10,167 research outputs found
Test Slice Difference Technique for Low-Transition Test Data Compression
[[notice]]補正完畢[[incitationindex]]EI[[booktype]]電子
S-band antenna phased array communications system
The development of an S-band antenna phased array for spacecraft to spacecraft communication is discussed. The system requirements, antenna array subsystem design, and hardware implementation are examined. It is stated that the phased array approach offers the greatest simplicity and lowest cost. The objectives of the development contract are defined as: (1) design of a medium gain active phased array S-band communications antenna, (2) development and test of a model of a seven element planar array of radiating elements mounted in the appropriate cavity matrix, and (3) development and test of a breadboard transmit/receive microelectronics module
Reducing Switching Activity by Test Slice Difference Technique for Test Volume Compression
[[abstract]]This paper presents a test slice difference (TSD) technique to improve test data compression. It is an efficient method and only needs one scan cell. Consequently, hardware overhead is much lower than cyclical scan chains (CSR). As the complexity of VLSI continues to grow, excessive power supply noise has become seriously. We propose a new compression scheme which smooth down the switching activity and reduce the test data volume simultaneously.[[conferencetype]]國際[[conferencelocation]]Taipei, Taiwa
SoC Test: Trends and Recent Standards
The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper
A 32-GHz phased array transmit feed for spacecraft telecommunications
A 21-element phased array transmit feed was demonstrated as part of an effort to develop and evaluate state-of-the-art transmitter and receiver components at 32 and 34 GHz for future deep-space missions. Antenna pattern measurements demonstrating electronic beam steering of the two-dimensional array are reported and compared with predictions based on measured performance of MMIC-based phase shifter and amplifier modules and Vivaldi slotline radiating elements
The SWAP EUV Imaging Telescope Part I: Instrument Overview and Pre-Flight Testing
The Sun Watcher with Active Pixels and Image Processing (SWAP) is an EUV
solar telescope on board ESA's Project for Onboard Autonomy 2 (PROBA2) mission
launched on 2 November 2009. SWAP has a spectral bandpass centered on 17.4 nm
and provides images of the low solar corona over a 54x54 arcmin field-of-view
with 3.2 arcsec pixels and an imaging cadence of about two minutes. SWAP is
designed to monitor all space-weather-relevant events and features in the low
solar corona. Given the limited resources of the PROBA2 microsatellite, the
SWAP telescope is designed with various innovative technologies, including an
off-axis optical design and a CMOS-APS detector. This article provides
reference documentation for users of the SWAP image data.Comment: 26 pages, 9 figures, 1 movi
Vertex-Detector R&D for CLIC
A detector concept based on hybrid planar pixel-detector technology is under
development for the CLIC vertex detector. It comprises fast, low-power and
small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix)
coupled to ultra-thin sensors via low-mass interconnects. The power dissipation
of the readout chips is reduced by means of power pulsing, allowing for a
cooling system based on forced gas flow. In this paper the CLIC vertex-detector
requirements are reviewed and the current status of R&D on sensors, readout and
detector integration is presented.Comment: 12 pages, 7 figures. Talk presented at the 13th Topical Seminar on
Innovative Particle and Radiation Detectors (IPRD13), 7 - 10 October 2013,
Siena, Ital
Polymeric Microsensors for Intraoperative Contact Pressure Measurement
Biocompatible sensors have been demonstrated using traditional microfabrication techniques modified for polymer substrates and utilize only materials suitable for implantation or bodily contact. Sensor arrays for the measurement of the load condition of polyethylene spacers in the total knee arthroplasty (TKA) prosthesis have been developed. Arrays of capacitive sensors are used to determine the three-dimensional strain within the polyethylene prosthesis component. Data from these sensors can be used to give researchers a better understanding of component motion, loading, and wear phenomena for a large range of activities. This dissertation demonstrates both analytically and experimentally the fabrication of these sensor arrays using biocompatible polymer substrates and dielectrics while preserving industry-standard microfabrication processing for micron-level resolution.
An array of sensors for real-time measurement of pressure profiles is the long-term goal of this research. A custom design using capacitive-based sensors is an excellent selection for such measurement, giving high spatial resolution across the sensing surface and high load resolution for pressures applied normal to that surface while operating at low power
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