Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors

[ES] Los procesadores multinúcleo actuales cuentan con recursos compartidos entre los diferentes núcleos. Dos de estos recursos compartidos, la cache de último nivel y el ancho de banda de memoria principal, pueden convertirse en cuellos de botella para el rendimiento. Además, con el crecimiento del número de núcleos que implementan los diseños más recientes, la red dentro del chip también se convierte en un cuello de botella que puede afectar negativamente al rendimiento, ya que las redes tradicionales pueden encontrar limitaciones a su escalabilidad en el futuro cercano. Prácticamente la totalidad de los diseños actuales implementan jerarquías de memoria que se comunican mediante rápidas redes de interconexión. Esta organización es eficaz dado que permite reducir el número de accesos que se realizan a memoria principal y la latencia media de acceso a memoria. Las caches, la red de interconexión y la memoria principal, conjuntamente con otras técnicas conocidas como la prebúsqueda, permiten reducir las enormes latencias de acceso a memoria principal, limitando así el impacto negativo ocasionado por la diferencia de rendimiento existente entre los núcleos de cómputo y la memoria. Sin embargo, compartir los recursos mencionados es fuente de diferentes problemas y retos, siendo uno de los principales el manejo de la interferencia entre aplicaciones. Hacer un uso eficiente de la jerarquía de memoria y las caches, así como contar con una red de interconexión apropiada, es necesario para sostener el crecimiento del rendimiento en los diseños tanto actuales como futuros. Esta tesis analiza y estudia los principales problemas e inconvenientes observados en estos dos recursos: la cache de último nivel y la red dentro del chip. En primer lugar, se estudia la escalabilidad de las tradicionales redes dentro del chip con topología de malla, así como esta puede verse comprometida en próximos diseños que cuenten con mayor número de núcleos. Los resultados de este estudio muestran que, a mayor número de núcleos, el impacto negativo de la distancia entre núcleos en la latencia puede afectar seriamente al rendimiento del procesador. Como solución a este problema, en esta tesis proponemos una de red de interconexión óptica modelada en un entorno de simulación detallado, que supone una solución viable a los problemas de escalabilidad observados en los diseños tradicionales. A continuación, esta tesis dedica un esfuerzo importante a identificar y proponer soluciones a los principales problemas de diseño de las jerarquías de memoria actuales como son, por ejemplo, el sobredimensionado del espacio de cache privado, la existencia de réplicas de datos y rigidez e incapacidad de adaptación de las estructuras de cache. Aunque bien conocidos, estos problemas y sus efectos adversos en el rendimiento pueden ser evitados en procesadores de alto rendimiento gracias a la enorme capacidad de la cache de último nivel que este tipo de procesadores típicamente implementan. Sin embargo, en procesadores de bajo consumo, no existe la posibilidad de contar con tales capacidades y hacer un uso eficiente del espacio disponible es crítico para mantener el rendimiento. Como solución a estos problemas en procesadores de bajo consumo, proponemos una novedosa organización de jerarquía de dos niveles cache que utiliza una red de interconexión óptica. Los resultados obtenidos muestran que, comparado con diseños convencionales, el consumo de energía estática en la arquitectura propuesta es un 60% menor, pese a que los resultados de rendimiento presentan valores similares. Por último, hemos extendido la arquitectura propuesta para dar soporte tanto a aplicaciones paralelas como secuenciales. Los resultados obtenidos con la esta nueva arquitectura muestran un ahorro de hasta el 78 % de energía estática en la ejecución de aplicaciones paralelas.[CA] Els processadors multinucli actuals compten amb recursos compartits entre els diferents nuclis. Dos d'aquests recursos compartits, la memòria d’últim nivell i l'ample de banda de memòria principal, poden convertir-se en colls d'ampolla per al rendiment. A mes, amb el creixement del nombre de nuclis que implementen els dissenys mes recents, la xarxa dins del xip també es converteix en un coll d'ampolla que pot afectar negativament el rendiment, ja que les xarxes tradicionals poden trobar limitacions a la seva escalabilitat en el futur proper. Pràcticament la totalitat dels dissenys actuals implementen jerarquies de memòria que es comuniquen mitjançant rapides xarxes d’interconnexió. Aquesta organització es eficaç ates que permet reduir el nombre d'accessos que es realitzen a memòria principal i la latència mitjana d’accés a memòria. Les caches, la xarxa d’interconnexió i la memòria principal, conjuntament amb altres tècniques conegudes com la prebúsqueda, permeten reduir les enormes latències d’accés a memòria principal, limitant així l'impacte negatiu ocasionat per la diferencia de rendiment existent entre els nuclis de còmput i la memòria. No obstant això, compartir els recursos esmentats és font de diversos problemes i reptes, sent un dels principals la gestió de la interferència entre aplicacions. Fer un us eficient de la jerarquia de memòria i les caches, així com comptar amb una xarxa d’interconnexió apropiada, es necessari per sostenir el creixement del rendiment en els dissenys tant actuals com futurs. Aquesta tesi analitza i estudia els principals problemes i inconvenients observats en aquests dos recursos: la memòria cache d’últim nivell i la xarxa dins del xip. En primer lloc, s'estudia l'escalabilitat de les xarxes tradicionals dins del xip amb topologia de malla, així com aquesta es pot veure compromesa en propers dissenys que compten amb major nombre de nuclis. Els resultats d'aquest estudi mostren que, a major nombre de