Cluster tools with chamber revisiting-modeling and analysis using timed Petri nets

Timed Petri nets are formal models of discrete concurrent systems. Since the durations of all activities are included in the model descriptions, many performance characteristics can be derived from such models. In the case of cluster tools, net models represent the flow of wafers through the chambers of the tool as well as consecutive actions performed by the robotic transporter. Steady-state performance of cluster tools with chamber revisiting is investigated in this paper. A systematic development of detailed tool schedules, based on a general behavioral description of the tool, is proposed and is used to derive the corresponding Petri net models. Symbolic performance characteristics of the modeled tools are obtained by using place invariants, without exhaustive reachability analysis. Simple examples presented in the paper can be easily extended in many ways

NASA space station automation: AI-based technology review

Research and Development projects in automation for the Space Station are discussed. Artificial Intelligence (AI) based automation technologies are planned to enhance crew safety through reduced need for EVA, increase crew productivity through the reduction of routine operations, increase space station autonomy, and augment space station capability through the use of teleoperation and robotics. AI technology will also be developed for the servicing of satellites at the Space Station, system monitoring and diagnosis, space manufacturing, and the assembly of large space structures

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Space station data system analysis/architecture study. Task 2: Options development DR-5. Volume 1: Technology options

The second task in the Space Station Data System (SSDS) Analysis/Architecture Study is the development of an information base that will support the conduct of trade studies and provide sufficient data to make key design/programmatic decisions. This volume identifies the preferred options in the technology category and characterizes these options with respect to performance attributes, constraints, cost, and risk. The technology category includes advanced materials, processes, and techniques that can be used to enhance the implementation of SSDS design structures. The specific areas discussed are mass storage, including space and round on-line storage and off-line storage; man/machine interface; data processing hardware, including flight computers and advanced/fault tolerant computer architectures; and software, including data compression algorithms, on-board high level languages, and software tools. Also discussed are artificial intelligence applications and hard-wire communications

Working Notes from the 1992 AAAI Spring Symposium on Practical Approaches to Scheduling and Planning

The symposium presented issues involved in the development of scheduling systems that can deal with resource and time limitations. To qualify, a system must be implemented and tested to some degree on non-trivial problems (ideally, on real-world problems). However, a system need not be fully deployed to qualify. Systems that schedule actions in terms of metric time constraints typically represent and reason about an external numeric clock or calendar and can be contrasted with those systems that represent time purely symbolically. The following topics are discussed: integrating planning and scheduling; integrating symbolic goals and numerical utilities; managing uncertainty; incremental rescheduling; managing limited computation time; anytime scheduling and planning algorithms, systems; dependency analysis and schedule reuse; management of schedule and plan execution; and incorporation of discrete event techniques

Technology 2003: The Fourth National Technology Transfer Conference and Exposition, volume 2

Proceedings from symposia of the Technology 2003 Conference and Exposition, Dec. 7-9, 1993, Anaheim, CA, are presented. Volume 2 features papers on artificial intelligence, CAD&E, computer hardware, computer software, information management, photonics, robotics, test and measurement, video and imaging, and virtual reality/simulation

Mechanisms of decay and interspecific interactions of white and brown rot fungi

University of Minnesota Ph.D. dissertation.April 2018. Major: Bioproducts/Biosystems Science Engineering and Management. Advisor: Jonathan Schilling. 1 computer file (PDF); xiii, 195 pages.Wood is the largest source of biotic carbon on earth and the principle drivers of its decay are basidiomycete fungi. The biochemical mechanisms of wood decay by basidiomycete fungi are fundamental processes in forest ecosystems that dictate carbon evolution rates, soil organic matter deposition, and overall ecosystem function. These decay mechanisms are also unique in their ability to efficiently convert recalcitrant woody biomass to fermentable sugars and can serve as a biological template for industrial lignocellulose conversion to make renewable biofuels more economical. However, basidiomycete wood decay mechanisms are not fully understood and therefore not replicable in vitro, due in part to a lack of understanding of how decay mechanisms change throughout the progression of decay. In addition, gene transcripts and proteins used to facilitate decay are produced in concert with other biomolecules with non-degradative functions which makes resolution of degradative genes difficult. This dissertation contributes to resolving these problems by describing the temporal progression of decay among several species of wood-degrading basidiomycetes and functionally categorizing genes and secreted proteins involved in mediating interspecific interactions. This was done by first spatially resolving decay into a temporal sequence by growing model brown-rot fungi directionally on thin wood wafers. This system was used to co-localize changes in fungal physiology with chemical changes in wood substrates and the production of fungal metabolites to identify the functional significance of those physiological changes. The same wafer culture design was then used to resolve changes in fungal secretomes between two phylogenetically disparate brown-rot species over the course of decay using proteomics co-localized with lignocellulose-degrading enzyme assays. Interspecific differences were further investigated by comparing decay performance of the same two fungi on a Poales substrate, sorghum bagasse. Sorghum decay rates along with component removal and enzyme assays were monitored during decay to determine the genetic and biochemical basis of substrate preferences of the two species. Temporal alterations to fungal secretomes were compared among several model white and brown-rot fungi as well. Comparative proteomics concurrent with lignocellulose-degrading enzyme assays were used to identify common patterns among both rot types, as well as interspecific variability of decay mechanisms within species. Finally, changes in gene expression, protein secretion, and enzyme activity profiles in response to fungal competitors were described by modifying the thin wood wafer microcosms to incorporate two brown-rot species grown in opposition to one another. Resolution of decay into a sequence revealed a biphasic decay mechanism in brown-rot fungi delineated by early stage, non-hydrolytic pretreatment followed by later stage glycoside hydrolase-mediated saccharification. Proteomic investigation confirmed this pattern by showing later stage secretomes contain a greater proportion of glycoside hydrolases and their activities than earlier stages of decay. Brown-rot secretomes varied considerably by species as did their ability to degrade sorghum bagasse, likely due to a difference in the ability to hydrolyze ferulic acid esters present in sorghum biomass. Comparison of white and brown-rot secretomes identified a common segregation of decay into a biphasic decay mechanism characterized by high lignolysis, in white-rot fungi, upon wood colonization followed by later stage glycoside hydrolase secretion in both decay types. Considerable interspecific variability in decay mechanism within decay types was also detected, with the white-rot species producing different suites of ligninolytic enzymes and brown-rot species diverging in the types of glycoside hydrolases produced. Investigation of interspecific interactions identified several proteins exclusively produced during the interaction of two brown-rot species as well as identifying the general downregulation of lignocellulose-degrading genes during the interaction. In addition, comparative transcriptomics identified two different interaction strategies employed by species and implicates several secondary metabolite-synthesizing genes in facilitating interspecific interactions. Overall, this work contributes toward functional categorization of a wide range of basidiomycete proteins and provides a better understanding of decay mechanisms and interspecific interactions in these understudied organisms