184 research outputs found

    ChatEDA: A Large Language Model Powered Autonomous Agent for EDA

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    The integration of a complex set of Electronic Design Automation (EDA) tools to enhance interoperability is a critical concern for circuit designers. Recent advancements in large language models (LLMs) have showcased their exceptional capabilities in natural language processing and comprehension, offering a novel approach to interfacing with EDA tools. This research paper introduces ChatEDA, an autonomous agent for EDA empowered by a large language model, AutoMage, complemented by EDA tools serving as executors. ChatEDA streamlines the design flow from the Register-Transfer Level (RTL) to the Graphic Data System Version II (GDSII) by effectively managing task planning, script generation, and task execution. Through comprehensive experimental evaluations, ChatEDA has demonstrated its proficiency in handling diverse requirements, and our fine-tuned AutoMage model has exhibited superior performance compared to GPT-4 and other similar LLMs

    Radiation Tolerant Electronics, Volume II

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    Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects

    Low Power Memory/Memristor Devices and Systems

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    This reprint focusses on achieving low-power computation using memristive devices. The topic was designed as a convenient reference point: it contains a mix of techniques starting from the fundamental manufacturing of memristive devices all the way to applications such as physically unclonable functions, and also covers perspectives on, e.g., in-memory computing, which is inextricably linked with emerging memory devices such as memristors. Finally, the reprint contains a few articles representing how other communities (from typical CMOS design to photonics) are fighting on their own fronts in the quest towards low-power computation, as a comparison with the memristor literature. We hope that readers will enjoy discovering the articles within

    A Comprehensive Review of Bio-Inspired Optimization Algorithms Including Applications in Microelectronics and Nanophotonics

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    The application of artificial intelligence in everyday life is becoming all-pervasive and unavoidable. Within that vast field, a special place belongs to biomimetic/bio-inspired algorithms for multiparameter optimization, which find their use in a large number of areas. Novel methods and advances are being published at an accelerated pace. Because of that, in spite of the fact that there are a lot of surveys and reviews in the field, they quickly become dated. Thus, it is of importance to keep pace with the current developments. In this review, we first consider a possible classification of bio-inspired multiparameter optimization methods because papers dedicated to that area are relatively scarce and often contradictory. We proceed by describing in some detail some more prominent approaches, as well as those most recently published. Finally, we consider the use of biomimetic algorithms in two related wide fields, namely microelectronics (including circuit design optimization) and nanophotonics (including inverse design of structures such as photonic crystals, nanoplasmonic configurations and metamaterials). We attempted to keep this broad survey self-contained so it can be of use not only to scholars in the related fields, but also to all those interested in the latest developments in this attractive area

    Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism

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    The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of this hardware heavily uses cycle-accurate simulation of register-transfer-level (RTL) designs. The best software RTL simulators can simulate designs at 1--1000~kHz, i.e., more than three orders of magnitude slower than hardware. Faster simulation can increase productivity by speeding design iterations and permitting more exhaustive exploration. One possibility is to use parallelism as RTL exposes considerable fine-grain concurrency. However, state-of-the-art RTL simulators generally perform best when single-threaded since modern processors cannot effectively exploit fine-grain parallelism. This work presents Manticore: a parallel computer designed to accelerate RTL simulation. Manticore uses a static bulk-synchronous parallel (BSP) execution model to eliminate runtime synchronization barriers among many simple processors. Manticore relies entirely on its compiler to schedule resources and communication. Because RTL code is practically free of long divergent execution paths, static scheduling is feasible. Communication and synchronization no longer incur runtime overhead, enabling efficient fine-grain parallelism. Moreover, static scheduling dramatically simplifies the physical implementation, significantly increasing the potential parallelism on a chip. Our 225-core FPGA prototype running at 475 MHz outperforms a state-of-the-art RTL simulator on an Intel Xeon processor running at ≈\approx 3.3 GHz by up to 27.9×\times (geomean 5.3×\times) in nine Verilog benchmarks

    Sparse Hamming Graph: A Customizable Network-on-Chip Topology

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    Chips with hundreds to thousands of cores require scalable networks-on-chip (NoCs). Customization of the NoC topology is necessary to reach the diverse design goals of different chips. We introduce sparse Hamming graph, a novel NoC topology with an adjustable costperformance trade-off that is based on four NoC topology design principles we identified. To efficiently customize this topology, we develop a toolchain that leverages approximate floorplanning and link routing to deliver fast and accurate cost and performance predictions. We demonstrate how to use our methodology to achieve desired cost-performance trade-offs while outperforming established topologies in cost, performance, or both

    It is too hot in here! A performance, energy and heat aware scheduler for Asymmetric multiprocessing processors in embedded systems.

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    Modern architecture present in self-power devices such as mobiles or tablet computers proposes the use of asymmetric processors that allow either energy-efficient or performant computation on the same SoC. For energy efficiency and performance consideration, the asymmetry resides in differences in CPU micro-architecture design and results in diverging raw computing capability. Other components such as the processor memory subsystem also show differences resulting in different memory transaction timing. Moreover, based on a bus-snoop protocol, cache coherency between processors comes with a peculiarity in memory latency depending on the processors operating frequencies. All these differences come with challenging decisions on both application schedulability and processor operating frequencies. In addition, because of the small form factor of such embedded systems, these devices generally cannot afford active cooling systems. Therefore thermal mitigation relies on dynamic software solutions. Current operating systems for embedded systems such as Linux or Android do not consider all these particularities. As such, they often fail to satisfy user expectations of a powerful device with long battery life. To remedy this situation, this thesis proposes a unified approach to deliver high-performance and energy-efficiency computation in each of its flavours, considering the memory subsystem and all computation units available in the system. Performance is maximized even when the device is under heavy thermal constraints. The proposed unified solution is based on accurate models targeting both performance and thermal behaviour and resides at the operating systems kernel level to manage all running applications in a global manner. Particularly, the performance model considers both the computation part and also the memory subsystem of symmetric or asymmetric processors present in embedded devices. The thermal model relies on the accurate physical thermal properties of the device. Using these models, application schedulability and processor frequency scaling decisions to either maximize performance or energy efficiency within a thermal budget are extensively studied. To cover a large range of application behaviour, both models are built and designed using a generative workload that considers fine-grain details of the underlying microarchitecture of the SoC. Therefore, this approach can be derived and applied to multiple devices with little effort. Extended evaluation on real-world benchmarks for high performance and general computing, as well as common applications targeting the mobile and tablet market, show the accuracy and completeness of models used in this unified approach to deliver high performance and energy efficiency under high thermal constraints for embedded devices

    AI/ML Algorithms and Applications in VLSI Design and Technology

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    An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations
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