Dynamic Thermal Management for Microprocessors

In deep submicron era, thermal hot spots and large temperature gradients significantly impact system reliability, performance, cost and leakage power. Dynamic thermal management techniques are designed to tackle the problems and control the chip temperature as well as power consumption. They refer to those techniques which enable the chip to autonomously modify the task execution and power dissipation characteristics so that lower-cost cooling solutions could be adopted while still guaranteeing safe temperature regulation. As long as the temperature is regulated, the system reliability can be improved, leakage power can be reduced and cooling system lifetime can be extended significantly. Multimedia applications are expected to form the largest portion of workload in general purpose PC and portable devices. The ever-increasing computation intensity of multimedia applications elevates the processor temperature and consequently impairs the reliability and performance of the system. In this thesis, we propose to perform dynamic thermal management using reinforcement learning algorithm for multimedia applications. The presented learning model does not need any prior knowledge of the workload information or the system thermal and power characteristics. It learns the temperature change and workload switching patterns by observing the temperature sensor and event counters on the processor, and finds the management policy that provides good performance-thermal tradeoff during the runtime. As the system complexity increases, it is more and more difficult to perform thermal management in a centralized manner because of state explosion and the overhead of monitoring the entire chip. In this thesis, we present a framework for distributed thermal management in many-core systems where balanced thermal profile can be achieved by proactive task migration among neighboring cores. The framework has a low cost agent residing in each core that observes the local workload and temperature and communicates with its nearest neighbor for task migration and exchange. By choosing only those migration requests that will result in balanced workload without generating thermal emergency, the presented framework maintains workload balance across the system and avoids unnecessary migration. Experimental results show that, our distributed management policy achieves almost the same performance as a global management policy when the tasks are initially randomly distributed. Compared with existing proactive task migration technique, our approach generates less hotspot, less migration overhead with negligible performance overhead. Temperature affects the leakage power and cooling power. In this thesis, we address the impact of task allocation on a processor\u27s leakage power and cooling fan power. Although the leakage power is determined by the average die temperature and the fan power is determined by the peak temperature, our analysis shows that the overall power can be minimized if a task allocation with minimum peak temperature is adopted together with an intelligent fan speed adjustment technique that finds the optimal tradeoff between fan power and leakage power. We further present a multi-agent distributed task migration technique that searches for the best task allocation during runtime. By choosing only those migration requests that will result chip maximum temperature reduction, the presented framework achieves large fan power savings as well as overall power reduction

An Analysis of Storage Virtualization

Investigating technologies and writing expansive documentation on their capabilities is like hitting a moving target. Technology is evolving, growing, and expanding what it can do each and every day. This makes it very difficult when trying to snap a line and investigate competing technologies. Storage virtualization is one of those moving targets. Large corporations develop software and hardware solutions that try to one up the competition by releasing firmware and patch updates to include their latest developments. Some of their latest innovations include differing RAID levels, virtualized storage, data compression, data deduplication, file deduplication, thin provisioning, new file system types, tiered storage, solid state disk, and software updates to coincide these technologies with their applicable hardware. Even data center environmental considerations like reusable energies, data center environmental characteristics, and geographic locations are being used by companies both small and large to reduce operating costs and limit environmental impacts. Companies are even moving to an entire cloud based setup to limit their environmental impact as it could be cost prohibited to maintain your own corporate infrastructure. The trifecta of integrating smart storage architectures to include storage virtualization technologies, reducing footprint to promote energy savings, and migrating to cloud based services will ensure a long-term sustainable storage subsystem

Exploring the design space for 3D clustered architectures

Journal Article3D die-stacked chips are emerging as intriguing prospects for the future because of their ability to reduce on-chip wire delays and power consumption. However, they will likely cause an increase in chip operating temperature, which is already a major bottleneck in modern microprocessor design. We believe that 3D will provide the highest performance benefit for high-ILP cores, where wire delays for 2D designs can be substantial. A clustered microarchitecture is an example of a complexity-effective implementation of a high-ILP core. In this paper, we consider 3D organizations of a single-threaded clustered microarchitecture to understand how floorplanning impacts performance and temperature. We first show that delays between the data cache and ALUs are most critical to performance. We then present a novel 3D layout that provides the best balance between temperature and performance. The best-performing 3D layout has 12% higher performance than the best-performing 2D layout

Introducing a Data Sliding Mechanism for Cooperative Caching in Manycore Architectures

