740 research outputs found

    Quiescent current testing of CMOS data converters

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    Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

    Doctor of Philosophy

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    dissertationSince the late 1950s, scientists have been working toward realizing implantable devices that would directly monitor or even control the human body's internal activities. Sophisticated microsystems are used to improve our understanding of internal biological processes in animals and humans. The diversity of biomedical research dictates that microsystems must be developed and customized specifically for each new application. For advanced long-term experiments, a custom designed system-on-chip (SoC) is usually necessary to meet desired specifications. Custom SoCs, however, are often prohibitively expensive, preventing many new ideas from being explored. In this work, we have identified a set of sensors that are frequently used in biomedical research and developed a single-chip integrated microsystem that offers the most commonly used sensor interfaces, high computational power, and which requires minimum external components to operate. Included peripherals can also drive chemical reactions by setting the appropriate voltages or currents across electrodes. The SoC is highly modular and well suited for prototyping in and ex vivo experimental devices. The system runs from a primary or secondary battery that can be recharged via two inductively coupled coils. The SoC includes a 16-bit microprocessor with 32 kB of on chip SRAM. The digital core consumes 350 μW at 10 MHz and is capable of running at frequencies up to 200 MHz. The integrated microsystem has been fabricated in a 65 nm CMOS technology and the silicon has been fully tested. Integrated peripherals include two sigma-delta analog-to-digital converters, two 10-bit digital-to-analog converters, and a sleep mode timer. The system also includes a wireless ultra-wideband (UWB) transmitter. The fullydigital transmitter implementation occupies 68 x 68 μm2 of silicon area, consumes 0.72 μW static power, and achieves an energy efficiency of 19 pJ/pulse at 200 MHz pulse repetition frequency. An investigation of the suitability of the UWB technology for neural recording systems is also presented. Experimental data capturing the UWB signal transmission through an animal head are presented and a statistical model for large-scale signal fading is developed

    Programmable CMOS Analog-to-Digital Converter Design and Testability

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    In this work, a programmable second order oversampling CMOS delta-sigma analog-to-digital converter (ADC) design in 0.5µm n-well CMOS processes is presented for integration in sensor nodes for wireless sensor networks. The digital cascaded integrator comb (CIC) decimation filter is designed to operate at three different oversampling ratios of 16, 32 and 64 to give three different resolutions of 9, 12 and 14 bits, respectively which impact the power consumption of the sensor nodes. Since the major part of power consumed in the CIC decimator is by the integrators, an alternate design is introduced by inserting coder circuits and reusing the same integrators for different resolutions and oversampling ratios to reduce power consumption. The measured peak signal-to-noise ratio (SNR) for the designed second order delta-sigma modulator is 75.6dB at an oversampling ratio of 64, 62.3dB at an oversampling ratio of 32 and 45.3dB at an oversampling ratio of 16. The implementation of a built-in current sensor (BICS) which takes into account the increased background current of defect-free circuits and the effects of process variation on ΔIDDQ testing of CMOS data converters is also presented. The BICS uses frequency as the output for fault detection in CUT. A fault is detected when the output frequency deviates more than ±10% from the reference frequency. The output frequencies of the BICS for various model parameters are simulated to check for the effect of process variation on the frequency deviation. A design for on-chip testability of CMOS ADC by linear ramp histogram technique using synchronous counter as register in code detection unit (CDU) is also presented. A brief overview of the histogram technique, the formulae used to calculate the ADC parameters, the design implemented in 0.5µm n-well CMOS process, the results and effectiveness of the design are described. Registers in this design are replaced by 6T-SRAM cells and a hardware optimized on-chip testability of CMOS ADC by linear ramp histogram technique using 6T-SRAM as register in CDU is presented. The on-chip linear ramp histogram technique can be seamlessly combined with ΔIDDQ technique for improved testability, increased fault coverage and reliable operation

    Novel techniques for the design and practical realization of switched-capacitor circuits in deep-submicron CMOS technologies

