An analytical performance model for the Spidergon NoC

Networks on chip (NoC) emerged as a promising alternative to bus-based interconnect networks to handle the increasing communication requirements of the large systems on chip. Employing an appropriate topology for a NoC is of high importance mainly because it typically trade-offs between cross-cutting concerns such as performance and cost. The spidergon topology is a novel architecture which is proposed recently for NoC domain. The objective of the spidergon NoC has been addressing the need for a fixed and optimized topology to realize cost effective multi-processor SoC (MPSoC) development [7]. In this paper we analyze the traffic behavior in the spidergon scheme and present an analytical evaluation of the average message latency in the architecture. We prove the validity of the analysis by comparing the model against the results produced by a discreteevent simulator

Design, processing and testing of LSI arrays hybrid microelectronics task

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed

QCDOC: A 10-teraflops scale computer for lattice QCD

The architecture of a new class of computers, optimized for lattice QCD calculations, is described. An individual node is based on a single integrated circuit containing a PowerPC 32-bit integer processor with a 1 Gflops 64-bit IEEE floating point unit, 4 Mbyte of memory, 8 Gbit/sec nearest-neighbor communications and additional control and diagnostic circuitry. The machine's name, QCDOC, derives from ``QCD On a Chip''.Comment: Lattice 2000 (machines) 8 pages, 4 figure

Design of TSV-sharing topologies for cost-effective 3D networks-on-chip

The Through-Silicon Via (TSV) technology has led to major breakthroughs in 3D stacking by providing higher speed and bandwidth, as well as lower power dissipation for the inter-layer communication. However, the current TSV fabrication suffers from a considerable area footprint and yield loss. Thus, it is necessary to restrict the number of TSVs in order to design cost-effective 3D on-chip networks. This critical issue can be addressed by clustering the network such that all of the routers within each cluster share a single TSV pillar for the vertical packet transmission. In some of the existing topologies, additional cluster routers are augmented into the mesh structure to handle the shared TSVs. However, they impose either performance degradation or power/area overhead to the system. Furthermore, the resulting architecture is no longer a mesh. In this paper, we redefine the clusters by replacing some routers in the mesh with the cluster routers, such that the mesh structure is preserved. The simulation results demonstrate a better equilibrium between performance and cost, using the proposed models