Exploiting Adaptive Techniques to Improve Processor Energy Efficiency

Rapid device-miniaturization keeps on inducing challenges in building energy efficient microprocessors. As the size of the transistors continuously decreasing, more uncertainties emerge in their operations. On the other hand, integrating more and more transistors on a single chip accentuates the need to lower its supply-voltage. This dissertation investigates one of the primary device uncertainties - timing error, in microprocessor performance bottleneck in NTC era. Then it proposes various innovative techniques to exploit these opportunities to maintain processor energy efficiency, in the context of emerging challenges. Evaluated with the cross-layer methodology, the proposed approaches achieve substantial improvements in processor energy efficiency, compared to other start-of-art techniques

Advanced Timing and Synchronization Methodologies for Digital VLSI Integrated Circuits

This dissertation addresses timing and synchronization methodologies that are critical to the design, analysis and optimization of high-performance, integrated digital VLSI systems. As process sizes shrink and design complexities increase, achieving timing closure for digital VLSI circuits becomes a significant bottleneck in the integrated circuit design flow. Circuit designers are motivated to investigate and employ alternative methods to satisfy the timing and physical design performance targets. Such novel methods for the timing and synchronization of complex circuitry are developed in this dissertation and analyzed for performance and applicability.Mainstream integrated circuit design flow is normally tuned for zero clock skew, edge-triggered circuit design. Non-zero clock skew or multi-phase clock synchronization is seldom used because the lack of design automation tools increases the length and cost of the design cycle. For similar reasons, level-sensitive registers have not become an industry standard despite their superior size, speed and power consumption characteristics compared to conventional edge-triggered flip-flops.In this dissertation, novel design and analysis techniques that fully automate the design and analysis of non-zero clock skew circuits are presented. Clock skew scheduling of both edge-triggered and level-sensitive circuits are investigated in order to exploit maximum circuit performances. The effects of multi-phase clocking on non-zero clock skew, level-sensitive circuits are investigated leading to advanced synchronization methodologies. Improvements in the scalability of the computational timing analysis process with clock skew scheduling are explored through partitioning and parallelization.The integration of the proposed design and analysis methods to the physical design flow of integrated circuits synchronized with a next-generation clocking technology-resonant rotary clocking technology-is also presented. Based on the design and analysis methods presented in this dissertation, a computer-aided design tool for the design of rotary clock synchronized integrated circuits is developed

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Fine-grained Energy and Thermal Management using Real-time Power Sensors

With extensive use of battery powered devices such as smartphones, laptops an

Voltage and Timing Adaptation for Variation and Aging Tolerance in Nanometer VLSI Circuits

Process variations and circuit aging continue to be main challenges to the power-efficiency of VLSI circuits, as considerable power budget must be allocated at design time to mitigate timing variations. Modern designs incorporate adaptive techniques for variation compensation to reduce the extra power consumption. The efficiency of existing adaptive approaches, however, is often significantly attenuated by the fine-grained nature of variations in nanometer technology such as random dopant fluctuation, litho-variation, and different rates of transistor degradation due to non-uniform activity factors. This dissertation addresses the limitations from existing adaptation techniques, and proposes new adaptive approaches to effectively compensate the fine-grained variations. Adaptive supply voltage (ASV) is one of the effective adaptation approaches for power-performance tuning. ASV has advantages on controlling dynamic and leakage power, while voltage generation and delivery overheads from conventional ASV systems make their application to mitigate fine-grained variations demanding. This dissertation presents a dual-level ASV system which provides ASV at both coarse-grained and fine-grained level, and has limited power routing overhead. Significant power reduction from our dual-ASV system demonstrates its superiority over existing approaches. Another novel technique on supply voltage adaptation for variation resilience in VLSI interconnects is proposed. A programmable boostable repeater design boosts switching speed by raising its internal voltage rail transiently and autonomously, and achieves fine-grained voltage adaptation without stand-alone voltage regulators or additional power grid. Since interconnect is a widely recognized bottleneck to chip performance and tremendous repeaters are employed on chip designs, boostable repeater has plenty of chances to improve system robustness. A low cost scheme for delay variation detection is essential to compose an efficient adaptation system. This dissertation presents an area-efficient built-in delay testing scheme which exploits BIST SCAN architecture and dynamic clock skew control. Using this built-in delay testing scheme, a fine-grained adaptation system composed of the proposed boostable repeater design and adaptive clock skew control is proposed, and demonstrated to mitigate process variation and aging induced timing degradations in a power as well as area efficient manner

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Just-in-time Hardware generation for abstracted reconfigurable computing