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    Dissertação apresentada para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaSwitches presenting high linearity are more and more required in switched-capacitor circuits,namely in 12 to 16 bits resolution analog-to-digital converters. The CMOS technology evolves continuously towards lower supply voltages and, simultaneously, new design techniques are necessary to fulfill the realization of switches exhibiting a high dynamic range and a distortion compatible with referred resolutions. Moreover, with the continuously downing of the sizes, the physic constraints of the technology must be considered to avoid the excessive stress of the devices when relatively high voltages are applied to the gates. New switch-linearization techniques, with high reliability, must be necessarily developed and demonstrated in CMOS integrated circuits. Also, the research of new structures of circuits with switched-capacitor is permanent. Simplified and efficient structures are mandatory, adequate to the new demands emerging from the proliferation of portable equipments, necessarily with low energy consumption while assuring high performance and multiple functions. The work reported in this Thesis comprises these two areas. The behavior of the switches under these new constraints is analyzed, being a new and original solution proposed, in order to maintain the performance. Also, proposals for the application of simpler clock and control schemes are presented, and for the use of open-loop structures and amplifiers with localfeedback. The results, obtained in laboratory or by simulation, assess the feasibility of the presented proposals

    Continuous-time cascaded ΣΔ modulators for VDSL: A comparative study

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    This paper describes new cascaded continuous-time ΣΔ modulators intended to cope with very high-rate digital subscriber line specifications, i.e 12-bit resolution within a 20-MHz signal bandwidth. These modulators have been synthesized using a new methodology that is based on the direct synthesis of the whole cascaded architecture in the continuous-time domain instead of using a discrete-to-continuous time transformation as has been done in previous approaches. This method allows to place the zeroes/poles of the loop-filter transfer function in an optimal way and to reduce the number of analog components, namely, transconductors and/or amplifiers, resistors, capacitors and digital-to-analog converters. This leads to more efficient topologies in terms of circuitry complexity, power consumption and robustness with respect to circuit non-idealities. A comparison study of the synthesized architectures is done considering their sensitivity to most critical circuit error mechanisms. Time-domain behavioral simulations are shown to validate the presented approach.Ministerio de Educación y Ciencia TEC2004-01752/MI

    Design of low-voltage power efficient frequency dividers in folded MOS current mode logic

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    In this paper we propose a methodology to design high-speed, power-efficient static frequency dividers based on the low-voltage Folded MOS Current Mode Logic (FMCML) approach. A modeling strategy to analyze the dependence of propagation delay and power consumption on the bias currents of the divide-by-2 (DIV2) cell is introduced. We demonstrate that the behavior of the FMCML DIV2 cell is different both from the one of the conventional MCML DFF (D-type Flip-Flop) and from FMCML DFF without a level shifter. Then an analytical strategy to optimize the divider in different design scenarios: maximum speed, minimum power-delay product (PDP) or minimum energy-delay product (EDP) is presented. The possibility to scale the bias currents through the divider stages without affecting the speed performance is also investigated. The proposed analytical approach allows to gain a deep insight into the circuit behavior and to comprehensively optimize the different design tradeoffs. The derived models and design guidelines are validated against transistor level simulations referring to a commercial 28nm FDSOI CMOS process. Different divide-by-8 circuits following different optimization strategies have been designed in the same 28nm CMOS technology showing the effectiveness of the proposed methodology

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    High-Bandwidth Voltage-Controlled Oscillator based architectures for Analog-to-Digital Conversion

