PeF: Poisson's Equation Based Large-Scale Fixed-Outline Floorplanning

Floorplanning is the first stage of VLSI physical design. An effective floorplanning engine definitely has positive impact on chip design speed, quality and performance. In this paper, we present a novel mathematical model to characterize non-overlapping of modules, and propose a flat fixed-outline floorplanning algorithm based on the VLSI global placement approach using Poisson's equation. The algorithm consists of global floorplanning and legalization phases. In global floorplanning, we redefine the potential energy of each module based on the novel mathematical model for characterizing non-overlapping of modules and an analytical solution of Poisson's equation. In this scheme, the widths of soft modules appear as variables in the energy function and can be optimized. Moreover, we design a fast approximate computation scheme for partial derivatives of the potential energy. In legalization, based on the defined horizontal and vertical constraint graphs, we eliminate overlaps between modules remained after global floorplanning, by modifying relative positions of modules. Experiments on the MCNC, GSRC, HB+ and ami49\_x benchmarks show that, our algorithm improves the average wirelength by at least 2\% and 5\% on small and large scale benchmarks with certain whitespace, respectively, compared to state-of-the-art floorplanners

Optimizing Scrubbing by Netlist Analysis for FPGA Configuration Bit Classification and Floorplanning

Existing scrubbing techniques for SEU mitigation on FPGAs do not guarantee an error-free operation after SEU recovering if the affected configuration bits do belong to feedback loops of the implemented circuits. In this paper, we a) provide a netlist-based circuit analysis technique to distinguish so-called critical configuration bits from essential bits in order to identify configuration bits which will need also state-restoring actions after a recovered SEU and which not. Furthermore, b) an alternative classification approach using fault injection is developed in order to compare both classification techniques. Moreover, c) we will propose a floorplanning approach for reducing the effective number of scrubbed frames and d), experimental results will give evidence that our optimization methodology not only allows to detect errors earlier but also to minimize the Mean-Time-To-Repair (MTTR) of a circuit considerably. In particular, we show that by using our approach, the MTTR for datapath-intensive circuits can be reduced by up to 48.5% in comparison to standard approaches

System-on-Chip Design and Test with Embedded Debug Capabilities

In this project, I started with a System-on-Chip platform with embedded test structures. The baseline platform consisted of a Leon2 CPU, AMBA on-chip bus, and an Advanced Encryption Standard decryption module. The basic objective of this thesis was to use the embedded reconfigurable logic blocks for post-silicon debug and verification. The System-on-Chip platform was designed at the register transistor level and implemented in a 180-nm IBM process. Test logic instrumentation was done with DAFCA (Design Automation for Flexible Chip Architecture) Inc. pre-silicon tools. The design was then synthesized using the Synopsys Design Compiler and placed and routed using Cadence SOC Encounter. Total transistor count is about 3 million, including 1400K transistors for the debug module serving as on chip logic analyzer. Core size of the design is about 4.8mm x 4.8mm and the system is working at 151MHz. Design verification was done with Cadence NCSim. The controllability and observability of internal signals of the design is greatly increased with the help of pre-silicon tools which helps locate bugs and later fix them with the help of post-silicon tools. This helps prevent re-spins on several occasions thus saving millions of dollars. Post-silicon tools have been used to program assertions and triggers and inject numerous personalities into the reconfigurable fabric which has greatly increased the versatility of the circuit

Leveraging 3D technology for improved reliability

Journal ArticleAggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower supply voltages have increased the vulnerability of computer systems towards transient faults. An increase in within-die and die-to-die parameter variations has also led to a greater number of dynamic timing errors. A potential solution to mitigate the impact of such errors is redundancy via an in-order checker processor. Emerging 3D performance as well as reduced power consumption because of shorter on-chip wires. In this paper, we leverage the "snap-on" functionality provided by 3D integration and propose implementing the redundant checker processor on a second die. This allows manufacturers to easily create a family of "reliable processors" without significantly impacting the cost or performance for customers that care less about reliability. We comprehensively evaluate design choices for this second die, including the effects of L2 cache organization, deep pipelining, and frequency. An interesting feature made possible by 3D integration is the incorporation of heterogeneous process technologies within a single chip

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

On the Use of Directed Moves for Placement in VLSI CAD

Search-based placement methods have long been used for placing integrated circuits targeting the field programmable gate array (FPGA) and standard cell design styles. Such methods offer the potential for high-quality solutions but often come at the cost of long run-times compared to alternative methods. This dissertation examines strategies for enhancing local search heuristics---and in particular, simulated annealing---through the application of directed moves. These moves help to guide a search-based optimizer by focusing efforts on states which are most likely to yield productive improvement, effectively pruning the size of the search space. The engineering theory and implementation details of directed moves are discussed in the context of both field programmable gate array and standard cell designs. This work explores the ways in which such moves can be used to improve the quality of FPGA placements, improve the robustness of floorplan repair and legalization methods for mixed-size standard cell designs, and enhance the quality of detailed placement for standard cell circuits. The analysis presented herein confirms the validity and efficacy of directed moves, and supports the use of such heuristics within various optimization frameworks

Design synthesis for dynamically reconfigurable logic systems

Dynamic reconfiguration of logic circuits has been a research problem for over four decades. While applications using logic reconfiguration in practical scenarios have been demonstrated, the design of these systems has proved to be a difficult process demanding the skills of an experienced reconfigurable logic design expert. This thesis proposes an automatic synthesis method which relieves designers of some of the difficulties associated with designing partially dynamically reconfigurable systems. A new design abstraction model for reconfigurable systems is proposed in order to support design exploration using the presented method. Given an input behavioural model, a technology server and a set of design constraints, the method will generate a reconfigurable design solution in the form of a 3D floorplan and a configuration schedule. The approach makes use of genetic algorithms. It facilitates global optimisation to accommodate multiple design objectives common in reconfigurable system design, while making realistic estimates of configuration overheads and of the potential for resource sharing between configurations. A set of custom evolutionary operators has been developed to cope with a multiple-objective search space. Furthermore, the application of a simulation technique verifying the lll results of such an automatic exploration is outlined in the thesis. The qualities of the proposed method are evaluated using a set of benchmark designs taking data from a real reconfigurable logic technology. Finally, some extensions to the proposed method and possible research directions are discussed

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201