Technology exploration for adaptive power and frequency scaling in 90nm CMOS

In this paper we examine the expectations and limitations of design technologies such as adaptive voltage scaling (AVS) and adaptive body biasing (ABB) in a modern deep sub-micron process. To serve this purpose, a set of ring oscillators was fabricated in a 90nm triple-well CMOS technology. The analysis hereby presented is based on two ring oscillators running at 822MHz and 93MHz, respectively. Measurement results indicate that it is possible to reach 13.8x power savings by 3.4x frequency downscaling using AVS, ±11% power and ±8% frequency tuning at nominal conditions using ABB only, 22x power savings with 5x frequency downscaling by combining AVS and ABB, as well as 22x leakage reduction

Voltage and Timing Adaptation for Variation and Aging Tolerance in Nanometer VLSI Circuits

Process variations and circuit aging continue to be main challenges to the power-efficiency of VLSI circuits, as considerable power budget must be allocated at design time to mitigate timing variations. Modern designs incorporate adaptive techniques for variation compensation to reduce the extra power consumption. The efficiency of existing adaptive approaches, however, is often significantly attenuated by the fine-grained nature of variations in nanometer technology such as random dopant fluctuation, litho-variation, and different rates of transistor degradation due to non-uniform activity factors. This dissertation addresses the limitations from existing adaptation techniques, and proposes new adaptive approaches to effectively compensate the fine-grained variations. Adaptive supply voltage (ASV) is one of the effective adaptation approaches for power-performance tuning. ASV has advantages on controlling dynamic and leakage power, while voltage generation and delivery overheads from conventional ASV systems make their application to mitigate fine-grained variations demanding. This dissertation presents a dual-level ASV system which provides ASV at both coarse-grained and fine-grained level, and has limited power routing overhead. Significant power reduction from our dual-ASV system demonstrates its superiority over existing approaches. Another novel technique on supply voltage adaptation for variation resilience in VLSI interconnects is proposed. A programmable boostable repeater design boosts switching speed by raising its internal voltage rail transiently and autonomously, and achieves fine-grained voltage adaptation without stand-alone voltage regulators or additional power grid. Since interconnect is a widely recognized bottleneck to chip performance and tremendous repeaters are employed on chip designs, boostable repeater has plenty of chances to improve system robustness. A low cost scheme for delay variation detection is essential to compose an efficient adaptation system. This dissertation presents an area-efficient built-in delay testing scheme which exploits BIST SCAN architecture and dynamic clock skew control. Using this built-in delay testing scheme, a fine-grained adaptation system composed of the proposed boostable repeater design and adaptive clock skew control is proposed, and demonstrated to mitigate process variation and aging induced timing degradations in a power as well as area efficient manner

inSense: A Variation and Fault Tolerant Architecture for Nanoscale Devices

Transistor technology scaling has been the driving force in improving the size, speed, and power consumption of digital systems. As devices approach atomic size, however, their reliability and performance are increasingly compromised due to reduced noise margins, difficulties in fabrication, and emergent nano-scale phenomena. Scaled CMOS devices, in particular, suffer from process variations such as random dopant fluctuation (RDF) and line edge roughness (LER), transistor degradation mechanisms such as negative-bias temperature instability (NBTI) and hot-carrier injection (HCI), and increased sensitivity to single event upsets (SEUs). Consequently, future devices may exhibit reduced performance, diminished lifetimes, and poor reliability. This research proposes a variation and fault tolerant architecture, the inSense architecture, as a circuit-level solution to the problems induced by the aforementioned phenomena. The inSense architecture entails augmenting circuits with introspective and sensory capabilities which are able to dynamically detect and compensate for process variations, transistor degradation, and soft errors. This approach creates ``smart\u27\u27 circuits able to function despite the use of unreliable devices and is applicable to current CMOS technology as well as next-generation devices using new materials and structures. Furthermore, this work presents an automated prototype implementation of the inSense architecture targeted to CMOS devices and is evaluated via implementation in ISCAS \u2785 benchmark circuits. The automated prototype implementation is functionally verified and characterized: it is found that error detection capability (with error windows from $\approx$30-400ps) can be added for less than 2\% area overhead for circuits of non-trivial complexity. Single event transient (SET) detection capability (configurable with target set-points) is found to be functional, although it generally tracks the standard DMR implementation with respect to overheads

Case Studies on Variation Tolerant and Low Power Design Using Planar Asymmetric Double Gate Transistor

