Materials for high-density electronic packaging and interconnection

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturized Space Systems

The results of a study carried out in order to manufacture and verify the quality of chip-on-board (COB) packaging technology are presented. The COB, designed for space applications, was tested under environmental stresses, temperature cycling, and temperature-humidity-bias. Both robustness in space applications and in environmental protection on the ground-complete reliability without hermeticity were searched for. The epoxy-parylene combinations proved to be superior to other materials tested

NASA SBIR abstracts of 1991 phase 1 projects

The objectives of 301 projects placed under contract by the Small Business Innovation Research (SBIR) program of the National Aeronautics and Space Administration (NASA) are described. These projects were selected competitively from among proposals submitted to NASA in response to the 1991 SBIR Program Solicitation. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 301, in order of its appearance in the body of the report. Appendixes to provide additional information about the SBIR program and permit cross-reference of the 1991 Phase 1 projects by company name, location by state, principal investigator, NASA Field Center responsible for management of each project, and NASA contract number are included

Index to 1985 NASA Tech Briefs, volume 10, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1985 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Publications of the Jet Propulsion Laboratory 1983

The Jet propulsion Laboratory (JPL) bibliography describes and indexes by primary author the externally distributed technical reporting, released during calendar year 1983, that resulted from scientific and engineering work performed, or managed, by the Jet Propulsion Laboratory. Three classes of publications are included. JPL Publication (81-,82-,83-series, etc.), in which the information is complete for a specific accomplishment, articles published in the open literature, and articles from the quarterly telecommunications and Data Acquisition (TDA) Progress Report (42-series) are included. Each collection of articles in this class of publication presents a periodic survey of current accomplishments by the Deep Space Network as well as other developments in Earth-based radio technology

Coatings for ALD Reactors to Prevent Metal Contamination on Semiconductor Products

Atomic layer deposition (ALD) is a promising processing method for the next generation semiconductor devices. Major advantages of ALD include conformality, uniformity over large areas, precise thickness control, repeatability and high quality of films produced. ALD thin film deposition is done inside an ALD reactor. Typical construction materials of ALD reactors include metal alloys such as stainless steel, aluminum and titanium. These materials contain multiple metallic elements that can be detrimental to the performance, reliability and yield of semiconductor devices. In order to process semiconductor devices with ALD, metal impurity levels originating from the ALD reactor must be controlled. Allowed levels of metal impurities in semiconductor processing are stringent and showing a tightening trend. This has led into the development of new methods for contamination control together with the adoption of more sensitive and robust detection methods for metallic impurities, such as inductively coupled plasma mass spectrometry (ICP-MS). This master thesis focuses on the metallic impurities originating from an ALD reactor and their prevention with ALD coatings. Three typical construction materials, aluminum, titanium and stainless steel were examined. The studied coatings were ALD deposited aluminum oxide (Al2O3), hafnium oxide (HfO2) and their nanolaminate (Al2O3/HfO2). The ability of the coatings to prevent metal impurity transfer from the metals to silicon substrates through the gas phase was studied by exposing the coated metals to two ALD precursors, trimethyl aluminum (TMA) and tris(dimethylamino) cyclopentadienyl hafnium (CpHf(NMe2)3). Metal impurity concentrations on silicon were measured with ICP-MS. Since academic literature concerning control of metal contamination from ALD reactors does not directly exist, the literature part of this thesis was based on relevant related topics. The selected topics included the development of semiconductor industry, role of ALD in this development and new ALD materials and chemistries required. Additionally, protective ALD films and the effects of metal impurities in semiconductor products were reviewed. The overall conclusion of this study was that the ALD coatings provide a worthy solution for metal contamination control. Some differences between the passivation efficiencies of different metal – coating systems were found

Index to 1984 NASA Tech Briefs, volume 9, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1984 Tech B Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences