Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio

Wireless Testing of Integrated Circuits.

Integrated circuits (ICs) are usually tested during manufacture by means of automatic testing equipment (ATE) employing probe cards and needles that make repeated physical contact with the ICs under test. Such direct-contact probing is very costly and imposes limitations on the use of ATE. For example, the probe needles must be frequently cleaned or replaced, and some emerging technologies such as three-dimensional ICs cannot be probed at all. As an alternative to conventional probe-card testing, wireless testing has been proposed. It mitigates many of the foregoing problems by replacing probe needles and contact points with wireless communication circuits. However, wireless testing also raises new problems which are poorly understood such as: What is the most suitable wireless communication technique to employ, and how well does it work in practice? This dissertation addresses the design and implementation of circuits to support wireless testing of ICs. Various wireless testing methods are investigated and evaluated with respect to their practicality. The research focuses on near-field capacitive communication because of its efficiency over the very short ranges needed during IC manufacture. A new capacitive channel model including chip separation, cross-talk, and misalignment effects is proposed and validated using electro-magnetic simulation studies to provide the intuitions for efficient antenna and circuit design. We propose a compact clock and data recovery architecture to avoid a dedicated clock channel. An analytical model which predicts the DC-level fluctuation due to the capacitive channel is presented. Based on this model, feed-forward clock selection is designed to enhance performance. A method to select proper channel termination is discussed to maximize the channel efficiency for return-to-zero signaling. Two prototype ICs incorporating wireless testing systems were fabricated and tested with the proposed methods of testing digital circuits. Both successfully demonstrated gigahertz communication speeds with a bit-error rate less than 10^−11. A third prototype IC containing analog voltage measurement circuits was implemented to determine the feasibility of wirelessly testing analog circuits. The fabricated prototype achieved satisfactory voltage measurement with 1 mV resolution. Our work demonstrates the validity of the proposed models and the feasibility of near-field capacitive communication for wireless testing of ICs.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93993/1/duelee_1.pd

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Design and Test of a Gate Driver with Variable Drive and Self-Test Capability Implemented in a Silicon Carbide CMOS Process

Discrete silicon carbide (SiC) power devices have long demonstrated abilities that outpace those of standard silicon (Si) parts. The improved physical characteristics allow for faster switching, lower on-resistance, and temperature performance. The capabilities unleashed by these devices allow for higher efficiency switch-mode converters as well as the advance of power electronics into new high-temperature regimes previously unimaginable with silicon devices. While SiC power devices have reached a relative level of maturity, recent work has pushed the temperature boundaries of control electronics further with silicon carbide integrated circuits. The primary requirement to ensure rapid switching of power MOSFETs was a gate drive buffer capable of taking a control signal and driving the MOSFET gate with high current required. In this work, the first integrated SiC CMOS gate driver was developed in a 1.2 μm SiC CMOS process to drive a SiC power MOSFET. The driver was designed for close integration inside a power module and exposure to high temperatures. The drive strength of the gate driver was controllable to allow for managing power MOSFET switching speed and potential drain voltage overshoot. Output transistor layouts were optimized using custom Python software in conjunction with existing design tool resources. A wafer-level test system was developed to identify yield issues in the gate driver output transistors. This method allowed for qualitative and quantitative evaluation of transistor leakage while the system was under probe. Wafer-level testing and results are presented. The gate driver was tested under high temperature operation up to 530 degrees celsius. An integrated module was built and tested to illustrate the capability of the gate driver to control a power MOSFET under load. The adjustable drive strength feature was successfully demonstrated

The Customizable Virtual FPGA: Generation, System Integration and Configuration of Application-Specific Heterogeneous FPGA Architectures

