Design and development of poly -(3 -hexylthiophene) field effect transistors

Organic field effect transistors (OFETs) with poly(3-hexylthiophene) (P3HT) as the active layer are developed and studied. The device characteristics are significantly affected by source/drain contact resistance, and P3HT-SiO 2 interface and the traps. These results are verified by the numerical device simulations. The temperature dependence of device mobility is studied, which indicates that the carrier transport is either heat-assisted or heat-limited at different temperature ranges. The on/off ratio and threshold voltage are found to be dependent on the temperature. Hysteresis effect due to gate electric stress is investigated. The silanol groups present at the SiO2 surface are thought to be the key factor, which could trap the gate-induced electrons forming immobile negative ions, and shift the device threshold voltage. Replacing gold with modified poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT-PSS) for the source/drain electrodes, reduces contact resistance and leads to an improved device performance. The SiO2 surface is also improved. Annealing the SiO2surface prior to the deposition of the P3HT layer is found to improve the performance of the device significantly. The device mobility is increased from 0.01 to 0.026 cm2/Vs, the on/off ratio increased from 2.3 × 103 to 8.2 × 103, and subthreshold slope decreased from 3.6 to 2 V/dec. The enhanced device performance is attributed to the possible reduction of physically adsorbed water molecules and hydroxyl groups at the SiO2 surface upon annealing. Polymer heterostructure OFETs are also developed for establishing a method to fabricate new devices and the possibility to increase the device performance. This idea stems from the conventional inorganic modulation doped field effect transistors (MODFETs) that have shown strikingly high carrier mobility. The operation of conventional MODFETs is based on the technique of modulation doping which provides a good means of introducing carriers into the conduction layer without the adverse effects of donors. A polymer heterojunction structure is made of P3HT and poly(9,9-dioctylfluorenyl-2,7-diyl) (PFO) and is integrated into a field effect transistor. The resulting device characteristic shows the modulation doping effect. To our knowledge, the modulation doping effect with a polymer heterojunction has not been reported so far. This finding opens a potential pathway to improve the OFETs\u27 device performance

Organic Electronic Devices - Fundamentals, Applications, and Novel Concepts

This work addresses two substantial problems of organic electronic devices: the controllability and adjustability of performance, and the integration using scalable, high resolution patterning techniques for planar thin-film transistors and novel vertical transistor devices. Both problems are of particular importance for the success of transparent and flexible organic electronics in the future. To begin with, the static behavior in molecular doped organic pin-diodes is investigated. This allows to deduce important diode parameters such as the depletion capacitance, the number of active dopant states, and the breakdown field. Applying this knowledge, organic pin-diodes are designed for ultra-high-frequency applications and a cut-off-frequency of up to 1GHz can be achieved using optimized parameters for device geometry, layer thickness, and dopant concentration. The second part of this work is devoted to organic thin-film transistors, high resolution patterning techniques, as well as novel vertical transistor concepts. In particular, fluorine based photo-lithography, a high resolution patterning technique compatible to organic semiconductors, is introduced fielding the integration of organic thin-film transistors under ambient conditions. However, as it will be shown, horizontal organic thin-film transistors are substantially limited in their performance by charge carrier injection. Hence, down-scaling is inappropriate to enlarge the transconductance of such transistors. To overcome this drawback, a novel vertical thin-film transistor concept with a vertical channel length of ∼50nm is realized using fluorine based photo-lithography. These vertical devices can surpass the performance of planar transistors and hence are prospective candidates for future integration in complex electronic circuits

Interpretation and Physical Modeling of Electronic Transport and Defect States in IGZO Thin-Film Transistors

