Thermal characterisation and reliability analysis of power electronic devices in wind and solar energy systems

Power electronic converters (PECs) are used for conditioning the flow of energy between renewable energy applications and grid or stand-alone connected loads. Insulated gate bipolar transistors (IGBTs) are critical components used as switching devices in PECs. IGBTs are multi-layered devices made of different coefficient of thermal expansion (CTE) based materials. In wind and solar energy applications, IGBT’s reliability is highly influenced by the operating conditions such as variable wind speed and solar irradiance. Power losses occur in switching transient of high current/voltage which causes temperature fluctuations among the layers of the IGBTs. This is the main stress mechanism which accelerates deterioration and eventual failures among IGBT layers due to the dissimilar CTEs. Therefore, proper thermal monitoring is essential for accurate estimation of PECs reliability and end lifetime. Several thermal models have been proposed in literature, which are not capable of representing accurate temperature profiles among multichip IGBTs. These models are mostly derived from offline modelling approaches which cannot take operating conditions and control mechanisms of PECs into account and unable to represent actual heat path among each chip. This research offers an accurate and powerful electro thermal and reliability monitoring tool for such devices. Three-dimensional finite element (FE) IGBT models are implemented using COMSOL, by considering complex heat interactions among each layer. Based on the obtained thermal characteristics, electro thermal and thermo mechanical models were developed in SIMULINK to determine the thermal behaviour of each layer and provide total lifetime consumption analysis. The developed models were verified by real-time (RT) experiments using dSPACE environment. New materials, such as silicon carbide (SiC) devices, were found to exhibit approximately 20°C less thermal profile compared to conventional silicon IGBTs. For PECs used within wind energy systems, PECs driving algorithms were derived within the proposed models and by adjusting switching frequency PECs cycling temperatures were reduced by 12°C which led to a significant reduction in thermal stress; approximately 27 MPa. Total life consumption for the proposed method was calculated as 3.26x10-5 which is approximately 1x10-5 less compared to the other both methods. Effects of maximum power tracking algorithms, used in photovoltaic solar systems, on thermal stress were also explored. The converter’s thermal cycling was found approximately 3 °C higher with the IC algorithm. The steady state temperature was 52.7°C for the IC while it was 42.6 °C for P&O. In conclusion, IC algorithm offers more accurate tracking accuracy; however, this is on the expense of harsher thermal stress which has led to approximately 1.4 times of life consumption compared to P&O under specific operating conditions

Mechanical modelling of high power lateral IGBT for LED driver applications

An assembly exercise was proposed to replace the vertical MOSFET by lateral IGBTs (LIGBT) for LED driver systems which can provide significant advantages in terms of size reduction (LIGBTs are ten times smaller than vertical MOSFETs) and lower component count. A 6 circle, 5V gate, 800 V LIGBT device with dimension of 818μm x 672μm with deposited solder balls that has a radius of around 75μm was selected in this assembly exercise. The driver system uses chip on board (COB) technique to create a compact driver system which can fit into a GU10 bulb housing. The challenging aspect of the LIGBT package in high voltage application is underfill dielectric breakdown and solder fatigue failure. In order to predict the extreme electric field values of the underfill, an electrostatic finite element analysis was undertaken on the LIGBT package structure for various underfill permittivity values. From the electro static finite element analysis, the maximum electric field in the underfill was estimated as 38 V/μm. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue failure. These selected underfills have dielectric breakdown higher than the predicted value from electrostatic analysis. The thermo-mechanical finite element analysis were undertaken for solder bump reliability for all the underfill materials. The underfill which can enhance the solder reliability was chosen as prime candidate

Reliability-Oriented Strategies for Multichip Module Based Mission Critical Industry Applications

The availability is defined as the portion of time the system remains operational to serve its purpose. In mission critical applications (MCA), the availability of power converters are determinant to ensure continue productivity and avoid financial losses. Multichip Modules (MCM) are widely adopted in such applications due to the high power density and reduced price; however, the high number of dies inside a compact package results in critical thermal deviations among them. Moreover, uneven power flow, inhomogeneous cooling and accumulated degradation, potentially result in thermal deviation among modules, thereby increasing the temperature differences and resulting in extra temperature in specific subset of devices. High temperatures influences multiple failure mechanisms in power modules, especially in highly dynamic load profiles. Therefore, the higher failure probability of the hottest dies drastically reduces the reliability of mission critical power converters. Therefore, this work investigate reliability-oriented solutions for the design and thermal management of MCM-based power converters applied in mission critical applications. The first contribution, is the integration of a die-level thermal and probabilistic analysis on the design for reliability (DFR) procedure, whereby the temperature and failure probability of each die are taken into account during the reliability modeling. It is demonstrated that the dielevel analysis can obtain more realistic system-level reliability of MCM-based power converters. Thereafter, three novel die-level thermal balancing strategies, based on a modified MCM - with more gate-emitter connections - are proposed and investigated. It is proven that the temperatures inside the MCM can be overcame, and the maximum temperate reduced in up to 8 %

Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices

The convection thermal coupling between adjacent power devices in power converters is dependent on the ambient temperature. When the ambient temperature changes, the convection thermal coupling also changes. This results in an inaccurate thermal model that causes errors in the prediction of the thermal distribution and junction temperature based on a fixed ambient temperature for power devices in converters application. To solve this variable-ambient-temperature-related issue, a thermal coupling experiment for semiconductor power devices (the MOSFET and diode) was performed to discuss the influence of the thermal coupling effect between adjacent devices and the FEM (Finite Element Method) thermal models for the power devices considering the convection thermal coupling are established. Through these simulations, the junction temperatures of devices under different ambient temperatures were obtained, and the relationships between the junction temperature and ambient temperatures were established. Moreover, the junction temperatures of power devices under different ambient temperatures were calculated and temperature distributions are analyzed in this paper. This method shows a strong significance and has potential applications for high-efficiency and high-power density converter designs

Multilevel Converters for Battery Energy Storage: How Many Levels and Why?