In den vergangenen drei Jahrzehnten wurde die Entwicklung von Field Programmable Gate Arrays (FPGAs) stark von Moore’s Gesetz, Prozesstechnologie (Skalierung) und kommerziellen Märkten beeinflusst. State-of-the-Art FPGAs bewegen sich einerseits dem Allzweck näher, aber andererseits, da FPGAs immer mehr traditionelle Domänen der Anwendungsspezifischen integrierten Schaltungen (ASICs) ersetzt haben, steigen die Effizienzerwartungen. Mit dem Ende der Dennard-Skalierung können Effizienzsteigerungen nicht mehr auf Technologie-Skalierung allein zurückgreifen. Diese Facetten und Trends in Richtung rekonfigurierbarer System-on-Chips (SoCs) und neuen Low-Power-Anwendungen wie Cyber Physical Systems und Internet of Things erfordern eine bessere Anpassung der Ziel-FPGAs. Neben den Trends für den Mainstream-Einsatz von FPGAs in Produkten des täglichen Bedarfs und Services wird es vor allem bei den jüngsten Entwicklungen, FPGAs in Rechenzentren und Cloud-Services einzusetzen, notwendig sein, eine sofortige Portabilität von Applikationen über aktuelle und zukünftige FPGA-Geräte hinweg zu gewährleisten. In diesem Zusammenhang kann die Hardware-Virtualisierung ein nahtloses Mittel für Plattformunabhängigkeit und Portabilität sein. Ehrlich gesagt stehen die Zwecke der Anpassung und der Virtualisierung eigentlich in einem Konfliktfeld, da die Anpassung für die Effizienzsteigerung vorgesehen ist, während jedoch die Virtualisierung zusätzlichen Flächenaufwand hinzufügt. Die Virtualisierung profitiert aber nicht nur von der Anpassung, sondern fügt auch mehr Flexibilität hinzu, da die Architektur jederzeit verändert werden kann. Diese Besonderheit kann für adaptive Systeme ausgenutzt werden. Sowohl die Anpassung als auch die Virtualisierung von FPGA-Architekturen wurden in der Industrie bisher kaum adressiert. Trotz einiger existierenden akademischen Werke können diese Techniken noch als unerforscht betrachtet werden und sind aufstrebende Forschungsgebiete. Das Hauptziel dieser Arbeit ist die Generierung von FPGA-Architekturen, die auf eine effiziente Anpassung an die Applikation zugeschnitten sind. Im Gegensatz zum üblichen Ansatz mit kommerziellen FPGAs, bei denen die FPGA-Architektur als gegeben betrachtet wird und die Applikation auf die vorhandenen Ressourcen abgebildet wird, folgt diese Arbeit einem neuen Paradigma, in dem die Applikation oder Applikationsklasse fest steht und die Zielarchitektur auf die effiziente Anpassung an die Applikation zugeschnitten ist. Dies resultiert in angepassten anwendungsspezifischen FPGAs. Die drei Säulen dieser Arbeit sind die Aspekte der Virtualisierung, der Anpassung und des Frameworks. Das zentrale Element ist eine weitgehend parametrierbare virtuelle FPGA-Architektur, die V-FPGA genannt wird, wobei sie als primäres Ziel auf jeden kommerziellen FPGA abgebildet werden kann, während Anwendungen auf der virtuellen Schicht ausgeführt werden. Dies sorgt für Portabilität und Migration auch auf Bitstream-Ebene, da die Spezifikation der virtuellen Schicht bestehen bleibt, während die physische Plattform ausgetauscht werden kann. Darüber hinaus wird diese Technik genutzt, um eine dynamische und partielle Rekonfiguration auf Plattformen zu ermöglichen, die sie nicht nativ unterstützen. Neben der Virtualisierung soll die V-FPGA-Architektur auch als eingebettetes FPGA in ein ASIC integriert werden, das effiziente und dennoch flexible System-on-Chip-Lösungen bietet. Daher werden Zieltechnologie-Abbildungs-Methoden sowohl für Virtualisierung als auch für die physikalische Umsetzung adressiert und ein Beispiel für die physikalische Umsetzung in einem 45 nm Standardzellen Ansatz aufgezeigt. Die hochflexible V-FPGA-Architektur kann mit mehr als 20 Parametern angepasst werden, darunter LUT-Grösse, Clustering, 3D-Stacking, Routing-Struktur und vieles mehr. Die Auswirkungen der Parameter auf Fläche und Leistung der Architektur werden untersucht und eine umfangreiche Analyse von über 1400 Benchmarkläufen zeigt eine hohe Parameterempfindlichkeit bei Abweichungen bis zu ±95, 9% in der Fläche und ±78, 1% in der Leistung, was die hohe Bedeutung von Anpassung für Effizienz aufzeigt. Um die Parameter systematisch an die Bedürfnisse der Applikation anzupassen, wird eine parametrische Entwurfsraum-Explorationsmethode auf der Basis geeigneter Flächen- und Zeitmodellen vorgeschlagen. Eine Herausforderung von angepassten Architekturen ist der Entwurfsaufwand und die Notwendigkeit für angepasste Werkzeuge. Daher umfasst diese Arbeit ein Framework für die Architekturgenerierung, die Entwurfsraumexploration, die Anwendungsabbildung und die Evaluation. Vor allem ist der V-FPGA in einem vollständig synthetisierbaren generischen Very High Speed Integrated Circuit Hardware Description Language (VHDL) Code konzipiert, der sehr flexibel ist und die Notwendigkeit für externe Codegeneratoren eliminiert. Systementwickler können von verschiedenen Arten von generischen SoC-Architekturvorlagen profitieren, um die Entwicklungszeit zu reduzieren. Alle notwendigen Konstruktionsschritte für die Applikationsentwicklung und -abbildung auf den V-FPGA werden durch einen Tool-Flow für Entwurfsautomatisierung unterstützt, der eine Sammlung von vorhandenen kommerziellen und akademischen Werkzeugen ausnutzt, die durch geeignete Modelle angepasst und durch ein neues Werkzeug namens V-FPGA-Explorer ergänzt werden. Dieses neue Tool fungiert nicht nur als Back-End-Tool für die Anwendungsabbildung auf dem V-FPGA sondern ist auch ein grafischer Konfigurations- und Layout-Editor, ein Bitstream-Generator, ein Architekturdatei-Generator für die Place & Route Tools, ein Script-Generator und ein Testbenchgenerator. Eine Besonderheit ist die Unterstützung der Just-in-Time-Kompilierung mit schnellen Algorithmen für die In-System Anwendungsabbildung. Die Arbeit schliesst mit einigen Anwendungsfällen aus den Bereichen industrielle Prozessautomatisierung, medizinische Bildgebung, adaptive Systeme und Lehre ab, in denen der V-FPGA eingesetzt wird

Advanced Applications of Rapid Prototyping Technology in Modern Engineering

Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems