Delay Extraction Based Equivalent Elmore Model For RLC On-Chip Interconnects

As feature sizes for VLSI technology is shrinking, associated with higher operating frequency, signal integrity analysis of on-chip interconnects has become a real challenge for circuit designers. For this purpose, computer-aided-design (CAD) tools are necessary to simulate signal propagation of on-chip interconnects which has been an active area for research. Although SPICE models exist which can accurately predict signal degradation of interconnects, they are computationally expensive. As a result, more effective and analytic models for interconnects are required to capture the response at the output of high speed VLSI circuits. This thesis contributes to the development of efficient and closed form solution models for signal integrity analysis of on-chip interconnects. The proposed model uses a delay extraction algorithm to improve the accuracy of two-pole Elmore based models used in the analysis of on-chip distributed RLC interconnects. In the proposed scheme, the time of fight signal delay is extracted without increasing the number of poles or affecting the stability of the transfer function. This algorithm is used for both unit step and ramp inputs. From the delay rational approximation of the transfer function, analytic fitted expressions are obtained for the 50% delay and rise time for unit step input. The proposed algorithm is tested on point to point interconnections and tree structure networks. Numerical examples illustrate improved 50% delay and rise time estimates when compared to traditional Elmore based two-pole models

Parameterized macromodeling of passive and active dynamical systems

L'abstract è presente nell'allegato / the abstract is in the attachmen

Macromodeling CMOS circuits for timing simulation

Orginally presented as author's thesis (M.S.--Massachusetts Institute of Technology), 1987."References": p. 92-94.Supported by the U.S. Air Force grant AFOSR-86-0164Lynne Michelle Brocco

Modeling and simulation of VLSI interconnections with moments

Also issued as Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1989.Includes bibliographical references.Supported in part by the Joint Services Electronics Program. DAAL03-86-K-0002Steven Paul McCormick

Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines, Inc.Joint Services Electronics Program (Contract DAALO03-86-K-0002)U.S. Air Force - Office of Scientific Research (Grant AFOSR 86-0164)Rockwell International CorporationOKI SemiconductorU.S. Navy - Office of Naval Research (Contract N00014-81-K-0742)Charles Stark Draper LaboratoryDARPA/U.S. Navy - Office of Naval Research (Contract N00014-80-C-0622)DARPA/U.S. Navy - Office of Naval Research (Contract N00014-87-K-0825)National Science Foundation (Grant ECS-83-10941)AT&T Bell Laboratorie

SCEE 2008 book of abstracts : the 7th International Conference on Scientific Computing in Electrical Engineering (SCEE 2008), September 28 – October 3, 2008, Helsinki University of Technology, Espoo, Finland

This report contains abstracts of presentations given at the SCEE 2008 conference.reviewe

Advanced modelling and design considerations for interconnects in ultra- low power digital system

PhD ThesisAs Very Large Scale Integration (VLSI) is progressing in very Deep submicron (DSM) regime without decreasing chip area, the importance of global interconnects increases but at the cost of performance and power consumption for advanced System-on- Chip (SoC)s. However, the growing complexity of interconnects behaviour presents a challenge for their adequate modelling, whereby conventional circuit theoretic approaches cannot provide sufficient accuracy. During the last decades, fractional differential calculus has been successfully applied to modelling certain classes of dynamical systems while keeping complexity of the models under acceptable bounds. For example, fractional calculus can help capturing inherent physical effects in electrical networks in a compact form, without following conventional assumptions about linearization of non-linear interconnect components. This thesis tackles the problem of interconnect modelling in its generality to simulate a wide range of interconnection configurations, its capacity to emulate irregular circuit elements and its simplicity in the form of responsible approximation. This includes modelling and analysing interconnections considering their irregular components to add more flexibility and freedom for design. The aim is to achieve the simplest adaptable model with the highest possible accuracy. Thus, the proposed model can be used for fast computer simulation of interconnection behaviour. In addition, this thesis proposes a low power circuit for driving a global interconnect at voltages close to the noise level. As a result, the proposed circuit demonstrates a promising solution to address the energy and performance issues related to scaling effects on interconnects along with soft errors that can be caused by neutron particles. The major contributions of this thesis are twofold. Firstly, in order to address Ultra-Low Power (ULP) design limitations, a novel driver scheme has been configured. This scheme uses a bootstrap circuitry which boosts the driver’s ability to drive a long interconnect with an important feedback feature in it. Hence, this approach achieves two objectives: improving performance and mitigating power consumption. Those achievements are essential in designing ULP circuits along with occupying a smaller footprint and being immune to noise, observed in this design as well. These have been verified by comparing the proposed design to the previous and traditional circuits using a simulation tool. Additionally, the boosting based approach has been shown beneficial in mitigating the effects of single event upset (SEU)s, which are known to affect DSM circuits working under low voltages. Secondly, the CMOS circuit driving a distributed RLC load has been brought in its analysis into the fractional order domain. This model will make the on-chip interconnect structure easy to adjust by including the effect of fractional orders on the interconnect timing, which has not been considered before. A second-order model for the transfer functions of the proposed general structure is derived, keeping the complexity associated with second-order models for this class of circuits at a minimum. The approach here attaches an important trait of robustness to the circuit design procedure; namely, by simply adjusting the fractional order we can avoid modifying the circuit components. This can also be used to optimise the estimation of the system’s delay for a broad range of frequencies, particularly at the beginning of the design flow, when computational speed is of paramount importance.Iraqi Ministry of Higher Education and Scientific Researc

Substrate noise analysis and techniques for mitigation in mixed-signal RF systems

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Includes bibliographical references (p. 151-158).Mixed-signal circuit design has historically been a challenge for several reasons. Parasitic interactions between analog and digital systems on a single die are one such challenge. Switching transients induced by digital circuits inject noise into the common substrate creating substrate noise. Analog circuits lack the large noise margins of digital circuits, thus making them susceptible to substrate voltage variations. This problem is exacerbated at higher frequencies as the effectiveness of standard isolation technique diminishes considerably. Historically, substrate noise was not a problem because each system was fabricated in its own package shielding it from such interactions. The work in this thesis spans all areas of substrate noise: generation, propagation, and reception. A set of guidelines in designing isolation structures was developed to assist designers in optimizing these structures for a particular application. Furthermore, the effect of substrate noise on two key components of the RF front end, the voltage controlled oscillator (VCO) and the low noise amplifier (LNA), was analyzed. Finally, a CAD tool (SNAT) was developed to efficiently simulate large digital designs to determine substrate noise performance.(cont.) Existing techniques have prohibitively long simulation times and are only suitable for final verification. Determination of substrate noise coupling during the design phase would be extremely beneficial to circuit designers who can incorporate the effect of the noise and re-design accordingly before fabrication. This would reduce the turn around time for circuits and prevent costly redesign. SNAT can be used at any stage of the design cycle to accurately predict (less than 12% error when compared to measurements) the substrate noise performance of any digital circuit with a large degree of computational efficiency.by Nisha Checka.Ph.D