In nanometer technologies, process variation control and low power have emerged as the first order design goal after high performance. Process variations cause high variability in performance and power consumption of an IC, which affects the overall yield. Short channel effects (SCEs) deteriorate the MOSFET performance and lead to higher leakage power. Double gate devices suppress SCEs and are potential candidates for replacing Bulk technology in nanometer nodes. Threshold voltage control in planar asymmetric double gate transistor (IGFET) using a fourth terminal provides an effective means of combating process variations and low power design. In this thesis, using various case studies, we analyzed the suitability of IGFET for variation control and low power design. We also performed an extensive comparison between IGFET and Bulk for reducing variability, improving yield and leakage power reduction using power gating. We also proposed a new circuit topology for IGFET, which on average shows 33.8 percent lower leakage and 34.9 percent lower area at the cost of 2.8 percent increase in total active mode power, for basic logic gates. Finally, we showed a technique for reducing leakage of minimum sized devices designed using new circuit topology for IGFET

Fbb Cmos Tapered Buffer With Optimal Vth Selection

This paper represents fixed body biased CMOS Tapered Buffer which is designed to minimize the PDP (Power Delay Product) of the circuit. CMOS Tapered Buffers are often used for driving large capacitive load at high speed. Since there are tradeoffs between performance parameters of Buffer for minimizing its PDP value and due to technology constraints on the threshold voltage of MOS; one can vary the Vth up to certain limit while keeping the VDD constant. The proposed work is helpful in designing power efficient CMOS Tapered Buffer. This is found that in proposed Buffer when Vth value for the first stage of inverter is taken between the range of (0.2VDD - 0.4 VDD), its performance gets improved in terms of power dissipation. This analysis is verified by simulating the 2-stage Tapered buffer using standard 180nm CMOS technology in Cadence environment. Analysis performed on the schematic shows that FBB (Fixed Body Bias) Tapered Buffer reduces the average power dissipation across capacitive load by 77% and static power has been reduced to 18.3% at very less penalty in delay. Hence the proposed approach is suitable in the design of low power buffer for increasing the current capability of logic gate at optimal speed

Reliability in the face of variability in nanometer embedded memories

In this thesis, we have investigated the impact of parametric variations on the behaviour of one performance-critical processor structure - embedded memories. As variations manifest as a spread in power and performance, as a first step, we propose a novel modeling methodology that helps evaluate the impact of circuit-level optimizations on architecture-level design choices. Choices made at the design-stage ensure conflicting requirements from higher-levels are decoupled. We then complement such design-time optimizations with a runtime mechanism that takes advantage of adaptive body-biasing to lower power whilst improving performance in the presence of variability. Our proposal uses a novel fully-digital variation tracking hardware using embedded DRAM (eDRAM) cells to monitor run-time changes in cache latency and leakage. A special fine-grain body-bias generator uses the measurements to generate an optimal body-bias that is needed to meet the required yield targets. A novel variation-tolerant and soft-error hardened eDRAM cell is also proposed as an alternate candidate for replacing existing SRAM-based designs in latency critical memory structures. In the ultra low-power domain where reliable operation is limited by the minimum voltage of operation (Vddmin), we analyse the impact of failures on cache functional margin and functional yield. Towards this end, we have developed a fully automated tool (INFORMER) capable of estimating memory-wide metrics such as power, performance and yield accurately and rapidly. Using the developed tool, we then evaluate the #effectiveness of a new class of hybrid techniques in improving cache yield through failure prevention and correction. Having a holistic perspective of memory-wide metrics helps us arrive at design-choices optimized simultaneously for multiple metrics needed for maintaining lifetime requirements

Monitor amb control strategies to reduce the impact of process variations in digital circuits

As CMOS technology scales down, Process, Voltage, Temperature and Ageing (PVTA) variations have an increasing impact on the performance and power consumption of electronic devices. These issues may hold back the continuous improvement of these devices in the near future. There are several ways to face the variability problem: to increase the operating margins of maximum clock frequency, the implementation of lithographic friendly layout styles, and the last one and the focus of this thesis, to adapt the circuit to its actual manufacturing and environment conditions by tuning some of the adjustable parameters once the circuit has been manufactured. The main challenge of this thesis is to develop a low-area variability compensation mechanism to automatically mitigate PVTA variations in run-time, i.e. while integrated circuit is running. This implies the development of a sensor to obtain the most accurate picture of variability, and the implementation of a control block to knob some of the electrical parameters of the circuit.A mesura que la tecnologia CMOS escala, les variacions de Procés, Voltatge, Temperatura i Envelliment (PVTA) tenen un impacte creixent en el rendiment i el consum de potència dels dispositius electrònics. Aquesta problemàtica podria arribar a frenar la millora contínua d'aquests dispositius en un futur proper. Hi ha diverses maneres d'afrontar el problema de la variabilitat: relaxar el marge de la freqüència màxima d'operació, implementar dissenys físics de xips més fàcils de litografiar, i per últim i com a tema principal d'aquesta tesi, adaptar el xip a les condicions de fabricació i d'entorn mitjançant la modificació d'algun dels seus paràmetres ajustables una vegada el circuit ja ha estat fabricat. El principal repte d'aquesta tesi és desenvolupar un mecanisme de compensació de variabilitat per tal de mitigar les variacions PVTA de manera automàtica en temps d'execució, és a dir, mentre el xip està funcionant. Això implica el desenvolupament d'un sensor capaç de mesurar la variabilitat de la manera més acurada possible, i la implementació d'un bloc de control que permeti l'ajust d'alguns dels paràmetres elèctrics dels circuits

