424 research outputs found

    Coalescing Cellular Automata

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    We say that a Cellular Automata (CA) is coalescing when its execution on two distinct (random) initial configurations in the same asynchronous mode (the same cells are updated in each configuration at each time step) makes both configurations become identical after a reasonable time. We prove coalescence for two elementary rules and show that there exists infinitely many coalescing CA. We then conduct an experimental study on all elementary CA and show that some rules exhibit a phase transition, which belongs to the universality class of directed percolation

    Invariant Measures and Convergence for Cellular Automaton 184 and Related Processes

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    For a class of one-dimensional cellular automata, we review and complete the characterization of the invariant measures (in particular, all invariant phase separation measures), the rate of convergence to equilibrium, and the derivation of the hydrodynamic limit. The most widely known representatives of this class of automata are: Automaton 184 from the classification of S. Wolfram, an annihilating particle system and a surface growth model.Comment: 18 page

    Asynchronism Induces Second Order Phase Transitions in Elementary Cellular Automata

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    Cellular automata are widely used to model natural or artificial systems. Classically they are run with perfect synchrony, i.e., the local rule is applied to each cell at each time step. A possible modification of the updating scheme consists in applying the rule with a fixed probability, called the synchrony rate. For some particular rules, varying the synchrony rate continuously produces a qualitative change in the behaviour of the cellular automaton. We investigate the nature of this change of behaviour using Monte-Carlo simulations. We show that this phenomenon is a second-order phase transition, which we characterise more specifically as belonging to the directed percolation or to the parity conservation universality classes studied in statistical physics

    Subcritical behavior in the alternating supercritical Domany-Kinzel dynamics

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    Cellular automata are widely used to model real-world dynamics. We show using the Domany-Kinzel probabilistic cellular automata that alternating two supercritical dynamics can result in subcritical dynamics in which the population dies out. The analysis of the original and reduced models reveals generality of this paradoxical behavior, which suggests that autonomous or man-made periodic or random environmental changes can cause extinction in otherwise safe population dynamics. Our model also realizes another scenario for the Parrondo's paradox to occur, namely, spatial extensions.Comment: 8 figure

    Level set implementation for the simulation of anisotropic etching: application to complex MEMS micromachining

