385 research outputs found
Network-on-Chip
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems
PhoNoCMap: An application mapping tool for photonic networks-on-chip
While providing a promising solution for high-performance on-chip communication, photonic networks-on-chip suffer from insertion loss and crosstalk noise, which may severely constrain their scalability. In this paper, we introduce a methodology and a related tool, PhoNoCMap, for the design space exploration of optical NoCs mapping solutions, which automatically assigns application tasks to the nodes of a generic photonic NoC architecture such that the worst-case either insertion loss or crosstalk noise are minimized. The experimental results show significant benefits in terms of insertion loss and crosstalk noise, allowing improved network scalability
Reliability-aware and energy-efficient system level design for networks-on-chip
2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work
DOTA: A Dynamically-Operated Photonic Tensor Core for Energy-Efficient Transformer Accelerator
The wide adoption and significant computing resource consumption of
attention-based Transformers, e.g., Vision Transformer and large language
models, have driven the demands for efficient hardware accelerators. While
electronic accelerators have been commonly used, there is a growing interest in
exploring photonics as an alternative technology due to its high energy
efficiency and ultra-fast processing speed. Optical neural networks (ONNs) have
demonstrated promising results for convolutional neural network (CNN) workloads
that only require weight-static linear operations. However, they fail to
efficiently support Transformer architectures with attention operations due to
the lack of ability to process dynamic full-range tensor multiplication. In
this work, we propose a customized high-performance and energy-efficient
photonic Transformer accelerator, DOTA. To overcome the fundamental limitation
of existing ONNs, we introduce a novel photonic tensor core, consisting of a
crossbar array of interference-based optical vector dot-product engines, that
supports highly-parallel, dynamic, and full-range matrix-matrix multiplication.
Our comprehensive evaluation demonstrates that DOTA achieves a >4x energy and a
>10x latency reduction compared to prior photonic accelerators, and delivers
over 20x energy reduction and 2 to 3 orders of magnitude lower latency compared
to the electronic Transformer accelerator. Our work highlights the immense
potential of photonic computing for efficient hardware accelerators,
particularly for advanced machine learning workloads.Comment: The short version is accepted by Next-Gen AI System Workshop at MLSys
202
Heterogeneous Photonic Network-on-Chip with Dynamic Bandwidth Allocation
Advancements in the field of chip fabrication has facilitated in integrating more number of transistors in a given area which has lead to an era of multi-core processors. Future multi-core chips or chip multiprocessors (CMPs) will have hundreds of heterogeneous components including processing engines, custom logic, GPU units, programmable fabrics and distributed memory. Such multi-core chips are expected to run varied multiple parallel workloads simultaneously. Hence, different communicating cores will require different bandwidths leading to the necessity of a heterogeneous Network-on-Chip (NoC) architecture. Simply over-provisioning for performance will invariably result in loss of power efficiency. On the other hand, recent research has shown that photonic interconnects are capable of achieving high-bandwidth and energy-efficient on-chip data transfer. In this paper we propose a dynamic heterogeneous photonic NoC (d-HetPNOC) architecture with dynamic bandwidth allocation to achieve better performance and energy-efficiency compared to a homogeneous photonic NoC architecture with the same aggregate data bandwidth
Investigating thermal dependence on monolithically-integrated photonic interconnects
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2013.Cataloged from PDF version of thesis.Includes bibliographical references (p. 59-61).Monolithically-integrated optical link is a disruptive technology which has the promising potential to remove memory bandwidth bottleneck in the deep multicore regime. Although with the advantages of high bandwidth-density and energy-efficiency, it comes with design challenges from device, architecture and system perspectives. High thermal sensitivity of the essential optical ring resonator imposes constraints on the applicability of optical links in the electro-optical systems. To investigate the thermal dynamics as well as to develop advanced ring thermal-tuning mechanisms, real-time thermal monitoring at design stage is required. In this work we propose a thermal simulation platform which integrates system modeling aspects including the high-level architectural performance model, the physical device evaluation model, and the thermal analysis model. By introducing the compact thermal model with linear transient thermal analysis solver, system thermal dynamics can be monitored at high efficiency. We demonstrate the temperature profile of a multi-core microprocessor system running real workloads. The evaluation results show the system thermal dependence on the manufacturing process, circuit thermal crosstalk and integrated ring heater efficiency.by Yu-Hsin Chen.S.M