This work explores the potential benefits of cascaded H-bridge multilevel converters in low-voltage applications, particularly grid-attached battery energy storage systems (BESS). While some benefits of these are discussed in literature, this work seeks to create practical, quantitative models for system performance in terms of a number of key performance parameters. These models are then used to find the trends in these performance parameters with an increasingly high order converter, starting to answer the question of how many levels are best. The system performance parameters modelled are power loss, thermal performance and reliability. Wherever practical models and assumptions are validated, be that experimentally or through comparison with existing methods – this work includes a number of experimental series. The resulting trends explored highlight a number of interesting trends, principally: total power loss can be much lower, particularly at high switching frequencies; system thermal performance can be much improved owing to more efficient heatsink utilisation; and due to these thermal benefits, the system reliability based on switching device failure does not suffer as one might expect, and can in fact be higher under some conditions. The investigation also considers the use of cutting-edge switching device technology, such as gallium nitride power transistors, which a multilevel converter enables the use of, and in turn can significantly reduce power dissipation and increase switching frequency. Overall, the work adds new arguments in favour of multilevel converters in such applications and lowers the barrier to practical implementation by answering a number of questions a designer would likely ask. The key novel contributions of this work are the results of the trends that were found in terms of converter power loss, system thermal performance and switching device reliability with respect to multilevel converter order – with the methodologies created for these being somewhat novel in their own right. Along the way, however, other novel work was conducted including: an experimental investigation in to the accuracy of voltage-capacitance curves provided by manufacturers; experimental derivation of relationships for predicting MOSFET body diode performance from readily available device parameters; analysis showing the potential impact of GaN devices on converter efficiency; an experimental validation of GaN device gate turn-on energy; creation and validation of empirical relationship for predicting how heatsink performance varies with more devices of a smaller size; as well as an exploration of whether the extreme small size of some modern power transistors could lead to unexpected thermal cycling issues

Control Strategies for Improving Reliability and Efficiency in Modular Power Converters

The significance of modular power converters has escalated drastically in various applications such as electrical energy distribution, industrial motor drives and More Electric Aircraft (MEA) owing to the benefits such as scalability, design flexibility, higher degree of fault tolerance and better maintenance. One of the main advantages of modular systems is the ability to replace the faulty converter cells during maintenance instead of the entire system. However, such maintenance cycles can result in a system of converter cells with different aging. A system with cells having different aging arises the threats of multiple maintenance, lower reliability and availability, and high maintenance costs. For controlling the thermal-stress based aging of modular power converters, power routing strategy was proposed. The thesis focuses on the different implementation strategies of power routing for modular converters. Power semiconductors are one of the most reliability critical components in power converters, and thermal-stress has been identified as the main cause of their failure. This thesis work concentrates on the power semiconductor reliability improvement algorithms. For improving system lifetime, virtual resistor based power routing algorithms for single stage and multi-stage modular architectures have been investigated through simulations and validated with experiment. A unified framework for routing the power in complex modular converter architectures is defined based on graph theory. Popular converter architectures for Smart Transformer (ST) and MEA applications are modeled as graphs to serve as the basis for developing power flow optimization. The effectiveness of graph theory for optimizing the power flow in modular systems is demonstrated with the help of proposed algorithms

Holistic Physics-of-Failure Approach to Wind Turbine Power Converter Reliability

As the cost of wind energy becomes of increasing importance to the global surge of clean and green energy sources, the reliability-critical power converter is a target for vast improvements in availability through dedicated research. To this end, this thesis concentrates on providing a new holistic approach to converter reliability research to facilitate reliability increasing, cost reducing innovations unique to the wind industry. This holistic approach combines both computational and physical experimentation to provide a test bench for detailed reliability analysis of the converter power modules under the unique operating conditions of the wind turbine. The computational models include a detailed permanent magnet synchronous generator wind turbine with a power loss and thermal model representing the machine side converter power module response to varying wind turbine conditions. The supporting experimental test rig consists of an inexpensive, precise and extremely fast temperature measurement approach using a PbSe photoconductive infra-red sensor unique in the wind turbine reliability literature. This is used to measure spot temperatures on a modified power module to determine the junction temperature swings experienced during current cycling. A number of key conclusions have been made from this holistic approach. -Physics-of-failure analysis (and indeed any wind turbine power converter based reliability analysis) requires realistic wind speed data as the temporal changes in wind speed have a significant impact on the thermal loading on the devices. -The use of drive train modelling showed that the current throughput of the power converter is decoupled from the incoming wind speed due to drive train dynamics and control. Therefore, the power converter loading cannot be directly derived from the wind speed input without this modelling. -The minimum wind speed data frequency required for sufficiently accurate temperature profiles was determined, and the use of SCADA data for physics-of failure reliability studies was subsequently shown to be entirely inadequate. -The experimental emulation of the power converter validated a number of the aspects of the simulation work including the increase in temperature with wind speed and the detectability of temperature variations due to the current's fundamental frequency. Most importantly, this holistic approach provides an ideal test bench for optimising power converter designs for wind turbine, or for other industries with stochastic loading, conditions whilst maintaining or exceeding present reliability levels to reduce wind turbine's cost of energy, and therefore, society