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    The use of atomistic methods, such as the continuous cellular automaton (CCA), is currently regarded as an accurate and efficient approach for the simulation of anisotropic etching in the development of micro-electro-mechanical systems (MEMS). However, whenever the targeted etching condition is modified (e. g. by changing the substrate material, etchant type, concentration and/or temperature) this approach requires performing a time-consuming recalibration of the full set of internal atomistic rates defined within the method. Based on the level set (LS) approach as an alternative and using the experimental data directly as input, we present a fully operational simulator that exhibits similar accuracy to the latest CCA models. The proposed simulator is tested by describing a wide range of silicon and quartz MEMS structures obtained in different etchants through complex processes, including double-sided etching as well as different mask patterns during different etching steps and/or simultaneous masking materials on different regions of the substrate. The results demonstrate that the LS method is able to simulate anisotropic etching for complex MEMS processes with similar computational times and accuracy as the atomistic models.This work has been supported by the Spanish FPI-MICINN BES-2011-045940 grant and the Ramon y Cajal Fellowship Program by the Spanish Ministry of Science and Innovation. Also, we acknowledge support by the JAE-Doc grant from the Junta para la Ampliacion de Estudios program co-funded by FSE and the Professor Partnership Program by NVIDIA Corporation.Montoliu, C.; Ferrando Jódar, N.; Gosalvez Ayuso, MA.; Cerdá Boluda, J.; Colom Palero, RJ. (2013). Level set implementation for the simulation of anisotropic etching: application to complex MEMS micromachining. Journal of Micromechanics and Microengineering. 23(7). https://doi.org/10.1088/0960-1317/23/7/075017S237Weirauch, D. F. (1975). Correlation of the anisotropic etching of single−crystal silicon spheres and wafers. Journal of Applied Physics, 46(4), 1478-1483. doi:10.1063/1.321787Seidel, H. (1990). Anisotropic Etching of Crystalline Silicon in Alkaline Solutions. Journal of The Electrochemical Society, 137(11), 3612. doi:10.1149/1.2086277Zielke, D., & Frühauf, J. (1995). Determination of rates for orientation-dependent etching. Sensors and Actuators A: Physical, 48(2), 151-156. doi:10.1016/0924-4247(95)00993-0Wind, R. A., & Hines, M. A. (2000). Macroscopic etch anisotropies and microscopic reaction mechanisms: a micromachined structure for the rapid assay of etchant anisotropy. Surface Science, 460(1-3), 21-38. doi:10.1016/s0039-6028(00)00479-9Gosálvez, M. A., Sato, K., Foster, A. S., Nieminen, R. M., & Tanaka, H. (2007). An atomistic introduction to anisotropic etching. Journal of Micromechanics and Microengineering, 17(4), S1-S26. doi:10.1088/0960-1317/17/4/s01Sato, K., Shikida, M., Matsushima, Y., Yamashiro, T., Asaumi, K., Iriye, Y., & Yamamoto, M. (1998). Characterization of orientation-dependent etching properties of single-crystal silicon: effects of KOH concentration. Sensors and Actuators A: Physical, 64(1), 87-93. doi:10.1016/s0924-4247(97)01658-0Zubel, I., & Kramkowska, M. (2002). The effect of alcohol additives on etching characteristics in KOH solutions. Sensors and Actuators A: Physical, 101(3), 255-261. doi:10.1016/s0924-4247(02)00265-0Charbonnieras, A. R., & Tellier, C. R. (1999). Characterization of the anisotropic chemical attack of {hk0} silicon plates in a T.M.A.H. solution. Sensors and Actuators A: Physical, 77(2), 81-97. doi:10.1016/s0924-4247(99)00020-5Shikida, M., Sato, K., Tokoro, K., & Uchikawa, D. (2000). Differences in anisotropic etching properties of KOH and TMAH solutions. Sensors and Actuators A: Physical, 80(2), 179-188. doi:10.1016/s0924-4247(99)00264-2Gosálvez, M. A., Zubel, I., & Viinikka, E. (2010). Wet Etching of Silicon. Handbook of Silicon Based MEMS Materials and Technologies, 375-407. doi:10.1016/b978-0-8155-1594-4.00024-3Pal, P., Gosalvez, M. A., & Sato, K. (2010). Silicon Micromachining Based on Surfactant-Added Tetramethyl Ammonium Hydroxide: Etching Mechanism and Advanced Applications. Japanese Journal of Applied Physics, 49(5), 056702. doi:10.1143/jjap.49.056702Zubel, I., & Kramkowska, M. (2004). Etch rates and morphology of silicon (h k l) surfaces etched in KOH and KOH saturated with isopropanol solutions. Sensors and Actuators A: Physical, 115(2-3), 549-556. doi:10.1016/j.sna.2003.11.010Fruhauf, J., Trautmann, K., Wittig, J., & Zielke, D. (1993). A simulation tool for orientation dependent etching. Journal of Micromechanics and Microengineering, 3(3), 113-115. doi:10.1088/0960-1317/3/3/004Than, O., & Büttgenbach, S. (1994). Simulation of anisotropic chemical etching of crystalline silicon using a cellular automata model. Sensors and Actuators A: Physical, 45(1), 85-89. doi:10.1016/0924-4247(94)00820-5Camon, H., Gue, A. M., Danel, J. S., & Djafari-Rouhani, M. (1992). Modelling of anisotropic etching in silicon-based sensor application. Sensors and Actuators A: Physical, 33(1-2), 103-105. doi:10.1016/0924-4247(92)80237-wGosalvez, M. ., Nieminen, R. ., Kilpinen, P., Haimi, E., & Lindroos, V. (2001). Anisotropic wet chemical etching of crystalline silicon: atomistic Monte-Carlo simulations and experiments. Applied Surface Science, 178(1-4), 7-26. doi:10.1016/s0169-4332(01)00233-1Zhenjun Zhu, & Chang Liu. (2000). Micromachining process simulation using a continuous cellular automata method. Journal of Microelectromechanical Systems, 9(2), 252-261. doi:10.1109/84.846706Gosalvez, M. A., Yan Xing, & Sato, K. (2008). Analytical Solution of the Continuous Cellular Automaton for Anisotropic Etching. Journal of Microelectromechanical Systems, 17(2), 410-431. doi:10.1109/jmems.2008.916339Ferrando, N., Gosálvez, M. A., Cerdá, J., Gadea, R., & Sato, K. (2011). Faster and exact implementation of the continuous cellular automaton for anisotropic etching simulations. Journal of Micromechanics and Microengineering, 21(2), 025021. doi:10.1088/0960-1317/21/2/025021Ferrando, N., Gosálvez, M. A., Cerdá, J., Gadea, R., & Sato, K. (2011). Octree-based, GPU implementation of a continuous cellular automaton for the simulation of complex, evolving surfaces. Computer Physics Communications, 182(3), 628-640. doi:10.1016/j.cpc.2010.11.004Moktadir, Z., & Camon, H. (1997). Monte Carlo simulation of anisotropic etching of silicon: investigation of surface properties. Modelling and Simulation in Materials Science and Engineering, 5(5), 481-488. doi:10.1088/0965-0393/5/5/004Flidr, J., Huang, Y.