Chip level simulation of fault tolerant computers

Chip level modeling techniques, functional fault simulation, simulation software development, a more efficient, high level version of GSP, and a parallel architecture for functional simulation are discussed

A Multiproject Chip Approach to the Teaching of Analog MOS LSI and VLSI

Multiproject chip implementation has been used in teaching analog MOS circuit design. After having worked with computer simulation and layout aids in homework problems, students designed novel circuits including several high performance op amps, an A/D converter, a switched capacitor filter, a 1 K dynamic RAM, and a variety of less conventional MOS circuits such as a VII converter, an AC/DC converter, an AM radio receiver, a digitally-controlled analog signal processor, and on-chip circuitry for measuring transistor capacitances. These circuits were laid out as part of an NMOS multiproject chip. Several of the designs exhibit a considerable degree of innovation; fabrication pending, computer simulation shows that some may be pushing the state of the art. Several designs are of interest to digital designers; in fact, the course has provided knowledge and technique needed for detailed digital circuit design at the gate level

Design, processing and testing of LSI arrays hybrid microelectronics task

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed

Design, processing and testing of LSI arrays, hybrid microelectronics task

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Expansion of CMOS array design techniques

The important features of the multiport (double entry) automatic placement and routing programs for standard cells are described. Measured performance and predicted performance were compared for seven CMOS/SOS array types and hybrids designed with the high speed CMOS/SOS cell family. The CMOS/SOS standard cell data sheets are listed and described

Multilevel Clustering Fault Model for IC Manufacture

A hierarchical approach to the construction of compound distributions for process-induced faults in IC manufacture is proposed. Within this framework, the negative binomial distribution is treated as level-1 models. The hierarchical approach to fault distribution offers an integrated picture of how fault density varies from region to region within a wafer, from wafer to wafer within a batch, and so on. A theory of compound-distribution hierarchies is developed by means of generating functions. A study of correlations, which naturally appears in microelectronics due to the batch character of IC manufacture, is proposed. Taking these correlations into account is of significant importance for developing procedures for statistical quality control in IC manufacture. With respect to applications, hierarchies of yield means and yield probability-density functions are considered.Comment: 10 pages, the International Conference "Micro- and Nanoelectronics- 2003" (ICMNE-2003),Zvenigorod, Moscow district, Russia, October 6-10, 200

Application of advanced technology to space automation

Automated operations in space provide the key to optimized mission design and data acquisition at minimum cost for the future. The results of this study strongly accentuate this statement and should provide further incentive for immediate development of specific automtion technology as defined herein. Essential automation technology requirements were identified for future programs. The study was undertaken to address the future role of automation in the space program, the potential benefits to be derived, and the technology efforts that should be directed toward obtaining these benefits

Preliminary candidate advanced avionics system for general aviation

An integrated avionics system design was carried out to the level which indicates subsystem function, and the methods of overall system integration. Sufficient detail was included to allow identification of possible system component technologies, and to perform reliability, modularity, maintainability, cost, and risk analysis upon the system design. Retrofit to older aircraft, availability of this system to the single engine two place aircraft, was considered