2,825 research outputs found

    A stochastic wire-length distribution for gigascale integration (GSI). I. Derivation and validation

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    Avionics architecture studies for the entry research vehicle

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    This report is the culmination of a year-long investigation of the avionics architecture for NASA's Entry Research Vehicle (ERV). The Entry Research Vehicle is conceived to be an unmanned, autonomous spacecraft to be deployed from the Shuttle. It will perform various aerodynamic and propulsive maneuvers in orbit and land at Edwards AFB after a 5 to 10 hour mission. The design and analysis of the vehicle's avionics architecture are detailed here. The architecture consists of a central triply redundant ultra-reliable fault tolerant processor attached to three replicated and distributed MIL-STD-1553 buses for input and output. The reliability analysis is detailed here. The architecture was found to be sufficiently reliable for the ERV mission plan

    A high-level power model for MPSoC on FPGA

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    Real-time temperature estimation in a multiple device power electronics system subject to dynamic cooling

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    This paper presents a technique to estimate the temperature of each power electronic device in a thermally coupled, multiple device system subject to dynamic cooling. Using a demonstrator system, the thermal transfer impedance between pairs of devices is determined in the frequency domain for a quantised range of active cooling levels using a technique based on pseudorandom binary sequences. The technique is illustrated by application to the case temperatures of power devices. For each cooling level and pair of devices, a sixth order digital IIR filter is produced which can be used to directly estimate temperature from device input power. When the cooling level changes, the filters in use are substituted and the internal states of the old filters are converted for use in the new filter. Two methods for filter state conversion are developed—a computationally efficient method which is suited to infrequent changes in power dissipation and cooling, and a more accurate method which requires increased memory and processing capacity. Results show that the temperature can be estimated with low error using a system which is suitable for integration on an embedded processor
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