Configurable 3D-integrated focal-plane sensor-processor array architecture

A mixed-signal Cellular Visual Microprocessor architecture with digital processors is described. An ASIC implementation is also demonstrated. The architecture is composed of a regular sensor readout circuit array, prepared for 3D face-to-face type integration, and one or several cascaded array of mainly identical (SIMD) processing elements. The individual array elements derived from the same general HDL description and could be of different in size, aspect ratio, and computing resources

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Design and application of reconfigurable circuits and systems

Open Acces

A Fast Digital Integrator for magnetic measurements

In this work, the Fast Digital Integrator (FDI), conceived for characterizing dynamic features of superconducting magnets and measuring fast transients of magnetic fields at the European Organization for Nuclear Research (CERN) and other high-energy physics research centres, is presented. FDI development was carried out inside a framework of cooperation between the group of Magnet Tests and Measurements of CERN and the Department of Engineering of the University of Sannio. Drawbacks related to measurement time decrease of main high-performance analog-to-digital architectures, such as Sigma-Delta and integrators, are overcome by founding the design on (i) a new generation of successive-approximation converters, for high resolution (18-bit) at high rate (500 kS/s), (ii) a digital signal processor, for on-line down-sampling by integrating the input signal, (iii) a custom time base, based on a Universal Time Counter, for reducing time-domain uncertainty, and (iv) a PXI board, for high bus transfer rate, as well as noise and heat immunity. A metrological analysis, aimed at verifying the effect of main uncertainty sources, systematic errors, and design parameters on the instrument performance is presented. In particular, results of an analytical study, a preliminary numerical analysis, and a comprehensive multi-factor analysis carried out to confirm the instrument design, are reported. Then, the selection of physical components and the FDI implementation on a PXI board according to the above described conceptual architecture are highlighted. The on-line integration algorithm, developed on the DSP in order to achieve a real-time Nyquist bandwidth of 125 kHz on the flux, is described. C++ classes for remote control of FDI, developed as a part of a new software framework, the Flexible Framework for Magnetic Measurements, conceived for managing a wide spectrum of magnetic measurements techniques, are described. Experimental results of metrological and throughput characterization of FDI are reported. In particular, in metrological characterization, FDI working as a digitizer and as an integrator, was assessed by means of static, dynamic, and time base tests. Typical values of static integral nonlinearity of ±7 ppm, ±3 ppm of 24-h stability, and 108 dB of signal-to-noise-anddistortion ratio at 10 Hz on Nyquist bandwidth of 125 kHz, were surveyed during the integrator working. The actual throughput rate was measured by a specific procedure of PXI bus analysis, by highlighting typical values of 1 MB/s. Finally, the experimental campaign, carried out at CERN facilities of superconducting magnet testing for on-field qualification of FDI, is illustrated. In particular, the FDI was included in a measurement station using also the new generation of fast transducers. The performance of such a station was compared with the one of the previous standard station used in series tests for qualifying LHC magnets. All the results highlight the FDI full capability of acting as the new de-facto standard for high-performance magnetic measurements at CERN and in other high-energy physics research centres

Advanced sensors technology survey

This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

Energy autonomous systems : future trends in devices, technology, and systems

The rapid evolution of electronic devices since the beginning of the nanoelectronics era has brought about exceptional computational power in an ever shrinking system footprint. This has enabled among others the wealth of nomadic battery powered wireless systems (smart phones, mp3 players, GPS, …) that society currently enjoys. Emerging integration technologies enabling even smaller volumes and the associated increased functional density may bring about a new revolution in systems targeting wearable healthcare, wellness, lifestyle and industrial monitoring applications

CMOS Data Converters for Closed-Loop mmWave Transmitters

With the increased amount of data consumed in mobile communication systems, new solutions for the infrastructure are needed. Massive multiple input multiple output (MIMO) is seen as a key enabler for providing this increased capacity. With the use of a large number of transmitters, the cost of each transmitter must be low. Closed-loop transmitters, featuring high-speed data converters is a promising option for achieving this reduced unit cost.In this thesis, both digital-to-analog (D/A) and analog-to-digital (A/D) converters suitable for wideband operation in millimeter wave (mmWave) massive MIMO transmitters are demonstrated. A 2 76 bit radio frequency digital-to-analog converter (RF-DAC)-based in-phase quadrature (IQ) modulator is demonstrated as a compact building block, that to a large extent realizes the transmit path in a closed-loop mmWave transmitter. The evaluation of an successive-approximation register (SAR) analog-to-digital converter (ADC) is also presented in this thesis. Methods for connecting simulated and measured performance has been studied in order to achieve a better understanding about the alternating comparator topology.These contributions show great potential for enabling closed-loop mmWave transmitters for massive MIMO transmitter realizations