InAs Nanowire Devices and Circuits

Since the introduction of the transistor and the integrated circuit, the semiconductor industry has developed at a remarkable pace. By continuously fabricating smaller and faster transistors, it has been possible to maintain an exponential increase in performance, a phenomenon famously described by Moore’s Law. Today, billions of transistors are integrated on a single chip and the size of a transistor is on the scale of tens of nanometres. Until recently, the improvements in performance and integration density have been mostly driven by scaling down the transistor size. However, as the length scale is rapidly approaching that of only a few atoms, this scaling paradigm may not continue forever. Instead, the research community, as well as the industry, is investigating alternative structures and materials in order to further increase the performance. One emerging technology for use in future electronic circuits is transistors based on nanowires. The nanowire transistor structure investigated in this work combines a number of key technologies to achieve a higher performance than traditional Si-based transistors. Epitaxially grown nanowires are naturally oriented in the vertical direction, which means that the devices may be fabricated from the bottom and up. This three-dimensional structure allows a higher integration density and enables the gate to completely surround the channel in a gate-all-around configuration. Combined with a high-k dielectric, this results in an excellent electrostatic gate control. Furthermore, nanowires have the unique ability to combine semiconductor materials with significantly different lattice constants. By introducing InAs as a channel material, a much higher electron mobility than for Si is achieved. In this work, simulations of nanowire-based devices are performed and the ultimate performance is predicted. A nanowire transistor architecture with a realistic footprint is proposed and a roadmap is established for the scaling of the device structure, based on a set of technology nodes. Benchmarking is performed against competing technologies, both from a device and circuit perspective. The physical properties of nanowire transistors, and the corresponding capacitor structure, are investigated by band-structure simulations. Based on these simulations, a ballistic transport model is used to derive the intrinsic transistor characteristics. This is combined with an extensive evaluation and optimization of the parasitic elements in the transistor structure for each technology node. It is demonstrated that an optimized nanowire transistor has the potential to operate at terahertz frequencies, while maintaining a low power consumption. A high quality factor and extremely high integration density is predicted for the nanowire capacitor structure. It is concluded that InAs nanowire devices show great potential for use in future electronic circuits, both in digital and analogue applications

Characterization Methodology, Modeling, and Converter Design for 600 V Enhancement-Mode GaN FETs

Gallium Nitride (GaN) power devices are an emerging technology that have only become available commercially in the past few years. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This dissertation reviews the unique characteristics, commercial status, and design challenges that surround GaN FETs, in order to provide sufficient background to potential GaN-based converter designers.Methodology for experimentally characterizing a GaN FET was also presented, including static characterization with a curve tracer and impedance analyzer, as well as dynamic characterization in a double pulse test setup. This methodology was supplemented by additional tests to determine losses caused by Miller-induced cross talk, and the tradeoff between these losses and overlap losses was studied for one example device.Based on analysis of characterization results, a simplified model was developed to describe the overall switching behavior and some unique features of the device. The impact of the Miller effect during the turn-on transient was studied, as well as the dynamic performance of GaN at elevated temperature.Furthermore, solutions were proposed for several key design challenges in GaN-based converters. First, a driver-integrated overcurrent and short-circuit protection scheme was developed, based on the relationship between gate voltage and drain current in GaN gate injection transistors. Second, the limitations on maximum utilization of current and voltage in a GaN FET were studied, particularly the voltage overshoots following turn-on and turn-off switching transients, and the effective cooling of GaN FETs in higher power operation. A thermal design was developed for heat extraction from bottom-cooled surface-mount devices. These solutions were verified in a GaN-based full-bridge single-phase inverter

Large signal design of silicon field effect transistors for linear radio frequency power amplifiers

EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Compact Models for Integrated Circuit Design

This modern treatise on compact models for circuit computer-aided design (CAD) presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models. Featuring exercise problems at the end of each chapter and extensive references at the end of the book, the text supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices. It ensures even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts

Modeling and Simulation of Subthreshold Characteristics of Short-Channel Fully-Depleted Recessed-Source/Drain SOI MOSFETs

Non-conventional metal-oxide-semiconductor (MOS) devices have attracted researchers‟ attention for future ultra-large-scale-integration (ULSI) applications since the channel length of conventional MOS devices approached the physical limit. Among the non-conventional CMOS devices which are currently being pursued for the future ULSI, the fully-depleted (FD) SOI MOSFET is a serious contender as the SOI MOSFETs possess some unique features such as enhanced short-channel effects immunity, low substrate leakage current, and compatibility with the planar CMOS technology. However, due to the ultra-thin source and drain regions, FD SOI MOSFETs possess large series resistance which leads to the poor current drive capability of the device despite having excellent short-channel characteristics. To overcome this large series resistance problem, the source/drain area may be increased by extending S/D either upward or downward. Hence, elevated-source/drain (E-S/D) and recessed-source/drain (Re-S/D) are the two structures which can be used to minimize the series resistance problem. Due to the undesirable issues such as parasitic capacitance, current crowding effects, etc. with E-S/D structure, the Re-S/D structure is a better choice. The FD Re-S/D SOI MOSFET may be an attractive option for sub-45nm regime because of its low parasitic capacitances, reduced series resistance, high drive current, very high switching speed and compatibility with the planar CMOS technology. The present dissertation is to deal with the theoretical modeling and computer-based simulation of the FD SOI MOSFETs in general, and recessed source/drain (Re-S/D) ultra-thin-body (UTB) SOI MOSFETs in particular. The current drive capability of Re-S/D UTB SOI MOSFETs can be further improved by adopting the dual-metal-gate (DMG) structure in place of the conventional single-metal-gate-structure. However, it will be interesting to see how the presence of two metals as gate contact changes the subthreshold characteristics of the device. Hence, the effects of adopting DMG structure on the threshold voltage, subthreshold swing and leakage current of Re-S/D UTB SOI MOSFETs have been studied in this dissertation. Further, high-k dielectric materials are used in ultra-scaled MOS devices in order to cut down the quantum mechanical tunneling of carriers. However, a physically thick gate dielectric causes fringing field induced performance degradation. Therefore, the impact of high-k dielectric materials on subthreshold characteristics of Re-S/D SOI MOSFETs needs to be investigated. In this dissertation, various subthreshold characteristics of the device with high-k gate dielectric and metal gate electrode have been investigated in detail. Moreover, considering the variability problem of threshold voltage in ultra-scaled devices, the presence of a back-gate bias voltage may be useful for ultimate tuning of the threshold voltage and other characteristics. Hence, the impact of back-gate bias on the important subthreshold characteristics such as threshold voltage, subthreshold swing and leakage currents of Re-S/D UTB SOI MOSFETs has been thoroughly analyzed in this dissertation. The validity of the analytical models are verified by comparing model results with the numerical simulation results obtained from ATLAS™, a device simulator from SILVACO Inc

Journal of Telecommunications and Information Technology, 2000, nr 3,4

kwartalni

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification