1,033 research outputs found
Test-Delivery Optimization in Manycore SOCs
We present two test-data delivery optimization algorithms
for system-on-chip (SOC) designs with hundreds of cores,
where a network-on-chip (NOC) is used as the interconnection
fabric. We first present an e ective algorithm based on a subsetsum
formulation to solve the test-delivery problem in NOCs
with arbitrary topology that use dedicated routing. We further
propose an algorithm for the important class of NOCs with grid
topology and XY routing. The proposed algorithm is the first to
co-optimize the number of access points, access-point locations,
pin distribution to access points, and assignment of cores to access
points for optimal test resource utilization of such NOCs. Testtime
minimization is modeled as an NOC partitioning problem
and solved with dynamic programming in polynomial time. Both
the proposed methods yield high-quality results and are scalable
to large SOCs with many cores. We present results on synthetic
grid topology NOC-based SOCs constructed using cores from
the ITC’02 benchmark, and demonstrate the scalability of our
approach for two SOCs of the future, one with nearly 1,000 cores
and the other with 1,600 cores. Test scheduling under power
constraints is also incorporated in the optimization framework
Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip
Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips.
To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability.
Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield.
With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle.
To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired.
In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements
RISC-V-Based Platforms for HPC: Analyzing Non-functional Properties for Future HPC and Big-Data Clusters
High-Performance Computing (HPC) have evolved to be used to perform simulations of systems where physical experimentation is prohibitively impractical, expensive, or dangerous. This paper provides a general overview and showcases the analysis of non-functional properties
in RISC-V-based platforms for HPCs. In particular, our analyses target the evaluation of power and energy control, thermal management, and reliability assessment of promising systems, structures, and technologies devised for current and future generation of HPC machines. The main set of design methodologies and technologies developed within the activities of the Future and HPC & Big Data spoke of the National Centre of HPC, Big Data and Quantum Computing project are described along with the description of the testbed for experimenting two-phase cooling approaches
A Survey of Prediction and Classification Techniques in Multicore Processor Systems
In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems
Test Planning for 3D SICs using ILP
In this paper we propose a test planning scheme for corebased 3D stacked integrated circuits where the total test cost for wafer sort of each individual chip and the test cost of the complete stack at package test is minimized. We use an Integer Linear Programming (ILP) model to find the optimal test cost, which is given as the weighted sum of the test time and the test access mechanism (TAM). As ILP is time consuming, we use a scheme to bound the test time and the TAM such that the search space is reduced. The proposed bounding scheme and the ILP model were applied on several ITC’02 benchmarks and the results show that optimal solutions were obtained at low computation time
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