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    The purpose of this thesis is the proposal and implementation of data conversion open-loop architectures based on voltage-controlled oscillators (VCOs) built with ring oscillators (RO-based ADCs), suitable for highly digital designs, scalable to the newest complementary metal-oxide-semiconductor (CMOS) nodes. The scaling of the design technologies into the nanometer range imposes the reduction of the supply voltage towards small and power-efficient architectures, leading to lower voltage overhead of the transistors. Additionally, phenomena like a lower intrinsic gain, inherent noise, and parasitic effects (mismatch between devices and PVT variations) make the design of classic structures for ADCs more challenging. In recent years, time-encoded A/D conversion has gained relevant popularity due to the possibility of being implemented with mostly digital structures. Within this trend, VCOs designed with ring oscillator based topologies have emerged as promising candidates for the conception of new digitization techniques. RO-based data converters show excellent scalability and sensitivity, apart from some other desirable properties, such as inherent quantization noise shaping and implicit anti-aliasing filtering. However, their nonlinearity and the limited time delay achievable in a simple NOT gate drastically limits the resolution of the converter, especially if we focus on wide-band A/D conversion. This thesis proposes new ways to alleviate these issues. Firstly, circuit-based techniques to compensate for the nonlinearity of the ring oscillator are proposed and compared to equivalent state-of-the-art solutions. The proposals are designed and simulated in a 65-nm CMOS node for open-loop RO-based ADC architectures. One of the techniques is also validated experimentally through a prototype. Secondly, new ways to artificially increase the effective oscillation frequency are introduced and validated by simulations. Finally, new approaches to shape the quantization noise and filter the output spectrum of a RO-based ADC are proposed theoretically. In particular, a quadrature RO-based band-pass ADC and a power-efficient Nyquist A/D converter are proposed and validated by simulations. All the techniques proposed in this work are especially devoted for highbandwidth applications, such as Internet-of-Things (IoT) nodes or maximally digital radio receivers. Nevertheless, their field of application is not restricted to them, and could be extended to others like biomedical instrumentation or sensing.El propósito de esta tesis doctoral es la propuesta y la implementación de arquitecturas de conversión de datos basadas en osciladores en anillos, compatibles con diseños mayoritariamente digitales, escalables en los procesos CMOS de fabricación más modernos donde las estructuras digitales se ven favorecidas. La miniaturización de las tecnologías CMOS de diseño lleva consigo la reducción de la tensión de alimentación para el desarrollo de arquitecturas pequeñas y eficientes en potencia. Esto reduce significativamente la disponibilidad de tensión para saturar transistores, lo que añadido a una ganancia cada vez menor de los mismos, ruido y efectos parásitos como el “mismatch” y las variaciones de proceso, tensión y temperatura han llevado a que sea cada vez más complejo el diseño de estructuras analógicas eficientes. Durante los últimos años la conversión A/D basada en codificación temporal ha ganado gran popularidad dado que permite la implementación de estructuras mayoritariamente digitales. Como parte de esta evolución, los osciladores controlados por tensión diseñados con topologías de oscilador en anillo han surgido como un candidato prometedor para la concepción de nuevas técnicas de digitalización. Los convertidores de datos basados en osciladores en anillo son extremadamente sensibles (variación de frecuencia con respecto a la señal de entrada) así como escalables, además de otras propiedades muy atractivas, como el conformado espectral de ruido de cuantificación y el filtrado “anti-aliasing”. Sin embargo, su respuesta no lineal y el limitado tiempo de retraso alcanzable por una compuerta NOT restringen la resolución del conversor, especialmente para conversión A/D en aplicaciones de elevado ancho de banda. Esta tesis doctoral propone nuevas técnicas para aliviar este tipo de problemas. En primer lugar, se proponen técnicas basadas en circuito para compensar el efecto de la no linealidad en los osciladores en anillo, y se comparan con soluciones equivalentes ya publicadas. Las propuestas se diseñan y simulan en tecnología CMOS de 65 nm para arquitecturas en lazo abierto. Una de estas técnicas presentadas es también validada experimentalmente a través de un prototipo. En segundo lugar, se introducen y validan por simulación varias formas de incrementar artificialmente la frecuencia de oscilación efectiva. Para finalizar, se proponen teóricamente dos enfoques para configurar nuevas formas de conformación del ruido de cuantificación y filtrado del espectro de salida de los datos digitales. En particular, son propuestos y validados por simulación un ADC pasobanda en cuadratura de fase y un ADC de Nyquist de gran eficiencia en potencia. Todas las técnicas propuestas en este trabajo están destinadas especialmente para aplicaciones de alto ancho de banda, tales como módulos para el Internet de las cosas o receptores de radiofrecuencia mayoritariamente digitales. A pesar de ello, son extrapolables también a otros campos como el de la instrumentación biomédica o el de la medición de señales mediante sensores.Programa de Doctorado en Ingeniería Eléctrica, Electrónica y Automática por la Universidad Carlos III de MadridPresidente: Juan Pablo Alegre Pérez.- Secretario: Celia López Ongil.- Vocal: Fernando Cardes Garcí
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