Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu-TiO2/ZnO (0.25wt%) composite solder alloys in a corrosive environment via scanning electron microscopy and focused ion beam techniques. The corrosive environment test showed that the application of TiO2 and ZnO nano-particles almost totally suppressed the Sn whisker growth and improved the corrosion resistance of the composite solder alloys compared to the reference 99Sn0.3Ag0.7Cu alloy. The microstructural analysis of the reference 99Sn0.3Ag0.7Cu solder alloy showed that the volumetric increase of the corroded β-Sn grains resulted in local mechanical stress in the solder joints, which was released by Sn whisker development. However, in the composite solder joints, the increased grain boundary fraction and segregation of the TiO2 and ZnO nano-particles to the grain boundaries resulted in a relatively uniform and compact protective oxide layer at the β-Sn grain boundaries. This suppressed the formation of SnOx, and via this, the corrosion-induced whisker growth

Electrochemical migration of Sn and Sn solder alloys: a review

Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed

Reliability Tests on SAC-xMn Solder Alloys

Different Sn based micro-alloyed solder alloys with manganese content were developed for the electronic industry as a possible cost-effective candidates. The commonly used SnAg3Cu0.5 (SAC305) lead-free solder alloy applied as a reference. As a first step, various technological parameters tested from the solder alloy-manufacturing point of view. During the reliability investigations of the solder alloys, Vickers hardness, tensile strength and shear force tests were carried out. The results show that Mn content SAC alloys are useful in the electronics technology especially in those fields, where the high reliability is not required

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0 and 1.5A and they were aged in corrosive environment (85 °C/85RH%) for 3000 h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well

Technology of Welding and Joining

In this book, you will find information on new materials and new welding technologies. Problems related to the welding of difficult-to-weld materials are considered and solved. The latest welding technologies and processes are presented. This book provides an opportunity to learn about the latest trends and developments in the welding industry. Enjoy reading

Corrosion and Degradation of Materials

Studies on the corrosion and degradation of materials play a decisive role in the novel design and development of corrosion-resistant materials, the selection of materials used in harsh environments in designed lifespans, the invention of corrosion control methods and procedures (e.g., coatings, inhibitors), and the safety assessment and prediction of materials (i.e., modelling). These studies cover a wide range of research fields, including the calculation of thermodynamics, the characterization of microstructures, the investigation of mechanical and corrosion properties, the creation of corrosion coatings or inhibitors, and the establishment of corrosion modelling. This Special Issue is devoted to these types of studies, which facilitate the understanding of the corrosion fundamentals of materials in service, the development of corrosion coatings or methods, improving their durability, and eventually decreasing corrosion loss