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On thermal sensor calibration and software techniques for many-core thermal management
The high power density of a many-core processor results in increased temperature which negatively impacts system reliability and performance. Dynamic thermal management applies thermal-aware techniques at run time to avoid overheating using temperature information collected from on-chip thermal sensors. Temperature sensing and thermal control schemes are two critical technologies for successfully maintaining thermal safety. In this dissertation, on-line thermal sensor calibration schemes are developed to provide accurate temperature information.
Software-based dynamic thermal management techniques are proposed using calibrated thermal sensors. Due to process variation and silicon aging, on-chip thermal sensors require periodic calibration before use in DTM. However, the calibration cost for thermal sensors can be prohibitively high as the number of on-chip sensors increases. Linear models which are suitable for on-line calculation are employed to estimate temperatures at multiple sensor locations using performance counters. The estimated temperature and the actual sensor thermal profile show a very high similarity with correlation coefficient ~0.9 for SPLASH2 and SPEC2000 benchmarks.
A calibration approach is proposed to combine potentially inaccurate temperature values obtained from two sources: thermal sensor readings and temperature estimations. A data fusion strategy based on Bayesian inference, which combines information from these two sources, is demonstrated. The result shows the strategy can effectively recalibrate sensor readings in response to inaccuracies caused by process variation and environmental noise. The average absolute error of the corrected sensor temperature readings is
A dynamic task allocation strategy is proposed to address localized overheating in many-core systems. Our approach employs reinforcement learning, a dynamic machine learning algorithm that performs task allocation based on current temperatures and a prediction regarding which assignment will minimize the peak temperature. Our results show that the proposed technique is fast (scheduling performed in \u3c1 \u3ems) and can efficiently reduce peak temperature by up to 8 degree C in a 49-core processor (6% on average) versus a leading competing task allocation approach for a series of SPLASH-2 benchmarks. Reinforcement learning has also been applied to 3D integrated circuits to allocate tasks with thermal awareness
Physical parameter-aware Networks-on-Chip design
PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable
and power-efficient communication fabric for chip multiprocessors
(CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine
both the performance and the reliability of such systems, with a
significant power demand that is expected to increase due to developments
in both technology and architecture. In terms of architecture, an
important trend in many-core systems architecture is to increase the
number of cores on a chip while reducing their individual complexity.
This trend increases communication power relative to computation
power. Moreover, technology-wise, power-hungry wires are dominating
logic as power consumers as technology scales down. For these
reasons, the design of future very large scale integration (VLSI) systems
is moving from being computation-centric to communication-centric.
On the other hand, chip’s physical parameters integrity, especially
power and thermal integrity, is crucial for reliable VLSI systems. However,
guaranteeing this integrity is becoming increasingly difficult with
the higher scale of integration due to increased power density and operating
frequencies that result in continuously increasing temperature
and voltage drops in the chip. This is a challenge that may prevent
further shrinking of devices. Thus, tackling the challenge of power
and thermal integrity of future many-core systems at only one level
of abstraction, the chip and package design for example, is no longer
sufficient to ensure the integrity of physical parameters. New designtime
and run-time strategies may need to work together at different
levels of abstraction, such as package, application, network, to provide
the required physical parameter integrity for these large systems. This
necessitates strategies that work at the level of the on-chip network
with its rising power budget.
This thesis proposes models, techniques and architectures to improve
power and thermal integrity of Network-on-Chip (NoC)-based
many-core systems. The thesis is composed of two major parts: i)
minimization and modelling of power supply variations to improve
power integrity; and ii) dynamic thermal adaptation to improve thermal
integrity. This thesis makes four major contributions. The first is
a computational model of on-chip power supply variations in NoCs.
The proposed model embeds a power delivery model, an NoC activity
simulator and a power model. The model is verified with SPICE simulation
and employed to analyse power supply variations in synthetic
and real NoC workloads. Novel observations regarding power supply
noise correlation with different traffic patterns and routing algorithms
are found. The second is a new application mapping strategy aiming
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to minimize power supply noise in NoCs. This is achieved by defining
a new metric, switching activity density, and employing a force-based
objective function that results in minimizing switching density. Significant
reductions in power supply noise (PSN) are achieved with a low
energy penalty. This reduction in PSN also results in a better link timing
accuracy. The third contribution is a new dynamic thermal-adaptive
routing strategy to effectively diffuse heat from the NoC-based threedimensional
(3D) CMPs, using a dynamic programming (DP)-based distributed
control architecture. Moreover, a new approach for efficient extension
of two-dimensional (2D) partially-adaptive routing algorithms
to 3D is presented. This approach improves three-dimensional networkon-
chip (3D NoC) routing adaptivity while ensuring deadlock-freeness.