This work is a comprehensive study on the interpretation and modeling of electronic transport behavior and defect states in indium-gallium-zinc-oxide (IGZO) TFTs. Key studies have focused on advancing the state of IGZO TFTs by addressing several challenges in device stability, scaling, and device modeling. These studies have provided new insight on the associated mechanisms and have resulted in the realization of scaled thin-film transistors that exhibit excellent electrical performance and stability. This work has demonstrated the ability to scale the conventional inverted staggered IGZO TFT down to one micron channel length, with excellent on-state and off-state performance where the VT ≈1 V, µeff =12 cm2/Vs, Ileak ≤ 10-12 A/µm and SS ≈ 160 mV/dec. The working source/drain electrodes are direct metal contact regions to the IGZO, which requires several microns of gate overlap to provide ohmic behavior with minimal series resistance and ensure tolerance to overlay error. New results utilizing ion implantation for self-aligned source/drain regions present a path towards submicron channel length. This strategy offers a reduction in channel length as well as parasitic capacitance, which translates to improvement in RC delay and associated voltage losses due to charge-sharing. The realization of self-aligned TFTs using boron ion implantation for selective activation was introduced in a first-time report of boron-doped IGZO. Cryogenic measurements made on long-channel devices has revealed temperature-dependent behavior that is not explained by existing TCAD models employed for defect states and carrier mobility. A completely new device model using Silvaco Atlas has been established which properly accounts for the role of donor-like oxygen vacancy defects, acceptor-like band-tail states, acceptor-like interface traps, and a temperature-dependent intrinsic channel mobility. The developed model demonstrates a remarkable match to transfer characteristics measured at T = 150 K to room temperature. A power-law fit for the µch = f(T) relationship, which resembles 〖μ ~ T〗^((+3)⁄2) behavior consistent with ionized defect scattering. The mobility model is expressly independent of carrier concentration, without dependence on the applied gate bias. The device model is consistent with a compact model developed for circuit simulation (SPICE) that has been recently refined to include on-state and off-state operation. While IGZO is the only AOS technology mature enough for commercialization, the effective electron channel mobility µeff ~ 10 cm2/Vs presents a performance limitation. Other candidate AOS materials which have higher reported channel mobility values have also been investigated; specifically, indium-tungsten-oxide (IWO) and indium-gallium-tin-oxide (ITGO). These investigations serve as preliminary studies; device characteristics support the claims of high channel mobility; however the influence of defect states clearly indicates the need for further process development. The advancements realized in IGZO TFTs in this work will serve as a foundation for these alternative AOS materials