nuclis, l'impacte negatiu de la distància entre nuclis en la latència pot afectar seriosament al rendiment del processador. Com a solució' a aquest problema, en aquesta tesi proposem una xarxa d’interconnexió' òptica modelada en un entorn de simulació detallat, que suposa una solució viable als problemes d'escalabilitat observats en els dissenys tradicionals. A continuació, aquesta tesi dedica un esforç important a identificar i proposar solucions als principals problemes de disseny de les jerarquies de memòria actuals com son, per exemple, el sobredimensionat de l'espai de memòria cache privat, l’existència de repliques de dades i la rigidesa i incapacitat d’adaptació' de les estructures de memòria cache. Encara que ben coneguts, aquests problemes i els seus efectes adversos en el rendiment poden ser evitats en processadors d'alt rendiment gracies a l'enorme capacitat de la memòria cache d’últim nivell que aquest tipus de processadors típicament implementen. No obstant això, en processadors de baix consum, no hi ha la possibilitat de comptar amb aquestes capacitats, i fer un us eficient de l'espai disponible es torna crític per mantenir el rendiment. Com a solució a aquests problemes en processadors de baix consum, proposem una nova organització de jerarquia de dos nivells de memòria cache que utilitza una xarxa d’interconnexió òptica. Els resultats obtinguts mostren que, comparat amb dissenys convencionals, el consum d'energia estàtica en l'arquitectura proposada és un 60% menor, malgrat que els resultats de rendiment presenten valors similars. Per últim, hem estes l'arquitectura proposada per donar suport tant a aplicacions paral·leles com seqüencials. Els resultats obtinguts amb aquesta nova arquitectura mostren un estalvi de fins al 78 % d'energia estàtica en l’execució d'aplicacions paral·leles.[EN] Current multicores face the challenge of sharing resources among the different processor cores. Two main shared resources act as major performance bottlenecks in current designs: the off-chip main memory bandwidth and the last level cache. Additionally, as the core count grows, the network on-chip is also becoming a potential performance bottleneck, since traditional designs may find scalability issues in the near future. Memory hierarchies communicated through fast interconnects are implemented in almost every current design as they reduce the number of off-chip accesses and the overall latency, respectively. Main memory, caches, and interconnection resources, together with other widely-used techniques like prefetching, help alleviate the huge memory access latencies and limit the impact of the core-memory speed gap. However, sharing these resources brings several concerns, being one of the most challenging the management of the inter-application interference. Since almost every running application needs to access to main memory, all of them are exposed to interference from other co-runners in their way to the memory controller. For this reason, making an efficient use of the available cache space, together with achieving fast and scalable interconnects, is critical to sustain the performance in current and future designs. This dissertation analyzes and addresses the most important shortcomings of two major shared resources: the Last Level Cache (LLC) and the Network on Chip (NoC). First, we study the scalability of both electrical and optical NoCs for future multicoresand many-cores. To perform this study, we model optical interconnects in a cycle-accurate multicore simulation framework. A proper model is required; otherwise, important performance deviations may be observed otherwise in the evaluation results. The study reveals that, as the core count grows, the effect of distance on the end-to-end latency can negatively impact on the processor performance. In contrast, the study also shows that silicon nanophotonics are a viable solution to solve the mentioned latency problems. This dissertation is also motivated by important design concerns related to current memory hierarchies, like the oversizing of private cache space, data replication overheads, and lack of flexibility regarding sharing of cache structures. These issues, which can be overcome in high performance processors by virtue of huge LLCs, can compromise performance in low power processors. To address these issues we propose a more efficient cache hierarchy organization that leverages optical interconnects. The proposed architecture is conceived as an optically interconnected two-level cache hierarchy composed of multiple cache modules that can be dynamically turned on and off independently. Experimental results show that, compared to conventional designs, static energy consumption is improved by up to 60% while achieving similar performance results. Finally, we extend the proposal to support both sequential and parallel applications. This extension is required since the proposal adapts to the dynamic cache space needs of the running applications, and multithreaded applications's behaviors widely differ from those of single threaded programs. In addition, coherence management is also addressed, which is challenging since each cache module can be assigned to any core at a given time in the proposed approach. For parallel applications, the evaluation shows that the proposal achieves up to 78% static energy savings. In summary, this thesis tackles major challenges originated by the sharing of on-chip caches and communication resources in current multicores, and proposes new cache hierarchy organizations leveraging optical interconnects to address them. The proposed organizations reduce both static and dynamic energy consumption compared to conventional approaches while achieving similar performance; which results in better energy efficiency.Puche Lara, J. (2021). Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/165254TESI

