A Survey Addressing on High Performance On-Chip VLSI Interconnect

With the rapid increase in transmission speeds of communication systems, the demand for very high-speed lowpower VLSI circuits is on the rise. Although the performance of CMOS technologies improves notably with scaling, conventional CMOS circuits cannot simultaneously satisfy the speed and power requirements of these applications. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, power and delay optimization and also comparative analysis of various techniques for high speed design have been discussed

High-performance long NoC link using delay-insensitive current-mode signaling

High-performance long-range NoC link enables efficient implementation of network-on-chip topologies which inherently require high-performance long-distance point-to-point communication such as torus and fat-tree structures. In addition, the performance of other topologies, such as mesh, can be improved by using high-performance link between few selected remote nodes.We presented novel implementation of high-performance long-range NoC link based onmultilevel current-mode signaling and delayinsensitive two-phase 1-of-4 encoding. Current-mode signaling reduces the communication latency of long wires significantlycompared to voltage-mode signaling, making it possible to achieve high throughput without pipelining and/or using repeaters. The performance of the proposed multilevel current-mode interconnect is analyzed and compared with two reference voltage mode interconnects. These two reference interconnects are designed using two-phase 1-of-4 encoded voltage-mode signaling, one with pipeline stages and the other using optimal repeater insertion. The proposed multilevel current-mode interconnect achieves higher throughput and lower latency than the two reference interconnects. Its throughput at 8mm wire length is 1.222GWord/swhich is 1.58 and 1.89 times higher than the pipelined and optimal repeater insertion interconnects, respectively. Furthermore, its power consumption is less than the optimal repeater insertion voltage-mode interconnect, at 10mm wire length its power consumption is 0.75mW while the reference repeater insertion interconnect is 1.066 mW. The effect of crosstalk is analyzed using four-bit parallel data transfer with the best-case and worst-case switching patterns and a transmission line model which has both capacitive coupling and inductive coupling.</p

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Towards Energy-Efficient and Reliable Computing: From Highly-Scaled CMOS Devices to Resistive Memories

The continuous increase in transistor density based on Moore\u27s Law has led us to highly scaled Complementary Metal-Oxide Semiconductor (CMOS) technologies. These transistor-based process technologies offer improved density as well as a reduction in nominal supply voltage. An analysis regarding different aspects of 45nm and 15nm technologies, such as power consumption and cell area to compare these two technologies is proposed on an IEEE 754 Single Precision Floating-Point Unit implementation. Based on the results, using the 15nm technology offers 4-times less energy and 3-fold smaller footprint. New challenges also arise, such as relative proportion of leakage power in standby mode that can be addressed by post-CMOS technologies. Spin-Transfer Torque Random Access Memory (STT-MRAM) has been explored as a post-CMOS technology for embedded and data storage applications seeking non-volatility, near-zero standby energy, and high density. Towards attaining these objectives for practical implementations, various techniques to mitigate the specific reliability challenges associated with STT-MRAM elements are surveyed, classified, and assessed herein. Cost and suitability metrics assessed include the area of nanomagmetic and CMOS components per bit, access time and complexity, Sense Margin (SM), and energy or power consumption costs versus resiliency benefits. In an attempt to further improve the Process Variation (PV) immunity of the Sense Amplifiers (SAs), a new SA has been introduced called Adaptive Sense Amplifier (ASA). ASA can benefit from low Bit Error Rate (BER) and low Energy Delay Product (EDP) by combining the properties of two of the commonly used SAs, Pre-Charge Sense Amplifier (PCSA) and Separated Pre-Charge Sense Amplifier (SPCSA). ASA can operate in either PCSA or SPCSA mode based on the requirements of the circuit such as energy efficiency or reliability. Then, ASA is utilized to propose a novel approach to actually leverage the PV in Non-Volatile Memory (NVM) arrays using Self-Organized Sub-bank (SOS) design. SOS engages the preferred SA alternative based on the intrinsic as-built behavior of the resistive sensing timing margin to reduce the latency and power consumption while maintaining acceptable access time

Electrokinetic Transport, Trapping, and Sensing in Integrated Micro- and Nanofluidic Devices