5nm 이하 3D Transistors의 Self-Heating 및 전열특성분석 연구

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·컴퓨터공학부, 2021.8. 신형철.In this thesis, Self-Heating Effect (SHE) is investigated using TCAD simulations in various Sub-10-nm node Field Effect Transistor (FET). As the node decreases, logic devices have evolved into 3D MOSFET structures from Fin-FET to Nanosheet-FET. In the case of 3D MOSFET, there are thermal reliability issues due to the following reasons: ⅰ) The power density of the channel is high, ⅱ) The channel structure surrounded by SiO2, ⅲ) The overall low thermal conductivity characteristics due to scaling down. Many papers introduce the analysis and prediction of temperature rise by SHE in the device, but there are no papers presenting the content of mitigation of temperature rise. Therefore, we have studied the methods of decreasing the maximum lattice temperature (TL,max) such as shallow trench isolation (STI) composition engineering in Fin-FET, thermal analysis according to DC/AC/duty cycle in nanowire-FET, and active region ( e.g., gate metal thickness, channel width, channel number etc..) optimization in nanosheet-FET. In addition, lifetime affected by hot carrier injection (HCI) / bias-temperature instability (BTI) is also analyzed according to various thermal relaxation methods presented.이 논문에서는 다양한 Sub-10nm 노드 전계 효과 트랜지스터 (FET)에서 TCAD 시뮬레이션을 사용하여 자체 발열 효과 (SHE)를 조사합니다. 노드가 감소함에 따라 논리 장치는 Fin-FET에서 Nanosheet-FET로 3D MOSFET 구조로 진화했습니다. 3D MOSFET의 경우 ⅰ) 채널의 전력 밀도가 높음, ⅱ) SiO2로 둘러싸인 채널 구조, ⅲ) 축소로 인해 전체적으로 낮은 열전도 특성 등 다음과 같은 이유로 열 신뢰성 문제가 있습니다. 한편, 많은 논문이 device에서 SHE에 의한 온도 상승의 분석 및 예측을 소개하지만 온도 상승 완화의 내용을 제시하는 논문은 거의 없습니다. 따라서 Fin-FET의 STI (Shallow Trench Isolation) 구성 공학, nanowire-FET의 DC / AC / 듀티 사이클에 따른 열 분석, nanosheet-FET에서 소자의 중요영역(예: 게이트 금속 두께, 채널 폭, 채널 번호 등)의 최적화를 통해서 최대 격자 온도 (TL,max)를 낮추는 방법등을 연구했습니다. 또한 더 나아가서 HCI (Hot Carrier Injection) / BTI (Bias-Temperature Instability)의 영향을 받는 수명도 제시된 다양한 열 완화 방법에 따라 분석하여 소자의 제작에 있어 열적 특성과 수명을 좋게 만드는 지표를 제시합니다 .Chapter 1 Introduction 1 1.1. Development of Semconductor structure 1 1.2. Self-Heating Effect issues in semiconductor devices 3 Chapter 2 Thermal-Aware Shallow Trench Isolation Design Optimization for Minimizing Ioff in Various Sub-10-nm 3-D Transistor 7 2.1. Introduction 7 2.2. Device Structure and Simulation Condition 7 2.3. Results and Discussion 12 2.4. Summary 27 Chapter 3 Analysis of Self Heating Effect in DC/AC Mode in Multi-channel GAA-Field Effect Transistor 32 3.1. Introduction 32 3.2. Multi-Channel Nanowire FET and Back End Of Line 33 3.3. Work Flow and Calibration Process 35 3.4. More Detailed Thermal Simulation of Nanowire-FET 37 3.5. Performance Analysis by Number of Channels 38 3.6. DC Characteristic of SHE in Nanowire-FETs 40 3.7. AC Characteristics of SHE in Nanowire-FETs 43 3.8. Summary 51 Chapter 4 Self-Heating and Electrothermal Properties of Advanced Sub-5-nm node Nanoplate FET 56 4.1. Introduction 56 4.2. Device Structure and Simulation Condition 57 4.3. Thermal characteristics by channel number and width 62 4.4. Thermal characteristics by inter layer-metal thickness (TM) 64 4.5. Life Time Prediction 65 4.6. Summary 67 Chapter 5 Study on Self Heating Effect and life time in Vertical-channel Field Effect Transistor 72 5.1. Introduction 72 5.2. Device Structure and Simulation Condition 72 5.3. Temperature and RTH according to channel width(TW) 76 5.4. Thermal properties according to air spacers and air gap 77 5.5. Ion boosting according to Channel numbers 81 5.6. Temperature imbalance of multi-channel VFETs 82 5.7. Mitigation of the channel temperature imbalance 86 5.8. Life time depending on various analysis conditions 88 5.9. Summary 89 Chapter 6 Conclusions 93 Appendix A. A Simple and Accurate Modeling Method of Channel Thermal Noise Using BSIM4 Noise Models 95 A.1. Introduction 95 A.2. Overall Schematic of the RF MOSFET Model 97 A.3. Verification of the DC Characteristics of the RF MOSFET Model 98 A.4. Verification of the MOSFET Model with Measured Y-parameters 100 A.5. Verification of the MOSFET Model with Measured Noise Parameters 101 A.6. Thermal Noise Extraction and Modeling (TNOIMOD = 0) 103 A.7. Verification of the Enhanced Model with Noise Parameters 112 A.8. Holistic Model (TNOIMOD = 1) 114 A.9. Evaluation the validity of the model for drain bias 115 A.10. Conclusion 117 Abstract in Korean 122박

Simulation study of scaling design, performance characterization, statistical variability and reliability of decananometer MOSFETs

This thesis describes a comprehensive, simulation based scaling study – including device design, performance characterization, and the impact of statistical variability – on deca-nanometer bulk MOSFETs. After careful calibration of fabrication processes and electrical characteristics for n- and p-MOSFETs with 35 nm physical gate length, 1 nm EOT and stress engineering, the simulated devices closely match the performance of contemporary 45 nm CMOS technologies. Scaling to 25 nm, 18 nm and 13 nm gate length n and p devices follows generalized scaling rules, augmented by physically realistic constraints and the introduction of high-k/metal-gate stacks. The scaled devices attain the performance stipulated by the ITRS. Device a.c. performance is analyzed, at device and circuit level. Extrinsic parasitics become critical to nano-CMOS device performance. The thesis describes device capacitance components, analyzes the CMOS inverter, and obtains new insights into the inverter propagation delay in nano-CMOS. The projection of a.c. performance of scaled devices is obtained. The statistical variability of electrical characteristics, due to intrinsic parameter fluctuation sources, in contemporary and scaled decananometer MOSFETs is systematically investigated for the first time. The statistical variability sources: random discrete dopants, gate line edge roughness and poly-silicon granularity are simulated, in combination, in an ensemble of microscopically different devices. An increasing trend in the standard deviation of the threshold voltage as a function of scaling is observed. The introduction of high-k/metal gates improves electrostatic integrity and slows this trend. Statistical evaluations of variability in Ion and Ioff as a function of scaling are also performed. For the first time, the impact of strain on statistical variability is studied. Gate line edge roughness results in areas of local channel shortening, accompanied by locally increased strain, both effects increasing the local current. Variations are observed in both the drive current, and in the drive current enhancement normally expected from the application of strain. In addition, the effects of shallow trench isolation (STI) on MOSFET performance and on its statistical variability are investigated for the first time. The inverse-narrow-width effect of STI enhances the current density adjacent to it. This leads to a local enhancement of the influence of junction shapes adjacent to the STI. There is also a statistical impact on the threshold voltage due to random STI induced traps at the silicon/oxide interface