SCONNA: A Stochastic Computing Based Optical Accelerator for Ultra-Fast, Energy-Efficient Inference of Integer-Quantized CNNs
The acceleration of a CNN inference task uses convolution operations that are
typically transformed into vector-dot-product (VDP) operations. Several
photonic microring resonators (MRRs) based hardware architectures have been
proposed to accelerate integer-quantized CNNs with remarkably higher throughput
and energy efficiency compared to their electronic counterparts. However, the
existing photonic MRR-based analog accelerators exhibit a very strong trade-off
between the achievable input/weight precision and VDP operation size, which
severely restricts their achievable VDP operation size for the quantized
input/weight precision of 4 bits and higher. The restricted VDP operation size
ultimately suppresses computing throughput to severely diminish the achievable
performance benefits. To address this shortcoming, we for the first time
present a merger of stochastic computing and MRR-based CNN accelerators. To
leverage the innate precision flexibility of stochastic computing, we invent an
MRR-based optical stochastic multiplier (OSM). We employ multiple OSMs in a
cascaded manner using dense wavelength division multiplexing, to forge a novel
Stochastic Computing based Optical Neural Network Accelerator (SCONNA). SCONNA
achieves significantly high throughput and energy efficiency for accelerating
inferences of high-precision quantized CNNs. Our evaluation for the inference
of four modern CNNs at 8-bit input/weight precision indicates that SCONNA
provides improvements of up to 66.5x, 90x, and 91x in frames-per-second (FPS),
FPS/W and FPS/W/mm2, respectively, on average over two photonic MRR-based
analog CNN accelerators from prior work, with Top-1 accuracy drop of only up to
0.4% for large CNNs and up to 1.5% for small CNNs. We developed a
transaction-level, event-driven python-based simulator for the evaluation of
SCONNA and other accelerators (https://github.com/uky-UCAT/SC_ONN_SIM.git).Comment: To Appear at IPDPS 202
Evolution of Publications, Subjects, and Co-authorships in Network-On-Chip Research From a Complex Network Perspective
The academia and industry have been pursuing network-on-chip (NoC) related research since two decades ago when there was an urgency to respond to the scaling and technological challenges imposed on intra-chip communication in SoC designs. Like any other research topic, NoC inevitably goes through its life cycle: A. it started up (2000-2007) and quickly gained traction in its own right; B. it then entered the phase of growth and shakeout (2008-2013) with the research outcomes peaked in 2010 and remained high for another four/five years; C. NoC research was considered mature and stable (2014-2020), with signs showing a steady slowdown. Although from time to time, excellent survey articles on different subjects/aspects of NoC appeared in the open literature, yet there is no general consensus on where we are in this NoC roadmap and where we are heading, largely due to lack of an overarching methodology and tool to assess and quantify the research outcomes and evolution. In this paper, we address this issue from the perspective of three specific complex networks, namely the citation network, the subject citation network, and the co-authorship network. The network structure parameters (e.g., modularity, diameter, etc.) and graph dynamics of the three networks are extracted and analyzed, which helps reveal and explain the reasons and the driving forces behind all the changes observed in NoC research over 20 years. Additional analyses are performed in this study to link interesting phenomena surrounding the NoC area. They include: (1) relationships between communities in citation networks and NoC subjects, (2) measure and visualization of a subject\u27s influence score and its evolution, (3) knowledge flow among the six most popular NoC subjects and their relationships, (4) evolution of various subjects in terms of number of publications, (5) collaboration patterns and cross-community collaboration among the authors in NoC research, (6) interesting observation of career lifetime and productivity among NoC researchers, and finally (7) investigation of whether or not new authors are chasing hot subjects in NoC. All these analyses have led to a prediction of publications, subjects, and co-authorship in NoC research in the near future, which is also presented in the paper
Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems
With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance.
Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems.
Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks
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Cross-Layer Pathfinding for Off-Chip Interconnects
Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects
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