394 research outputs found

    End-of-Life and Constant Rate Reliability Modeling for Semiconductor Packages Using Knowledge-Based Test Approaches

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    End-of-life and constant rate reliability modeling for semiconductor packages are the focuses of this dissertation. Knowledge-based testing approaches are applied and the test-to-failure approach is approved to be a reliable approach. First of all, the end-of-life AF models for solder joint reliability are studied. The research results show using one universal AF model for all packages is flawed approach. An assessment matrix is generated to guide the application of AF models. The AF models chosen should be either assessed based on available data or validated through accelerated stress tests. A common model can be applied if the packages have similar structures and materials. The studies show that different AF models will be required for SnPb solder joints and SAC lead-free solder joints. Second, solder bumps under power cycling conditions are found to follow constant rate reliability models due to variations of the operating conditions. Case studies demonstrate that a constant rate reliability model is appropriate to describe non solder joint related semiconductor package failures as well. Third, the dissertation describes the rate models using Chi-square approach cannot correlate well with the expected failure mechanisms in field applications. The estimation of the upper bound using a Chi-square value from zero failure is flawed. The dissertation emphasizes that the failure data is required for the failure rate estimation. A simple but tighter approach is proposed and provides much tighter bounds in comparison of other approaches available. Last, the reliability of solder bumps in flip chip packages under power cycling conditions is studied. The bump materials and underfill materials will significantly influence the reliability of the solder bumps. A set of comparable bump materials and the underfill materials will dramatically improve the end-of-life solder bumps under power cycling loads, and bump materials are one of the most significant factors. Comparing to the field failure data obtained, the end-of-life model does not predict the failures in the field, which is more close to an approximately constant failure rate. In addition, the studies find an improper underfill material could change the failure location from solder bump cracking to ILD cracking or BGA solder joint failures

    Materials for high-density electronic packaging and interconnection

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    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

    JTEC Panel report on electronic manufacturing and packaging in Japan

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    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies

    Cumulative index to NASA Tech Briefs, 1963-1967

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    Cumulative index to NASA survey on technology utilization of aerospace research outpu

    Heterogeneous 2.5D integration on through silicon interposer

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    © 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity

    FE IMPACTS ON SOLDER JOINT PROPERTIES IN MICROELECTRONIC ASSEMBLY

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    Master'sMASTER OF SCIENC

    Space Transportation Materials and Structures Technology Workshop

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    The Space Transportation Materials and Structures Technology Workshop was held on September 23-26, 1991, in Newport News, Virginia. The workshop, sponsored by the NASA Office of Space Flight and the NASA Office of Aeronautics and Space Technology, was held to provide a forum for communication within the space materials and structures technology developer and user communities. Workshop participants were organized into a Vehicle Technology Requirements session and three working panels: Materials and Structures Technologies for Vehicle Systems, Propulsion Systems, and Entry Systems

    Interior Materiality

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    The knowledge of materials and finishes is the bridge that links conceptual design to real-world application. It is among the core content of virtually all interior architecture/design curricula, moreover, access to up-to-date information on emerging technologies and trends is a key exigency for the contemporary designer. Accordingly, this book is authored to form a comprehensive resource for the “hows” and “whys” surrounding the functional and aesthetic contributions of a wide selection of materials and finishes used in multiple spatial design contexts. The knowledge base presented here is not only useful in shaping spatial experience, ensuring occupant well-being, and employing sustainable thinking but also beneficial in managing budget and schedule while enabling the delivery of top-quality work. The book investigates fundamental material properties, performance criteria, as well as sector-specific standards, regulations, and guidelines, with a special focus on concerns surrounding occupant health and safety as well as environmental impact and sustainability concerns. Furthermore, fabrication, installation, and maintenance issues were explored in detail. Various information collection and organization conventions are also discussed with regard to detailing, specification, estimation, and documentation of materials and finishes. The goals of the book can be listed as follows: ● Developing a vocabulary and knowledge base to comprehend and communicate concepts and paradigms associated with the history, classification, manufacturing, evaluation, fabrication, installation, and maintenance of materials and finishes. ● Identifying a broad range of materials and finishes, considering their aesthetic and performance properties, and understanding their utilization with regard to creative design intent, client expectations and requirements, user needs and experience, and incorporating life cycle implications. ● Providing a basis for achieving physical and psychological well-being for occupants, understanding the impact of changing social, cultural, economic, and ecological context, and eliminating negative environmental and social outcomes.https://newprairiepress.org/ebooks/1042/thumbnail.jp

    Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics

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    The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.
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