FOS: a low-power cache organization for multicores

[EN] The cache hierarchy of current multicore processors typically consists of one or two levels of private caches per core and a large shared last-level cache. This approach incurs area and energy wasting due to oversizing the private cache space, data replication through the inclusive cache levels, as well as the use of highly set-associative caches. In this paper, we claim that although this is the commonly adopted approach, it presents important design issues that can be addressed by a more energy efficient organization. This work proposes Flat On-chip Storage (FOS), a novel cache organization that, aimed at addressing energy and area on low-power processors, resolves the mentioned issues. For this purpose, FOS combines L2 and L3 cache levels into a single one, organized as a flat space, and composed of a pool of private small cache slices. These slices are initially powered off to save energy, and they are powered on and assigned to cores provided that the system performance is expected to improve. To provide fast and uniform access from the private L1 caches to the FOS's cache slices, multiple architectural challenges are overcome, which entails the design of a custom optical network-on-chip. Experimental results show that FOS achieves significant energy savings on both static and dynamic energy over conventional cache organizations with the same storage capacity. FOS static energy savings are as much as 60% over an electrically connected shared cache; these savings grow up to 75% compared to optically connected baselines. Moreover, despite deactivating part of the cache space, FOS achieves similar performance values as those achieved by conventional approaches.Puche-Lara, J.; Petit Martí, SV.; Sahuquillo Borrás, J.; Gómez Requena, ME. (2019). FOS: a low-power cache organization for multicores. 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Interconnects architectures for many-core era using surface-wave communication

PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has emerged aiming to address on-chip communication challenges and to satisfy interconnection demands for chip-multiprocessors (CMPs). Nonetheless, there is continuous demand for even higher computational power, which is leading to a relentless downscaling of CMOS technology to enable the integration of many-cores. However, technology downscaling is in favour of the gate nodes over wires in terms of latency and power consumption. Consequently, this has led to the era of many-core processors where power consumption and performance are governed by inter-core communications rather than core computation. Therefore, NoCs need to evolve from being merely metalbased implementations which threaten to be a performance and power bottleneck for many-core efficiency and scalability. To overcome such intensified inter-core communication challenges, this thesis proposes a novel interconnect technology: the surface-wave interconnect (SWI). This new RF-based on-chip interconnect has notable characteristics compared to cutting-edge on-chip interconnects in terms of CMOS compatibility, high speed signal propagation, low power dissipation, and massive signal fan-out. Nonetheless, the realization of the SWI requires investigations at different levels of abstraction, such as the device integration and RF engineering levels. The aim of this thesis is to address the networking and system level challenges and highlight the potential of this interconnect. This should encourage further research at other levels of abstraction. Two specific system-level challenges crucial in future many-core systems are tackled in this study, which are cross-the-chip global communication and one-to-many communication. This thesis makes four major contributions towards this aim. The first is reducing the NoC average-hop count, which would otherwise increase packet-latency exponentially, by proposing a novel hybrid interconnect architecture. This hybrid architecture can not only utilize both regular metal-wire and SWI, but also exploits merits of both bus and NoC architectures in terms of connectivity compared to other general-purpose on-chip interconnect architectures. The second contribution addresses global communication issues by developing a distance-based weighted-round-robin arbitration (DWA) algorithm. This technique prioritizes global communication to be send via SWI short-cuts, which offer more efficient power dissipation and faster across-the-chip signal propagation. Results obtained using a cycleaccurate simulator demonstrate the effectiveness of the proposed system architecture in terms of significant power reduction, considervii able average delay reduction and higher throughput compared to a regular NoC. The third contribution is in handling multicast communications, which are normally associated with traffic overload, hotspots and deadlocks and therefore increase, by an order of magnitude the power consumption and latency. This has been achieved by proposing a novel routing and centralized arbitration schemes that exploits the SWI0s remarkable fan-out features. The evaluation demonstrates drastic improvements in the effectiveness of the proposed architecture in terms of power consumption ( 2-10x) and performance ( 22x) but with negligible hardware overheads ( 2%). The fourth contribution is to further explore multicast contention handling in a flexible decentralized manner, where original techniques such as stretch-multicast and ID-tagging flow control have been developed. A comparison of these techniques shows that the decentralized approach is superior to the centralized approach with low traffic loads, while the latter outperforms the former near and after NoC saturation

