A modular hybrid simulation framework for complex manufacturing system design

For complex manufacturing systems, the current hybrid Agent-Based Modelling and Discrete Event Simulation (ABM–DES) frameworks are limited to component and system levels of representation and present a degree of static complexity to study optimal resource planning. To address these limitations, a modular hybrid simulation framework for complex manufacturing system design is presented. A manufacturing system with highly regulated and manual handling processes, composed of multiple repeating modules, is considered. In this framework, the concept of modular hybrid ABM–DES technique is introduced to demonstrate a novel simulation method using a dynamic system of parallel multi-agent discrete events. In this context, to create a modular model, the stochastic finite dynamical system is extended to allow the description of discrete event states inside the agent for manufacturing repeating modules (meso level). Moreover, dynamic complexity regarding uncertain processing time and resources is considered. This framework guides the user step-by-step through the system design and modular hybrid model. A real case study in the cell and gene therapy industry is conducted to test the validity of the framework. The simulation results are compared against the data from the studied case; excellent agreement with 1.038% error margin is found in terms of the company performance. The optimal resource planning and the uncertainty of the processing time for manufacturing phases (exo level), in the presence of dynamic complexity is calculated

Designing a dexterous reconfigurable packaging system for flexible automation

This paper presents a design for a reconfigurable packaging system that can handle cartons of different shape and sizes and is amenable to ever changing demands of packaging industries for perfumery and cosmetic products. The system takes structure of a multi-fingered robot hand, which can provide fine motions, and dexterous manipulation capability that may be required in a typical packaging-assembly line. The paper outlines advanced modeling and simulation undertaken to design the packaging system and discusses the experimental work carried out. The new packaging system is based on the principle of reconfigurability, that shows adaptability to simple as well as complex carton geometry. The rationale of developing such a system is presented with description of its human equivalent. The hardware and software implementations are also discussed together with directions for future research

RNA packaging motor: From structure to quantum mechanical modelling and sequential-stochastic mechanism

The bacteriophages of the Cystoviridae family package their single stranded RNA genomic precursors into empty capsid (procapsids) using a hexameric packaging ATPase motor (P4). This molecular motor shares sequence and structural similarity with RecA-like hexameric helicases. A concerted structural, mutational and kinetic analysis helped to define the mechanical reaction coordinate, i.e. the conformational changes associated with RNA translocation. The results also allowed us to propose a possible scheme of coupling between ATP hydrolysis and translocation which requires the cooperative action of three consecutive subunits. Here, we first test this model by preparing hexamers with defined proportions of wild type and mutant subunits and measuring their activity. Then, we develop a stochastic kinetic model which accounts for the catalytic cooperativity of the P4 hexamer. Finally, we use the available structural information to construct a quantum-chemical model of the chemical reaction coordinate and obtain a detailed description of the electron density changes during ATP hydrolysis. The model explains the results of the mutational analyses and yields new insights into the role of several conserved residues within the ATP binding pocket. These hypotheses will guide future experimental work

Warpage issues in large area mould embedding technologies

The need for higher communications speed, heterogeneous integration and further miniaturisation have increased demand in developing new 3D integrated packaging technologies which include wafer-level moulding and chip-to-wafer interconnections . Wafer-level moulding refers to the embedding of multiple chips or heterogeneous systems on the wafer scale. This can be achieved through a relatively new technology consisting of thermal compression moulding of granular or liquid epoxy moulding compounds. Experimental measurements from compression moulding on 8” blank wafers have shown an unexpected tendency to warp into a cylindrical-shape following cooling from the moulding temperature to room temperature. Wafer warpage occurs primarily as a result of a mismatch between the coefficient of thermal expansion of the resin compound and the Si wafer. This paper will delve into possible causes of such asymmetric warpage related to mould, dimensional and material characteristics using finite element (FE) software (ANSYS Mechanical). The FE model of the resin on wafer deposition will be validated against the measurement results and will be used to deduce appropriate guidelines for low warpage wafer encapsulation.peer-reviewe

Variability analysis of interconnect structures including general nonlinear elements in SPICE-type framework

A stochastic modelling method is developed and implemented in a SPICE framework to analyse variability effects on interconnect structures including general nonlinear element

An Agent-Based Approach to Self-Organized Production

The chapter describes the modeling of a material handling system with the production of individual units in a scheduled order. The units represent the agents in the model and are transported in the system which is abstracted as a directed graph. Since the hindrances of units on their path to the destination can lead to inefficiencies in the production, the blockages of units are to be reduced. Therefore, the units operate in the system by means of local interactions in the conveying elements and indirect interactions based on a measure of possible hindrances. If most of the units behave cooperatively ("socially"), the blockings in the system are reduced. A simulation based on the model shows the collective behavior of the units in the system. The transport processes in the simulation can be compared with the processes in a real plant, which gives conclusions about the consequencies for the production based on the superordinate planning.Comment: For related work see http://www.soms.ethz.c

Logistic regression for simulating damage occurrence on a fruit grading line

Many factors influence the incidence of mechanical damage in fruit handled on a grading line. This makes it difficult to address damage estimation from an analytical point of view. During fruit transfer from one element of a grading line to another, damage occurs as a combined effect of machinery roughness and the intrinsic susceptibility of fruit. This paper describes a method to estimate bruise probability by means of logistic regression, using data yielded by specific laboratory tests. Model accuracy was measured via the statistical significance of its parameters and its classification ability. The prediction model was then linked to a simulation model through which impacts and load levels, similar to those of real grading lines, could be generated. The simulation output sample size was determined to yield reliable estimations. The process makes it possible to derive a suitable line design and the type of fruit that should be handled to maintain bruise levels within European Union (EU) Standards. A real example with peaches was carried out with the aid of the software implementation SIMLIN®, developed by the authors and registered by Madrid Technical University. This kind of tool has been demanded by inter-professional associations and grading lines designers in recent year