This thesis addresses the use of reconfigurable hardware in computing platforms, in order to harness the performance benefits of dedicated hardware whilst maintaining the flexibility associated with software. Although the reconfigurable computing concept is not new, the low level nature of the supporting tools normally used, together with the consequent limited level of abstraction and resultant lack of backwards compatibility, has prevented the widespread adoption of this technology. In addition, bandwidth and architectural limitations, have seriously constrained the potential improvements in performance. A review of existing approaches and tools flows is conducted to highlight the current problems being faced in this field. The objective of the work presented in this thesis is to introduce a radically new approach to reconfigurable computing tool flows. The runtime based tool flow introduces complete abstraction between the application developer and the underlying hardware. This new technique eliminates the ease of use and backwards compatibility issues that have plagued the reconfigurable computing concept, and could pave the way for viable mainstream reconfigurable computing platforms. An easy to use, cycle accurate behavioural modelling system is also presented, which was used extensively during the early exploration of new concepts and architectures. Some performance improvements produced by the new reconfigurable computing tool flow, when applied to both a MIPS based embedded platform, and the Cray XDl, are also presented. These results are then analyzed and the hardware and software factors affecting the performance increases that were obtained are discussed, together with potential techniques that could be used to further increase the performance of the system. Lastly a heterogenous computing concept is proposed, in which, a computer system, containing multiple types of computational resource is envisaged, each having their own strengths and weaknesses (e.g. DSPs, CPUs, FPGAs). A revolutionary new method of fully exploiting the potential of such a system, whilst maintaining scalability, backwards compatibility, and ease of use is also presented

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated separately. In addition, these dies can be fabricated in different technologies. The effect of different sources of variations on 3-D circuits, consequently, differ from 2-D ICs. As technology scales, these variations significantly affect the performance of circuits. Therefore, it is increasingly important to accurately and efficiently model different sources of variations in 3-D ICs. The process, voltage, and temperature variations in 3-D ICs are investigated in this dissertation. Related modeling and design techniques are proposed to design a robust 3-D IC. Process variations in 3-D ICs are first analyzed. The effect of process variations on synchronization and 3-D clock distribution networks, is carefully studied. A novel statistical model is proposed to describe the timing variation in 3-D clock distribution networks caused by process variations. Based on this model, different topologies of 3-D clock distribution networks are compared in terms of skew variation. A set of guidelines is proposed to design 3-D clock distribution networks with low clock uncertainty. Voltage variations are described by power supply noise. Power supply noise in 3-D ICs is investigated considering different characteristics of potential 3-D power grids in this thesis. A new algorithm is developed to fast analyze the steady-state IR-drop in 3-D power grids. The first droop of power supply noise, also called resonant supply noise, is usually the deepest voltage drop in power distribution networks. The effect of resonant supply noise on 3-D clock distribution networks is investigated. The combined effect of process variations and power supply noise is modeled by skitter consisting of both skew and jitter. A novel statistical model of skitter is proposed. Based on this proposed model and simulation results, a set of guidelines has been proposed to mitigate the negative effect of process and voltage variations on 3-D clock distribution networks. Thermal issues in 3-D ICs are considered by carefully modeling thermal through silicon vias (TTSVs) in this dissertation. TTSVs are vertical vias which do not carry signals, dedicated to facilitate the propagation of heat to reduce the temperature of 3-D ICs. Two analytic models are proposed to describe the heat transfer in 3-D circuits related to TTSVs herein, providing proper closed-form expressions for the thermal resistance of the TTSVs. The effect of different physical and geometric parameters of TTSVs on the temperature of 3-D ICs is analyzed. The proposed models can be used to fast and accurately estimate the temperature to avoid the overuse of TTSVs occupying a large portion of area. A set of models and design techniques is proposed in this dissertation to describe and mitigate the deleterious effects of process, voltage, and temperature variations in 3-D ICs. Due to the continuous shrink in the feature size of transistors, the large number of devices within one circuit, and the high operating frequency, the effect of these variations on the performance of 3-D ICs becomes increasingly significant. Accurately and efficiently estimating and controlling these variations are, consequently, critical tasks for the design of 3-D ICs

Time keeping in myriad networks : theories, solutions and applications

Thesis (S.M.)--Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2001.Includes bibliographical references (leaves 70-72).Distributed sensor networks make extensive use of a common time reference. In this work we address the problem of time dissemination in a packet switched network when the nodes are NOT generally all connected to an accurate, external time reference source. We thoroughly analyze Network Time Protocol - version 3 and identify its oversimplified clock modeling and its neglect of network delay variance (network jitter) as the primal causes for its inaccuracy. We explicitly address frequency skew in our clock model and propose a novel Kalman filtering technique for de-noising (remove of network jitter) during the NTP time synchronization process. The parameters of the Kalman linear estimator are optimal and they are computed online from the network environment, with a well-defined procedure. Our End-to-End technique decreases NTP rms error by two orders of magnitude and is compared with a software phased lock loop and a linear programming technique, with cross traffic exhibiting long-range dependence (fractional Brownian motion cross-traffic) or no dependence at all (white Gaussian case). We conclude with applications over packet switched networks that require time synchronization, like spatial filtering (beam-forming). The suite of algorithms and applications define a new class of packet switched networks, called Myriad Networks.by Aggelos Anastasiou Bletsas.S.M

High-speed, economical design implementation of transit network router

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1995.Includes bibliographical references (p. 88-90).by Kazuhiro Hara.M.S