Next Generation Silicon Photonic Transceiver: From Device Innovation to System Analysis

Silicon photonics is recognized as a disruptive technology that has the potential to reshape many application areas, for example, data center communication, telecommunications, high-performance computing, and sensing. The key capability that silicon photonics offers is to leverage CMOS-style design, fabrication, and test infrastructure to build compact, energy-efficient, and high-performance integrated photonic systems-on- chip at low cost. As the need to squeeze more data into a given bandwidth and a given footprint increases, silicon photonics becomes more and more promising. This work develops and demonstrates novel devices, methodologies, and architectures to resolve the challenges facing the next-generation silicon photonic transceivers. The first part of this thesis focuses on the topology optimization of passive silicon photonic devices. Specifically, a novel device optimization methodology - particle swarm optimization in conjunction with 3D finite-difference time-domain (FDTD), has been proposed and proven to be an effective way to design a wide range of passive silicon photonic devices. We demonstrate a polarization rotator and a 90◦ optical hybrid for polarization-diversity and phase-diversity communications - two important schemes to increase the communication capacity by increasing the spectral efficiency. The second part of this thesis focuses on the design and characterization of the next- generation silicon photonic transceivers. We demonstrate a polarization-insensitive WDM receiver with an aggregate data rate of 160 Gb/s. This receiver adopts a novel architecture which effectively reduces the polarization-dependent loss. In addition, we demonstrate a III-V/silicon hybrid external cavity laser with a tuning range larger than 60 nm in the C-band on a silicon-on-insulator platform. A III-V semiconductor gain chip is hybridized into the silicon chip by edge-coupling to the silicon chip. The demonstrated packaging method requires only passive alignment and is thus suitable for high-volume production. We also demonstrate all silicon-photonics-based transmission of 34 Gbaud (272 Gb/s) dual-polarization 16-QAM using our integrated laser and silicon photonic coherent transceiver. The results show no additional penalty compared to commercially available narrow linewidth tunable lasers. The last part of this thesis focuses on the chip-scale optical interconnect and presents two different types of reconfigurable memory interconnects for multi-core many-memory computing systems. These reconfigurable interconnects can effectively alleviate the memory access issues, such as non-uniform memory access, and Network-on-Chip (NoC) hot-spots that plague the many-memory computing systems by dynamically directing the available memory bandwidth to the required memory interface

The effect of an optical network on-chip on the performance of chip multiprocessors

Optical networks on-chip (ONoC) have been proposed to reduce power consumption and increase bandwidth density in high performance chip multiprocessors (CMP), compared to electrical NoCs. However, as buffering in an ONoC is not viable, the end-to-end message path needs to be acquired in advance during which the message is buffered at the network ingress. This waiting latency is therefore a combination of path setup latency and contention and forms a significant part of the total message latency. Many proposed ONoCs, such as Single Writer, Multiple Reader (SWMR), avoid path setup latency at the expense of increased optical components. In contrast, this thesis investigates a simple circuit-switched ONoC with lower component count where nodes need to request a channel before transmission. To hide the path setup latency, a coherence-based message predictor is proposed, to setup circuits before message arrival. Firstly, the effect of latency and bandwidth on application performance is thoroughly investigated using full-system simulations of shared memory CMPs. It is shown that the latency of an ideal NoC affects the CMP performance more than the NoC bandwidth. Increasing the number of wavelengths per channel decreases the serialisation latency and improves the performance of both ONoC types. With 2 or more wavelengths modulating at 25 Gbit=s , the ONoCs will outperform a conventional electrical mesh (maximal speedup of 20%). The SWMR ONoC outperforms the circuit-switched ONoC. Next coherence-based prediction techniques are proposed to reduce the waiting latency. The ideal coherence-based predictor reduces the waiting latency by 42%. A more streamlined predictor (smaller than a L1 cache) reduces the waiting latency by 31%. Without prediction, the message latency in the circuit-switched ONoC is 11% larger than in the SWMR ONoC. Applying the realistic predictor reverses this: the message latency in the SWMR ONoC is now 18% larger than the predictive circuitswitched ONoC

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu