.8 dBm, with a total radiated power of 0.9 mW, and is capable of beam steering. MPD radiators were also applied in the domain of integrated silicon photonics. For these designs, the driver transistor circuitry was replaced with silicon optical waveguides and photodiodes to produce a 350 GHz signal. Three of these optical MPD radiator designs have been implemented as 2x2 arrays at 350 GHz. The first is a beam forming array that has a simulated gain of 12.1 dBi with a simulated EIRP of -2 dBm. The second has the same simulated performance, but includes optical phase modulators that enable two-dimensional beam steering. Finally, a third design incorporates multi-antenna DPC by combining the outputs of both left and right handed circularly polarized MPD antennas to produce a linear polarization with controllable polarization angle, and has a simulated gain of 11.9 dBi and EIRP of -3 dBm. In simulation, it can tune the polarization from 0 degrees through 180 degrees while maintaining a radiated power that has a 0.35 dB maximum deviation from the mean. The reliability of mm-wave radiators and power amplifiers was also investigated, and two self-healing systems have been proposed. Self-healing is a global feedback method where integrated sensors detect the performance of the circuit after fabrication and report that data to a digital control algorithm. The algorithm then is capable of setting actuators that can control the performance of the mm-wave circuit and counteract any performance degradation that is observed by the sensors. The first system is for a MPD radiator array with a partially integrated self-healing system. The self-healing MPD radiator senses substrate modes through substrate mode pickup sensors and infers the far-field radiated pattern from those sensors. DC current sensors are also included to determine the DC power consumption of the system. Actuators are implemented in the form of phase and amplitude control of the multiple drive points. The second self-healing system is a fully integrated self-healing power amplifier (PA) at 28 GHz. This system measures the output power, gain and efficiency of the PA using radio frequency (RF) power sensors, DC current sensors and junction temperature sensors. The digital block is synthesized from VHDL code on-chip and it can actuate the output power combining matching network using tunable transmission line stubs, as well as the DC operating point of the amplifying transistors through bias control. Measurements of 20 chips confirm self-healing for two different algorithms for process variation and transistor mismatch, while measurements from 10 chips show healing for load impedance mismatch, and linearity healing. Laser induced partial and total transistor failure show the benefit of self-healing in the case of catastrophic failure, with improvements of up to 3.9 dB over the default case. An exemplary yield specification shows self-healing improving the yield from 0% up through 80%.</p

Negative Bias Temperature Instability (NBTI) Monitoring and Mitigation Technique for MOSFET

修士論

Study of Single-Event Transient Effects on Analog Circuits

Radiation in space is potentially hazardous to microelectronic circuits and systems such as spacecraft electronics. Transient effects on circuits and systems from high energetic particles can interrupt electronics operation or crash the systems. This phenomenon is particularly serious in complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs) since most of modern ICs are implemented with CMOS technologies. The problem is getting worse with the technology scaling down. Radiation-hardening-by-design (RHBD) is a popular method to build CMOS devices and systems meeting performance criteria in radiation environment. Single-event transient (SET) effects in digital circuits have been studied extensively in the radiation effect community. In recent years analog RHBD has been received increasing attention since analog circuits start showing the vulnerability to the SETs due to the dramatic process scaling. Analog RHBD is still in the research stage. This study is to further study the effects of SET on analog CMOS circuits and introduces cost-effective RHBD approaches to mitigate these effects. The analog circuits concerned in this study include operational amplifiers (op amps), comparators, voltage-controlled oscillators (VCOs), and phase-locked loops (PLLs). Op amp is used to study SET effects on signal amplitude while the comparator, the VCO, and the PLL are used to study SET effects on signal state during transition time. In this work, approaches based on multi-level from transistor, circuit, to system are presented to mitigate the SET effects on the aforementioned circuits. Specifically, RHBD approach based on the circuit level, such as the op amp, adapts the auto-zeroing cancellation technique. The RHBD comparator implemented with dual-well and triple-well is studied and compared at the transistor level. SET effects are mitigated in a LC-tank oscillator by inserting a decoupling resistor. The RHBD PLL is implemented on the system level using triple modular redundancy (TMR) approach. It demonstrates that RHBD at multi-level can be cost-effective to mitigate the SEEs in analog circuits. In addition, SETs detection approaches are provided in this dissertation so that various mitigation approaches can be implemented more effectively. Performances and effectiveness of the proposed RHBD are validated through SPICE simulations on the schematic and pulsed-laser experiments on the fabricated circuits. The proposed and tested RHBD techniques can be applied to other relevant analog circuits in the industry to achieve radiation-tolerance

High Performance Optical Transmitter Ffr Next Generation Supercomputing and Data Communication

High speed optical interconnects consuming low power at affordable prices are always a major area of research focus. For the backbone network infrastructure, the need for more bandwidth driven by streaming video and other data intensive applications such as cloud computing has been steadily pushing the link speed to the 40Gb/s and 100Gb/s domain. However, high power consumption, low link density and high cost seriously prevent traditional optical transceiver from being the next generation of optical link technology. For short reach communications, such as interconnects in supercomputers, the issues related to the existing electrical links become a major bottleneck for the next generation of High Performance Computing (HPC). Both applications are seeking for an innovative solution of optical links to tackle those current issues. In order to target the next generation of supercomputers and data communication, we propose to develop a high performance optical transmitter by utilizing CISCO Systems®\u27s proprietary CMOS photonic technology. The research seeks to achieve the following outcomes: 1. Reduction of power consumption due to optical interconnects to less than 5pJ/bit without the need for Ring Resonators or DWDM and less than 300fJ/bit for short distance data bus applications. 2. Enable the increase in performance (computing speed) from Peta-Flop to Exa-Flops without the proportional increase in cost or power consumption that would be prohibitive to next generation system architectures by means of increasing the maximum data transmission rate over a single fiber. 3. Explore advanced modulation schemes such as PAM-16 (Pulse-Amplitude-Modulation with 16 levels) to increase the spectrum efficiency while keeping the same or less power figure. This research will focus on the improvement of both the electrical IC and optical IC for the optical transmitter. An accurate circuit model of the optical device is created to speed up the performance optimization and enable co-simulation of electrical driver. Circuit architectures are chosen to minimize the power consumption without sacrificing the speed and noise immunity. As a result, a silicon photonic based optical transmitter employing 1V supply, featuring 20Gb/s data rate is fabricated. The system consists of an electrical driver in 40nm CMOS and an optical MZI modulator with an RF length of less than 0.5mm in 0.13&mu m SOI CMOS. Two modulation schemes are successfully demonstrated: On-Off Keying (OOK) and Pulse-Amplitude-Modulation-N (PAM-N N=4, 16). Both versions demonstrate signal integrity, interface density, and scalability that fit into the next generation data communication and exa-scale computing. Modulation power at 20Gb/s data rate for OOK and PAM-16 of 4pJ/bit and 0.25pJ/bit are achieved for the first time of an MZI type optical modulator, respectively