-C., & Hines, M. A. (1999). An atomistic mechanism for the production of two- and three-dimensional etch hillocks on Si(111) surfaces. The Journal of Chemical Physics, 111(15), 6970-6981. doi:10.1063/1.479990Gos lvez, M. A., & Nieminen, R. M. (2003). Surface morphology during anisotropic wet chemical etching of crystalline silicon. New Journal of Physics, 5, 100-100. doi:10.1088/1367-2630/5/1/400Xing, Y., Gosálvez, M. A., Sato, K., Tian, M., & Yi, H. (2012). Evolutionary determination of kinetic Monte Carlo rates for the simulation of evolving surfaces in anisotropic etching of silicon. Journal of Micromechanics and Microengineering, 22(8), 085020. doi:10.1088/0960-1317/22/8/085020Xing, Y., Gosálvez, M. A., Sato, K., & Yi, H. (2009). Orientation-dependent surface morphology of crystalline silicon during anisotropic etching using a continuous cellular automaton. Journal of Micromechanics and Microengineering, 20(1), 015019. doi:10.1088/0960-1317/20/1/015019Zhou, Z., Huang, Q., Li, W., & Deng, W. (2007). A cellular automaton-based simulator for silicon anisotropic etching processes considering high index planes. Journal of Micromechanics and Microengineering, 17(4), S38-S49. doi:10.1088/0960-1317/17/4/s03Gosálvez, M. A., Xing, Y., Sato, K., & Nieminen, R. M. (2009). Discrete and continuous cellular automata for the simulation of propagating surfaces. Sensors and Actuators A: Physical, 155(1), 98-112. doi:10.1016/j.sna.2009.08.012Ferrando, N., Gosálvez, M. A., & Colóm, R. J. (2012). Evolutionary continuous cellular automaton for the simulation of wet etching of quartz. Journal of Micromechanics and Microengineering, 22(2), 025021. doi:10.1088/0960-1317/22/2/025021Osher, S., & Sethian, J. A. (1988). Fronts propagating with curvature-dependent speed: Algorithms based on Hamilton-Jacobi formulations. Journal of Computational Physics, 79(1), 12-49. doi:10.1016/0021-9991(88)90002-2Adalsteinsson, D., & Sethian, J. A. (1995). A Level Set Approach to a Unified Model for Etching, Deposition, and Lithography I: Algorithms and Two-Dimensional Simulations. Journal of Computational Physics, 120(1), 128-144. doi:10.1006/jcph.1995.1153Adalsteinsson, D., & Sethian, J. A. (1995). A Level Set Approach to a Unified Model for Etching, Deposition, and Lithography II: Three-Dimensional Simulations. Journal of Computational Physics, 122(2), 348-366. doi:10.1006/jcph.1995.1221Adalsteinsson, D., & Sethian, J. A. (1997). A Level Set Approach to a Unified Model for Etching, Deposition, and Lithography. Journal of Computational Physics, 138(1), 193-223. doi:10.1006/jcph.1997.5817Ertl, O., & Selberherr, S. (2009). A fast level set framework for large three-dimensional topography simulations. Computer Physics Communications, 180(8), 1242-1250. doi:10.1016/j.cpc.2009.02.002Ertl, O., & Selberherr, S. (2010). Three-dimensional level set based Bosch process simulations using ray tracing for flux calculation. Microelectronic Engineering, 87(1), 20-29. doi:10.1016/j.mee.2009.05.011Burzynski, T., & Papini, M. (2010). Level set methods for the modelling of surface evolution in the abrasive jet micromachining of features used in MEMS and microfluidic devices. Journal of Micromechanics and Microengineering, 20(8), 085004. doi:10.1088/0960-1317/20/8/085004Radjenović, B., Lee, J. K., & Radmilović-Radjenović, M. (2006). Sparse field level set method for non-convex Hamiltonians in 3D plasma etching profile simulations. Computer Physics Communications, 174(2), 127-132. doi:10.1016/j.cpc.2005.09.010Radjenović, B., Radmilović-Radjenović, M., & Mitrić, M. (2006). Nonconvex Hamiltonians in three dimensional level set simulations of the wet etching of silicon. Applied Physics Letters, 89(21), 213102. doi:10.1063/1.2388860Branislav, R., & Marija, R.-R. (2010). Level set simulations of the anisotropic wet etching process for device fabrication in nanotechnologies. Hemijska industrija, 64(2), 93-97. doi:10.2298/hemind100205008rRadjenović, B., Radmilović-Radjenović, M., & Mitrić, M. (2010). Level Set Approach to Anisotropic Wet Etching of Silicon. Sensors, 10(5), 4950-4967. doi:10.3390/s100504950Radjenović, B., & Radmilović-Radjenović, M. (2011). Three-Dimensional Simulations of the Anisotropic Etching Profile Evolution for Producing Nanoscale Devices. Acta Physica Polonica A, 119(3), 447-450. doi:10.12693/aphyspola.119.447Crandall, M. G., & Lions, P.-L. (1984). Two approximations of solutions of Hamilton-Jacobi equations. Mathematics of Computation, 43(167), 1-1. doi:10.1090/s0025-5718-1984-0744921-8Whitaker, R. T. (1998). International Journal of Computer Vision, 29(3), 203-231. doi:10.1023/a:1008036829907Gomes, J., & Faugeras, O. (2000). Reconciling Distance Functions and Level Sets. Journal of Visual Communication and Image Representation, 11(2), 209-223. doi:10.1006/jvci.1999.0439Fukuzawa, K., Terada, S., Shikida, M., Amakawa, H., Zhang, H., & Mitsuya, Y. (2007). Mechanical design and force calibration of dual-axis micromechanical probe for friction force microscopy. Journal of Applied Physics, 101(3), 034308. doi:10.1063/1.2434825Schröpfer, G., Labachelerie, M. de, Ballandras, S., & Blind, P. (1998). Collective wet etching of a 3D monolithic silicon seismic mass system. Journal of Micromechanics and Microengineering, 8(2), 77-79. doi:10.1088/0960-1317/8/2/008Wilke, N., Reed, M. L., & Morrissey, A. (2006). The evolution from convex corner undercut towards microneedle formation: theory and experimental verification. Journal of Micromechanics and Microengineering, 16(4), 808-814. doi:10.1088/0960-1317/16/4/018Liang, J., Kohsaka, F., Matsuo, T., & Ueda, T. (2007). Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Applications. IEEJ Transactions on Sensors and Micromachines, 127(7), 337-342. doi:10.1541/ieejsmas.127.337Hida, H., Shikida, M., Fukuzawa, K., Murakami, S., Sato, K., Asaumi, K., … Sato, K. (2008). Fabrication of a quartz tuning-fork probe with a sharp tip for AFM systems. Sensors and Actuators A: Physical, 148(1), 311-318. doi:10.1016/j.sna.2008.08.02

