12,966 research outputs found
Nonlinear transient analysis based on power waves and state variables
Muhammad Ershadul Kabir was born in Chittagong, Bangladesh on July 15, 1982. He
received the Bachelor of Science in Electrical and Electronic Engineering from Bangladesh University
of Engineering and Technology (BUET) in Dhaka, Bangladesh in June, 2005. From July,
2005 to August, 2008 he worked in Motorola Telecommunication Bangladesh Pvt. Ltd. as System
Engineer. During this time, he designed many SDH and PDH communication networks for
different Wireless and PSTN operators in Bangladesh.
In September 2008 he enrolled in the Masters program of Electrical and Computer Engineering
in Lakehead University and move in Canada along with his wife. His research interests include
Computer Aided Design (CAD) of Circuit and systems, Simulation Techniques and Algorithms,
Parallel computing system and parallel Implementation of CAD tools, Implementation of CAD
tools in Graphics processing unit (GPU), Analog and mixed-signal circuit design, VLSI circuit
design. He is a student member of the Institute of Electrical and Electronics Engineers (IEEE)
Tensor Computation: A New Framework for High-Dimensional Problems in EDA
Many critical EDA problems suffer from the curse of dimensionality, i.e. the
very fast-scaling computational burden produced by large number of parameters
and/or unknown variables. This phenomenon may be caused by multiple spatial or
temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit
simulation), nonlinearity of devices and circuits, large number of design or
optimization parameters (e.g. full-chip routing/placement and circuit sizing),
or extensive process variations (e.g. variability/reliability analysis and
design for manufacturability). The computational challenges generated by such
high dimensional problems are generally hard to handle efficiently with
traditional EDA core algorithms that are based on matrix and vector
computation. This paper presents "tensor computation" as an alternative general
framework for the development of efficient EDA algorithms and tools. A tensor
is a high-dimensional generalization of a matrix and a vector, and is a natural
choice for both storing and solving efficiently high-dimensional EDA problems.
This paper gives a basic tutorial on tensors, demonstrates some recent examples
of EDA applications (e.g., nonlinear circuit modeling and high-dimensional
uncertainty quantification), and suggests further open EDA problems where the
use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and
System
A Multiproject Chip Approach to the Teaching of Analog MOS LSI and VLSI
Multiproject chip implementation has been used in teaching analog MOS circuit design. After having worked with computer simulation and layout aids in homework problems, students designed novel circuits including several high
performance op amps, an A/D converter, a switched capacitor filter, a 1 K dynamic RAM, and a variety of less conventional MOS circuits such as a VII converter, an AC/DC converter, an AM radio receiver, a digitally-controlled
analog signal processor, and on-chip circuitry for measuring transistor capacitances. These circuits were laid out as part of an NMOS multiproject chip. Several of the designs exhibit a considerable degree of innovation;
fabrication pending, computer simulation shows that some may be pushing the state of the art. Several designs are of interest to digital designers; in fact, the course has provided knowledge and technique needed for detailed
digital circuit design at the gate level
Computer aided electronic circuit design Status report, Dec. 1, 1967 - May 31, 1968
Computer aided electronic circuit desig
Layout to circuit extraction for three-dimensional thermal-electrical circuit simulation of device structures
In this paper, a method is proposed for extraction of coupled networks from layout information for simulation of electrothermal device behavior. The networks represent a three-dimensional (3-D) device structure with circuit elements. The electrical and thermal characteristics of this circuit representation are calculated with a circuit simulator. Spatial potential distributions, current flows, and temperature distributions in the device structure are calculated on the spatial coordinates. This simulation method can be placed between device simulation and (conventional) circuit simulation. It has been implemented in a circuit simulator and is demonstrated for simulation of self-heating in a bipolar low frequency power transistor. The main advantage of this simulation method is that not only the 3-D thermal behavior of the whole chip is simulated, but that this is also directly coupled to the electrical device behavior by means of the power dissipation and temperature distribution in the device. This offers the possibility for the circuit designer to simulate 3-D, coupled, thermal-electrical problems with a circuit simulator. As an example, the influence of the emitter contacting on the internal temperature and current distribution of a BJT is investigate
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