Thesis (Ph.D.) - Indiana University, Chemistry, 2009Microfluidics is rapidly becoming a mature field, and improved fabrication methods now routinely produce sub-micrometer features. As device dimensions shrink, physical phenomena that are negligible at larger length scales become more important, and by integrating nanofluidic elements with microchannels, new analytical techniques can be developed based on the unique behavior of matter at the nanoscale. This work addresses the fabrication, operation, and application of in-plane nanochannels and out-of-plane nanopores in lab-on-a-chip devices. In planar nanofluidic devices, we demonstrate a method to produce micro- and nanoscale features simultaneously with a single UV exposure step and evaluate flow control and sample dispensing with nanofluidic cross structures. Modification of the pinched injection method makes it applicable to variable-volume, attoliter-scale injections, including the smallest volume electrokinetically-controlled injections to date. As an alternative approach, track-etch nanopore membranes are explored as out-of-plane nanofluidic components. The random distribution of pores in these membranes is overcome by lithographic and microchannel-based methods to isolate and address specific pores. Microfluidic isolation improves mass transport to the pore(s), provides easy coupling of electrical potentials, and facilitates additional sample processing steps up- and downstream. These integrated microchannel-nanopore devices are used for diffusion-based dispensing, electrokinetic trapping, and resistive pulse sensing. In a high pore density device, diffusion-based dispensing establishes a stable chemical gradient for bacterial chemotaxis assays. For lower pore density devices, the nanopores are the most resistive components in the fluidic circuit, and application of an electric potential produces localized regions of high electric field strength and field gradient. These high field regions are applied to electrokinetic trapping of particles and cells in multiple-pore devices and to single particle detection by resistive pulse sensing in devices with a single isolated pore. To better understand factors influencing ion current in single nanoscale conduits, we systematically examine ion current rectification as a function of pore diameter, ionic strength, and pH to improve understanding of ion current through nanopores and to characterize preferred operating parameters for sensing applications. These results are applied to detection of virus capsids, and future work is proposed to investigate capsid assembly

Optically-Connected Memory: Architectures and Experimental Characterizations

Growing demands on future data centers and high-performance computing systems are driving the development of processor-memory interconnects with greater performance and flexibility than can be provided by existing electronic interconnects. A redesign of the systems' memory devices and architectures will be essential to enabling high-bandwidth, low-latency, resilient, energy-efficient memory systems that can meet the challenges of exascale systems and beyond. By leveraging an optics-based approach, this thesis presents the design and implementation of an optically-connected memory system that exploits both the bandwidth density and distance-independent energy dissipation of photonic transceivers, in combination with the flexibility and scalability offered by optical networks. By replacing the electronic memory bus with an optical interconnection network, novel memory architectures can be created that are otherwise infeasible. With remote optically-connected memory nodes accessible to processors as if they are local, programming models can be designed to utilize and efficiently share greater amounts of data. Processors that would otherwise be idle, being starved for data while waiting for scarce memory resources, can instead operate at high utilizations, leading to drastic improvements in the overall system performance. This work presents a prototype optically-connected memory module and a custom processor-based optical-network-aware memory controller that communicate transparently and all-optically across an optical interconnection network. The memory modules and controller are optimized to facilitate memory accesses across the optical network using a packet-switched, circuit-switched, or hybrid packet-and-circuit-switched approach. The novel memory controller is experimentally demonstrated to be compatible with existing processor-memory access protocols, with the memory controller acting as the optics-computing interface to render the optical network transparent. Additionally, the flexibility of the optical network enables additional performance benefits including increased memory bandwidth through optical multicasting. This optically-connected architecture can further enable more resilient memory system realizations by expanding on current error dectection and correction memory protocols. The integration of optics with memory technology constitutes a critical step for both optics and computing. The scalability challenges facing main memory systems today, especially concerning bandwidth and power consumption, complement well with the strengths of optical communications-based systems. Additionally, ongoing efforts focused on developing low-cost optical components and subsystems that are suitable for computing environments may benefit from the high-volume memory market. This work therefore takes the first step in merging the areas of optics and memory, developing the necessary architectures and protocols to interface the two technologies, and demonstrating potential benefits while identifying areas for future work. Future computing systems will undoubtedly benefit from this work through the deployment of high-performance, flexible, energy-efficient optically-connected memory architectures