International audienceIn this paper, we propose a new cooperative caching method improving the cache miss rate for manycore micro- architec- tures. The work is motivated by some limitations of recent adaptive cooperative caching proposals. Elastic Cooperative caching (ECC), is a dynamic memory partitioning mechanism that allows sharing cache across cooperative nodes according to the application behavior. However, it is mainly limited with cache eviction rate in case of highly stressed neighbor- hood. Another system, the adaptive Set-Granular Cooperative Caching (ASCC), is based on finer set-based mechanisms for a better adaptability. However, heavy localized cache loads are not efficiently managed. In such a context, we propose a cooperative caching strategy that consists in sliding data through closer neighbors. When a cache receives a storing request of a neighbor's private block, it spills the least recently used private data to a close neighbor. Thus, solicited saturated nodes slide local blocks to their respective neighbors to always provide free cache space. We also propose a new Priority- based Data Replacement policy to decide efficiently which blocks should be spilled, and a new mechanism to choose host destination called Best Neighbor selector. The first analytic performance evaluation shows that the proposed cache management policies reduce by half the average global communication rate. As frequent accesses are focused in the neighboring zones, it efficiently improves on-Chip traffic. Finally, our evaluation shows that cache miss rate is en- hanced: each tile keeps the most frequently accessed data 1- Hop close to it, instead of ejecting them Off-Chip. Proposed techniques notably reduce the cache miss rate in case of high solicitation of the cooperative zone, as it is shown in the performed experiments

Understanding the thermal implications of multicore architectures

Multicore architectures are becoming the main design paradigm for current and future processors. The main reason is that multicore designs provide an effective way of overcoming instruction-level parallelism (ILP) limitations by exploiting thread-level parallelism (TLP). In addition, it is a power and complexity-effective way of taking advantage of the huge number of transistors that can be integrated on a chip. On the other hand, today's higher than ever power densities have made temperature one of the main limitations of microprocessor evolution. Thermal management in multicore architectures is a fairly new area. Some works have addressed dynamic thermal management in bi/quad-core architectures. This work provides insight and explores different alternatives for thermal management in multicore architectures with 16 cores. Schemes employing both energy reduction and activity migration are explored and improvements for thread migration schemes are proposed.Peer ReviewedPostprint (published version

Power Management Techniques for Data Centers: A Survey

With growing use of internet and exponential growth in amount of data to be stored and processed (known as 'big data'), the size of data centers has greatly increased. This, however, has resulted in significant increase in the power consumption of the data centers. For this reason, managing power consumption of data centers has become essential. In this paper, we highlight the need of achieving energy efficiency in data centers and survey several recent architectural techniques designed for power management of data centers. We also present a classification of these techniques based on their characteristics. This paper aims to provide insights into the techniques for improving energy efficiency of data centers and encourage the designers to invent novel solutions for managing the large power dissipation of data centers.Comment: Keywords: Data Centers, Power Management, Low-power Design, Energy Efficiency, Green Computing, DVFS, Server Consolidatio

Overclocking Approach in Speeding-up a PC Performance

Overclocking can be defined as running a computer at a speed higher than the manufacturer intended. As technology evolves, the introduction of software-based overclocking solutions has widened the horizon of overclocking concept for all PC users. This concept originally designed to overcome money or price issues among the competing processor manufacturer. With this technology, user can achieve satisfaction as user will get boost on performance without spending a lot of money. This project called "Overclocking Approach in Speeding-up a PC Performance" will undermine all the relevant and important issues in developing a complete overclocked PC system with the right hardware and the right tools. This research discusses all the procedure needed in developing and testing the system stability within the capability of standard PC user using certain software. This research aim to achieve certain objectives that involve the procedures, legal issues, performance boost and skill development in overclocking concept as to ensure the topic are carefully chosen. For this project, the author is using the hybrid methodology of system development life cycle that include (Planning) Preliminary and feasibility study, Requirement specification, Design, Development and Testing. With this methodology, the author aim to develop a fully overclocked system in proving that overclocking approach can achieve higher overall performance result compare to standard system. Overclocking approach is designed for PC users to exploit the possibility of achieving higher system configuration and specification within the current hardware system with the help of sometweaking process and activities

Understanding the impact of 3D stacked layouts on ILP

Journal Article3D die-stacked chips can alleviate the penalties imposed by long wires within micro-processor circuits. Many recent studies have attempted to partition each microprocessor structure across three dimensions to reduce their access times. In this paper, we implement each microprocessor structure on a single 2D die and leverage 3D to reduce the lengths of wires that communicate data between microprocessor structures within a single core. We begin with a criticality analysis of inter-structure wire delays and show that for most tra- ditional simple superscalar cores, 2D floorplans are already very efficient at minimizing critical wire delays. For an aggressive wire-constrained clustered superscalar architecture, an exploration of the design space reveals that 3D can yield higher benefit. However, this benefit may be negated by the higher power density and temperature entailed by 3D integration. Overall, we report a negative result and argue against leveraging 3D for higher ILP