Obtaining an SDL entity identifier using SDL/SystemC co-modeling

This paper describes a technical problem of obtaining a unique SDL entity identifier using SDL/SystemC co-modeling. The problem occurs during scientific research in co-modeling field as well as work under real projects. Solution consists in redefinition the standard function of SDL simulation kernel for getting access to entity name and then conversion its name to a unique identifier. The paper explains the situation where problem appears, demonstrates its application using SDL/SystemC co-simulation and describes in practice a solution that fully solved the problem and makes possible further research

Design Languages for Embedded Systems

Embedded systems are application-specific computers that interact with the physical world. Each has a diverse set of tasks to perform, and although a very flexible language might be able to handle all of them, instead a variety of problem-domain-specific languages have evolved that are easier to write, analyze, and compile. This paper surveys some of the more important languages, introducing their central ideas quickly without going into detail. A small example of each is included

Possibility of SystemC code generation from SDL specification

Technology of code generation for models of systems is described by means of DSL (Domain- Specific Language) languages, based on MDA (Model Driven Architecture) design, provides a basis for further simulation and testing. In particular, the use of SDL language for design of formal specification of communication systems has more than thirty years story. Due to rapidly increasing complexity of systems, recently a group of researchers from SUAI and NOKIA Research Center has proposed and successfully implemented method for SDL and SystemC languages co-modeling use. This method has some significant drawbacks, seriously complicating process of SystemC components integration with SDL models. This paper describes a solution, which consists of method of SystemC code generation firstly by parsing textual representation of SDL specification, then by generating AST (Abstract Syntax Tree) tree and finally by generating of SystemC code from this tree

Hardware/Software Codesign

The current state of the art technology in integrated circuits allows the incorporation of multiple processor cores and memory arrays, in addition to application specific hardware, on a single substrate. As silicon technology has become more advanced, allowing the implementation of more complex designs, systems have begun to incorporate considerable amounts of embedded software [3]. Thus it becomes increasingly necessary for the system designers to have knowledge on both hardware and software to make efficient design tradeoffs. This is where hardware/software codesign comes into existence

Embedded System Design

A unique feature of this open access textbook is to provide a comprehensive introduction to the fundamental knowledge in embedded systems, with applications in cyber-physical systems and the Internet of things. It starts with an introduction to the field and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, including real-time operating systems. The author also discusses evaluation and validation techniques for embedded systems and provides an overview of techniques for mapping applications to execution platforms, including multi-core platforms. Embedded systems have to operate under tight constraints and, hence, the book also contains a selected set of optimization techniques, including software optimization techniques. The book closes with a brief survey on testing. This fourth edition has been updated and revised to reflect new trends and technologies, such as the importance of cyber-physical systems (CPS) and the Internet of things (IoT), the evolution of single-core processors to multi-core processors, and the increased importance of energy efficiency and thermal issues

High-Speed Performance, Power and Thermal Co-simulation For SoC Design

This dissertation presents a multi-faceted effort at developing standard System Design Language based tools that allow designers to the model power and thermal behavior of SoCs, including heterogeneous SoCs that include non-digital components. The research contributions made in this dissertation include: • SystemC-based power/performance co-simulation for the Intel XScale microprocessor. We performed detailed characterization of the power dissipation patterns of a variety of system components and used these results to build detailed power models, including a highly accurate, validated instruction-level power model of the XScale processor. We also proposed a scalable, efficient and validated methodology for incorporating fast, accurate power modeling capabilities into system description languages such as SystemC. This was validated against physical measurements of hardware power dissipation. • Modeling the behavior of non-digital SoC components within standard System Design Languages. We presented an approach for modeling the functionality, performance, power, and thermal behavior of a complex class of non-digital components — MEMS microhotplate-based gas sensors — within a SystemC design framework. The components modeled include both digital components (such as microprocessors, busses and memory) and MEMS devices comprising a gas sensor SoC. The first SystemC models of a MEMS-based SoC and the first SystemC models of MEMS thermal behavior were described. Techniques for significantly improving simulation speed were proposed, and their impact quantified. • Vertically Integrated Execution-Driven Power, Performance and Thermal Co-Simulation For SoCs. We adapted the above techniques and used numerical methods to model the system of differential equations that governs on-chip thermal diffusion. This allows a single high-speed simulation to span performance, power and thermal modeling of a design. It also allows feedback behaviors, such as the impact of temperature on power dissipation or performance, to be modeled seamlessly. We validated the thermal equation-solving engine on test layouts against detailed low-level tools, and illustrated the power of such a strategy by demonstrating a series of studies that designers can perform using such tools. We also assessed how simulation and accuracy are impacted by spatial and temporal resolution used for thermal modeling