Variability-driven module selection with joint design time optimization and post-silicon tuning

Abstract—Increasing delay and power variation are significant chal-lenges to the designers as technology scales to the deep sub-micron (DSM) regime. Traditional module selection techniques in high level synthesis use worst case delay/power information to perform the optimization, and therefore may be too pessimistic such that extra resources are used to guarantee design requirements. Parametric yield, which is defined as the probability of the synthesized hardware meeting the performance/power constraints, can be used to guide design space exploration. The para-metric yield can be effectively improved by combining both design-time variation-aware optimization and post silicon tuning techniques (such as adaptive body biasing (ABB)). In this paper, we propose a module selection algorithm that combines design-time optimization with post-silicon tuning (using ABB) to maximize design yield. A variation-aware module selection algorithm based on efficient performance and power yield gradient computation is developed. The post silicon optimization is formulated as an efficient sequential conic program to determine the optimal body bias distribution, which in turn affects design-time module selection. The experiment results show that significant yield can be achieved compared to traditional worst-case driven module selection technique. To the best of our knowledge, this is the first variability-driven high level synthesis technique that considers post-silicon tuning during design time optimization. 1 I

Parametric Yield of VLSI Systems under Variability: Analysis and Design Solutions

Variability has become one of the vital challenges that the designers of integrated circuits encounter. variability becomes increasingly important. Imperfect manufacturing process manifest itself as variations in the design parameters. These variations and those in the operating environment of VLSI circuits result in unexpected changes in the timing, power, and reliability of the circuits. With scaling transistor dimensions, process and environmental variations become significantly important in the modern VLSI design. A smaller feature size means that the physical characteristics of a device are more prone to these unaccounted-for changes. To achieve a robust design, the random and systematic fluctuations in the manufacturing process and the variations in the environmental parameters should be analyzed and the impact on the parametric yield should be addressed. This thesis studies the challenges and comprises solutions for designing robust VLSI systems in the presence of variations. Initially, to get some insight into the system design under variability, the parametric yield is examined for a small circuit. Understanding the impact of variations on the yield at the circuit level is vital to accurately estimate and optimize the yield at the system granularity. Motivated by the observations and results, found at the circuit level, statistical analyses are performed, and solutions are proposed, at the system level of abstraction, to reduce the impact of the variations and increase the parametric yield. At the circuit level, the impact of the supply and threshold voltage variations on the parametric yield is discussed. Here, a design centering methodology is proposed to maximize the parametric yield and optimize the power-performance trade-off under variations. In addition, the scaling trend in the yield loss is studied. Also, some considerations for design centering in the current and future CMOS technologies are explored. The investigation, at the circuit level, suggests that the operating temperature significantly affects the parametric yield. In addition, the yield is very sensitive to the magnitude of the variations in supply and threshold voltage. Therefore, the spatial variations in process and environmental variations make it necessary to analyze the yield at a higher granularity. Here, temperature and voltage variations are mapped across the chip to accurately estimate the yield loss at the system level. At the system level, initially the impact of process-induced temperature variations on the power grid design is analyzed. Also, an efficient verification method is provided that ensures the robustness of the power grid in the presence of variations. Then, a statistical analysis of the timing yield is conducted, by taking into account both the process and environmental variations. By considering the statistical profile of the temperature and supply voltage, the process variations are mapped to the delay variations across a die. This ensures an accurate estimation of the timing yield. In addition, a method is proposed to accurately estimate the power yield considering process-induced temperature and supply voltage variations. This helps check the robustness of the circuits early in the design process. Lastly, design solutions are presented to reduce the power consumption and increase the timing yield under the variations. In the first solution, a guideline for floorplaning optimization in the presence of temperature variations is offered. Non-uniformity in the thermal profiles of integrated circuits is an issue that impacts the parametric yield and threatens chip reliability. Therefore, the correlation between the total power consumption and the temperature variations across a chip is examined. As a result, floorplanning guidelines are proposed that uses the correlation to efficiently optimize the chip's total power and takes into account the thermal uniformity. The second design solution provides an optimization methodology for assigning the power supply pads across the chip for maximizing the timing yield. A mixed-integer nonlinear programming (MINLP) optimization problem, subject to voltage drop and current constraint, is efficiently solved to find the optimum number and location of the pads