    Implementation and evaluation of the Level Set method: towards efficient and accurate simulation of wet etching for microengineering applications

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    The use of atomistic methods, such as the Continuous Cellular Automaton (CCA), is currently regarded as a computationally efficient and experimentally accurate approach for the simulation of anisotropic etching of various substrates in the manufacture of Micro-electro-mechanical Systems (MEMS). However, when the features of the chemical process are modified, a time-consuming calibration process needs to be used to transform the new macroscopic etch rates into a corresponding set of atomistic rates. Furthermore, changing the substrate requires a labor-intensive effort to reclassify most atomistic neighborhoods. In this context, the Level Set (LS) method provides an alternative approach where the macroscopic forces affecting the front evolution are directly applied at the discrete level, thus avoiding the need for reclassification and/or calibration. Correspondingly, we present a fully-operational Sparse Field Method (SFM) implementation of the LS approach, discussing in detail the algorithm and providing a thorough characterization of the computational cost and simulation accuracy, including a comparison to the performance by the most recent CCA model. We conclude that the SFM implementation achieves similar accuracy as the CCA method with less fluctuations in the etch front and requiring roughly 4 times less memory. Although SFM can be up to 2 times slower than CCA for the simulation of anisotropic etchants, it can also be up to 10 times faster than CCA for isotropic etchants. In addition, we present a parallel, GPU-based implementation (gSFM) and compare it to an optimized, multicore CPU version (cSFM), demonstrating that the SFM algorithm can be successfully parallelized and the simulation times consequently reduced, while keeping the accuracy of the simulations. Although modern multicore CPUs provide an acceptable option, the massively parallel architecture of modern GPUs is more suitable, as reflected by computational times for gSFM up to 7.4 times faster than for cSFM. (c) 2013 Elsevier B.V. All rights reserved.We thank the anonymous reviewers for their valuable comments and suggestions. This work has been supported by the Spanish FPI-MICINN BES-2011-045940 grant and the Ramon y Cajal Fellowship Program by the Spanish Ministry of Science and Innovation. Also, we acknowledge support by the JAE-Doc grant from the Junta para la Ampliacion de Estudios program co-funded by FSE and the Professor Partnership Program by NVIDIA Corporation.Montoliu Álvaro, C.; Ferrando Jódar, N.; Gosalvez, MÁ.; Cerdá Boluda, J.; Colom Palero, RJ. (2013). Implementation and evaluation of the Level Set method: towards efficient and accurate simulation of wet etching for microengineering applications. Computer Physics Communications. 184(10):2299-2309. https://doi.org/10.1016/j.cpc.2013.05.016S229923091841
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