Modeling and optimization of Tunnel-FET architectures exploiting carrier gas dimensionality

The semiconductor industry, governed by the Moore's law, has achieved the almost unbelievable feat of exponentially increasing performance while lowering the costs for years. The main enabler for this achievement has been the scaling of the CMOS transistor that allowed the manufacturers to pack more and more functionality into the same chip area. However, it is now widely agreed that the happy days of scaling are well over and we are about to reach the physical limits of the CMOS concept. One major, insurmountable limit of CMOS is the so-called thermionic emission limit which dictates that the switching slope of the transistor cannot go below 60mV/dec at room temperature. This makes it impossible to scale down the supply voltage for CMOS transistor without dramatically increasing the static power consumption. To address this issue, a novel transistor concept called Tunnel FET (TFET) which utilizes the quantum mechanical band-to-band tunneling (BTBT) has been proposed. TFETs possess the potential to overcome the thermionic emission limit and therefore allow for low supply voltage operation. This thesis aims at investigating the performance of TFETs with alternative architectures exploiting quantized carrier gases through quantum mechanical simulations. To this end, 1D and 2D self-consistent Schrödinger-Poisson solvers with closed boundaries are developed along with the phonon-assisted and direct BTBT models implemented as a post-processing step. Moreover, we propose an efficient method to incorporate the quantization along the transverse direction which enables us to simulate different dimensionality combinations. The implemented models are calibrated against experimental and more fundamental quantum mechanical simulation methods such as k.p and tight-binding NEGF using tunneling diode structures. Using these tools, we simulate an advanced TFET architecture called electron-hole bilayer TFET (EHBTFET) which exploits BTBT between 2D electron and hole gases electrostatically induced by two separate oppositely biased gates. The subband-to-subband tunneling is first analyzed with the 1D simulator where the device working principle is demonstrated. Then, non-idealities of the EHBTFET operation such as the lateral tunneling and corner effects are investigated using the 2D simulator. The origin of the lateral leakage and techniques to reduce it are analyzed in detail. A parameter space analysis of the EHBTFET is performed by simulating a wide range of channel materials, channel thickness and oxide thicknesses. Our results indicate the possibility of having 2D-2D and 3D-3D tunneling for the EHBTFET, depending on the parameters chosen. A novel digital logic scheme utilizing the independent biasing property of the EHBTFET n- and p-gates is proposed and verified through quantum-corrected TCAD simulations. The performance benchmarking against a 28nm FD-SOI CMOS technology is performed as well. The results indicate that the EHBTFET logic can outperform the CMOS counterpart in the low supply voltage (subthreshold) regime, where it can offer significantly higher drive current due to its steep switching slope. We also compare the different dimensionality cases and highlight important differences between the face and edge tunneling devices in terms of their dependence on the device parameters (channel material, channel thickness and EOT)

Low temperature lithographically patterned metal oxide transistors for large area electronics

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 167-184).Optically transparent, wide bandgap metal oxide semiconductors are a promising candidate for large-area electronics technologies that require lightweight, temperature-sensitive flexible substrates. Because these thin films retain relatively high carrier mobilities even in an amorphous state, metal oxide-based field effect transistors (FETs) can be processed at near-room temperatures. Compared to amorphous silicon FETs, which are the dominant technology used in display backplanes, metal oxide FETs have been demonstrated with higher charge carrier mobilities, higher current densities, and faster response performance. In this thesis we present a low-temperature ('1000C), scalable, fully lithographic process for top-gate, bottom-contact amorphous zinc indium oxide FETs using parylene, a room-temperature-deposited CVD polymer, as gate dielectric. Electrical characteristics were compared for FETs of varying device dimensions (W, L) using a standard set of extracted device parameters. We show in both simulation and experiment that the FET threshold voltage can be modified by varying the channel thickness alone, without requiring the additional complexity of multiple channel materials or different dopings. The baseline lithographic process was further developed to enable the integration of FETs of different channel thicknesses, and hence threshold voltages, on a single substrate. The availability of FETs with different threshold voltages allows the implementation of enhancement-depletion (E/D) logic circuits that have faster speeds and smaller device areas than single-VT topologies. Using the two-VT lithographic process, we fabricated integrated E/D inverters that operate at VDD as low as 3V with gains > 20 and symmetric noise margins ~1.2V. Furthermore, we demonstrated integrated 11-stage and 21-stage E/D ring oscillators that operated rail-to-rail at VDD= 3V and maintained oscillation for VDD as low as 1.7V. These results demonstrate the potential for low VDD metal oxide-based integrated circuits fabricated in a low temperature budget, fully lithographic process for large-area transparent electronics.by Annie I. Wang.Ph.D

