4,415 research outputs found

    DeSyRe: on-Demand System Reliability

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    The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

    Test Scheduling of SoC by using Dynamic Voltage Frequency Scaling (DVFS) Technique

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    High temperature gradients in System on Chip (SoC) lowered the performances, reliability and leakage power. In addition, temperature during testing gain more compared to normal operation. Therefore, the investigation of the impact dynamic voltage frequency scaling (DVFS) on the thermal aware test scheduling performance will be the main contribution of this work. The test scheduling algorithm which embeds frequency scaling effect with dynamic voltage supply is tested on ITC’02 benchmark. The formulation of ILP is to minimize the group of the test session in SoC and continued with DVFS formulation. Compared to the conventional thermal-aware scheduling approach based purely on a frequency scaling, this technique provides shorter overall test times and greatly improved flexibility to satisfy strict thermal constraints. The proposed DVFS with thermal aware task scheduling allows to minimize test time more than 46%

    On the Reliability Assessment of Artificial Neural Networks Running on AI-Oriented MPSoCs

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    Nowadays, the usage of electronic devices running artificial neural networks (ANNs)-based applications is spreading in our everyday life. Due to their outstanding computational capabilities, ANNs have become appealing solutions for safety-critical systems as well. Frequently, they are considered intrinsically robust and fault tolerant for being brain-inspired and redundant computing models. However, when ANNs are deployed on resource-constrained hardware devices, single physical faults may compromise the activity of multiple neurons. Therefore, it is crucial to assess the reliability of the entire neural computing system, including both the software and the hardware components. This article systematically addresses reliability concerns for ANNs running on multiprocessor system-on-a-chips (MPSoCs). It presents a methodology to assign resilience scores to individual neurons and, based on that, schedule the workload of an ANN on the target MPSoC so that critical neurons are neatly distributed among the available processing elements. This reliability-oriented methodology exploits an integer linear programming solver to find the optimal solution. Experimental results are given for three different convolutional neural networks trained on MNIST, SVHN, and CIFAR-10. We carried out a comprehensive assessment on an open-source artificial intelligence-based RISC-V MPSoC. The results show the reliability improvements of the proposed methodology against the traditional scheduling

    SoC Test Applications Using ACO metaheuristic

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    Thermal-Aware Test Scheduling for Core-Based SoC in an Abort-on-First-Fail Test Environment

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    Long test application time and high temperature have become two major issues of system-on-chip (SoC) test. In order to minimize test application times and avoid overheating during tests, we propose a thermal-aware test scheduling technique for core-based SoC in an abort-on-first-fail (AOFF) test environment. The AOFF environment assumes that the test process is terminated as soon as the first fault is detected, which is usually deployed in volume production test. To avoid high temperature, test sets are partitioned into test sub-sequences which are separated by cooling periods. The proposed test scheduling technique utilizes instantaneous thermal simulation results to guide the partitioning of test sets and to determine the lengths of cooling periods. Experimental results have shown that the proposed technique is efficient to minimize the expected test application time while keeping the temperatures of cores under test below the imposed temperature limit

    Reliable Design of Three-Dimensional Integrated Circuits

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