Finally, the proposed thermal-adaptive routing is implemented in
field-programmable gate array (FPGA), and implementation challenges,
for both thermal sensing and the dynamic control architecture are addressed.
The proposed routing implementation is evaluated in terms
of both functionality and performance.
The methodologies and architectures proposed in this thesis open a
new direction for improving the power and thermal integrity of future
NoC-based 2D and 3D many-core architectures
Energy-Efficient and Reliable Computing in Dark Silicon Era
Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability
Thermal-Aware Networked Many-Core Systems
Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors.
This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast
Magneto-Inductive Powering and Uplink of In-Body Microsensors: Feasibility and High-Density Effects
This paper studies magnetic induction for wireless powering and the data
uplink of microsensors, in particular for future medical in-body applications.
We consider an external massive coil array as power source (1 W) and data sink.
For sensor devices at 12 cm distance from the array, e.g. beneath the human
skin, we compute a minimum coil size of 150 um assuming 50 nW required chip
activation power and operation at 750 MHz. A 275 um coil at the sensor allows
for 1 Mbit/s uplink rate. Moreover, we study resonant sensor nodes in dense
swarms, a key aspect of envisioned biomedical applications. In particular, we
investigate the occurring passive relaying effect and cooperative transmit
beamforming in the uplink. We show that the frequency- and location-dependent
signal fluctuations in such swarms allow for significant performance gains when
utilized with adaptive matching, spectrally-aware signaling and node
cooperation. The work is based on a general magneto-inductive MIMO system
model, which is introduced first.Comment: 6 pages, to appear at IEEE WCNC 2019. This work has been submitted to
the IEEE for possible publication. Copyright may be transferred without
notice, after which this version may no longer be accessibl
Adaptive Knobs for Resource Efficient Computing
Performance demands of emerging domains such as artificial intelligence, machine learning and vision, Internet-of-things etc., continue to grow. Meeting such requirements on modern multi/many core systems with higher power densities, fixed power and energy budgets, and thermal constraints exacerbates the run-time management challenge. This leaves an open problem on extracting the required performance within the power and energy limits, while also ensuring thermal safety. Existing architectural solutions including asymmetric and heterogeneous cores and custom acceleration improve performance-per-watt in specific design time and static scenarios. However, satisfying applications’ performance requirements under dynamic and unknown workload scenarios subject to varying system dynamics of power, temperature and energy requires intelligent run-time management.
Adaptive strategies are necessary for maximizing resource efficiency, considering i) diverse requirements and characteristics of concurrent applications, ii) dynamic workload variation, iii) core-level heterogeneity and iv) power, thermal and energy constraints. This dissertation proposes such adaptive techniques for efficient run-time resource management to maximize performance within fixed budgets under unknown and dynamic workload scenarios. Resource management strategies proposed in this dissertation comprehensively consider application and workload characteristics and variable effect of power actuation on performance for pro-active and appropriate allocation decisions. Specific contributions include i) run-time mapping approach to improve power budgets for higher throughput, ii) thermal aware performance boosting for efficient utilization of power budget and higher performance, iii) approximation as a run-time knob exploiting accuracy performance trade-offs for maximizing performance under power caps at minimal loss of accuracy and iv) co-ordinated approximation for heterogeneous systems
through joint actuation of dynamic approximation and power knobs for performance guarantees with minimal power consumption.
The approaches presented in this dissertation focus on adapting existing mapping techniques, performance boosting strategies, software and dynamic approximations to meet the performance requirements, simultaneously considering system constraints. The proposed strategies are compared against relevant state-of-the-art run-time management frameworks to qualitatively evaluate their efficacy
Enabling Technology in Optical Fiber Communications: From Device, System to Networking
This book explores the enabling technology in optical fiber communications. It focuses on the state-of-the-art advances from fundamental theories, devices, and subsystems to networking applications as well as future perspectives of optical fiber communications. The topics cover include integrated photonics, fiber optics, fiber and free-space optical communications, and optical networking
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