Electrical Characterisation of III-V Nanowire MOSFETs

The ever increasing demand for faster and more energy-efficient electricalcomputation and communication presents severe challenges for the semiconductor industry and particularly for the metal-oxidesemiconductorfield-effect transistor (MOSFET), which is the workhorse of modern electronics. III-V materials exhibit higher carrier mobilities than the most commonly used MOSFET material Si so that the realisation of III-V MOSFETs can enable higher operation speeds and lower drive voltages than that which is possible in Si electronics. A lowering of the transistor drive voltage can be further facilitated by employing gate-all-around nanowire geometries or novel operation principles. However, III-V materials bring about their own challenges related to material quality and to the quality of the gate oxide on top of a III-V MOSFET channel.This thesis presents detailed electrical characterisations of two types of (vertical) III-V nanowire transistors: MOSFETs based on conventional thermionic emission; and Tunnel FETs, which utilise quantum-mechanical tunnelling instead to control the device current and reach inverse subthreshold slopes below the thermal limit of 60 mV/decade. Transistor characterisations span over fourteen orders of magnitude in frequency/time constants and temperatures from 11 K to 370 K.The first part of the thesis focusses on the characterisation of electrically active material defects (‘traps’) related to the gate stack. Low-frequency noise measurements yielded border trap densities of 10^18 to 10^20 cm^-3 eV^-1 and hysteresis measurements yielded effective trap densities – projected to theoxide/semiconductor interface – of 2x10^12 to 3x10^13 cm^-2 eV^-1. Random telegraph noise measurements revealed that individual oxide traps can locally shift the channel energy bands by a few millielectronvolts and that such defects can be located at energies from inside the semiconductor band gap all the way into the conduction band.Small-signal radio frequency (RF) measurements revealed that parts of the wide oxide trap distribution can still interact with carriers in the MOSFET channel at gigahertz frequencies. This causes frequency hystereses in the small-signal transconductance and capacitances and can decrease the RF gains by a few decibels. A comprehensive small-signal model was developed, which takes into account these dispersions, and the model was applied to guide improvements of the physical structure of vertical RF MOSFETs. This resulted in values for the cutoff frequency fT and the maximum oscillation frequency fmax of about 150 GHz in vertical III-V nanowire MOSFETs.Bias temperature instability measurements and the integration of (lateral) III-V nanowire MOSFETs in a back end of line process were carried out as complements to the main focus of this thesis. The results of this thesis provide a broad perspective of the properties of gate oxide traps and of the RF performance of III-V nanowire transistors and can act as guidelines for further improvement and finally the integration of III-V nanowire MOSFETs in circuits

Compact modeling of the rf and noise behavior of multiple-gate mosfets

La reducción de la tecnología MOSFET planar ha sido la opción tecnológica dominante en las últimas décadas. Sin embargo, hemos llegado a un punto en el que los materiales y problemas en los dispositivos surgen, abriendo la puerta para estructuras alternativas de los dispositivos. Entre estas estructuras se encuentran los dispositivos DG, SGT y Triple-Gate. Estas tres estructuras están estudiadas en esta tesis, en el contexto de rducir las dimensiones de los dispositivos a tamaños tales que los mecanismos cuánticos y efectos de calan coro deben tenerse n cuenta. Estos efectos vienen con una seria de desafíos desde el pun to de vista de modelación, unos de los más grandes siendo el tiempo y los recursos comprometidos para ejecutar las simulaciones. para resolver este problema, esta tesis propone modelos comlets analíticos y compactos para cada una de las geometrías, validos desde DC hasta el modo de operación en Rf para los nodos tecnológicos futuros. Dichos modelos se han extendido para analizar el ruido de alta frecuencia en estos diapositivos