Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Dynamic Voltage and Frequency Scaling for Wireless Network-on-Chip

Previously, research and design of Network-on-Chip (NoC) paradigms where mainly focused on improving the performance of the interconnection networks. With emerging wide range of low-power applications and energy constrained high-performance applications, it is highly desirable to have NoCs that are highly energy efficient without incurring performance penalty. In the design of high-performance massive multi-core chips, power and heat have become dominant constrains. Increased power consumption can raise chip temperature, which in turn can decrease chip reliability and performance and increase cooling costs. It was proven that Small-world Wireless Network-on-Chip (SWNoC) architecture which replaces multi-hop wire-line path in a NoC by high-bandwidth single hop long range wireless links, reduces the overall energy dissipation when compared to wire-line mesh-based NoC architecture. However, the overall energy dissipation of the wireless NoC is still dominated by wire-line links and switches (buffers). Dynamic Voltage Scaling is an efficient technique for significant power savings in microprocessors. It has been proposed and deployed in modern microprocessors by exploiting the variance in processor utilization. On a Network-on-Chip paradigm, it is more likely that the wire-line links and buffers are not always fully utilized even for different applications. Hence, by exploiting these characteristics of the links and buffers over different traffic, DVFS technique can be incorporated on these switches and wire-line links for huge power savings. In this thesis, a history based DVFS mechanism is proposed. This mechanism uses the past utilization of the wire-line links & buffers to predict the future traffic and accordingly tune the voltage and frequency for the links and buffers dynamically for each time window. This mechanism dynamically minimizes the power consumption while substantially maintaining a high performance over the system. Performance analysis on these DVFS enabled Wireless NoC shows that, the overall energy dissipation is improved by around 40% when compared Small-world Wireless NoCs

Optimal digital system design in deep submicron technology

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.Includes bibliographical references (p. 165-174).The optimization of a digital system in deep submicron technology should be done with two basic principles: energy waste reduction and energy-delay tradeoff. Increased energy resources obtained through energy waste reduction are utilized through energy-delay tradeoffs. The previous practice of obliviously pursuing performance has led to the rapid increase in energy consumption. While energy waste due to unnecessary switching could be reduced with small increases in logic complexity, leakage energy waste still remains as a major design challenge. We find that fine-grain dynamic leakage reduction (FG-DLR), turning off small subblocks for short idle intervals, is the key for successful leakage energy saving. We introduce an FG-DLR circuit technique, Leakage Biasing, which uses leakage currents themselves to bias the circuit into the minimum leakage state, and apply it to primary SRAM arrays for bitline leakage reduction (Leakage-Biased Bitlines) and to domino logic (Leakage-Biased Domino). We also introduce another FG-DLR circuit technique, Dynamic Resizing, which dynamically downsizes transistors on idle paths while maintaining the performance along active critical paths, and apply it to static CMOS circuits.(cont.) We show that significant energy reduction can be achieved at the same computation throughput and communication bandwidth by pipelining logic gates and wires. We find that energy saved by pipelining datapaths is eventually limited by latch energy overhead, leading to a power-optimal pipelining. Structuring global wires into on-chip networks provides a better environment for pipelining and leakage energy saving. We show that the energy-efficiency increase through replacement with dynamically packet-routed networks is bounded by router energy overhead. Finally, we provide a way of relaxing the peak power constraint. We evaluate the use of Activity Migration (AM) for hot spot removal. AM spreads heat by transporting computation to a different location on the die. We show that AM can be used either to increase the power that can be dissipated by a given package, or to lower the operating temperature and hence the operating energy.by Seongmoo Heo.Ph.D

Energy-aware synthesis for networks on chip architectures

The Network on Chip (NoC) paradigm was introduced as a scalable communication infrastructure for future System-on-Chip applications. Designing application specific customized communication architectures is critical for obtaining low power, high performance solutions. Two significant design automation problems are the creation of an optimized configuration, given application requirement the implementation of this on-chip network. Automating the design of on-chip networks requires models for estimating area and energy, algorithms to effectively explore the design space and network component libraries and tools to generate the hardware description. Chip architects are faced with managing a wide range of customization options for individual components, routers and topology. As energy is of paramount importance, the effectiveness of any custom NoC generation approach lies in the availability of good energy models to effectively explore the design space. This thesis describes a complete NoC synthesis flow, called NoCGEN, for creating energy-efficient custom NoC architectures. Three major automation problems are addressed: custom topology generation, energy modeling and generation. An iterative algorithm is proposed to generate application specific point-to-point and packet-switched networks. The algorithm explores the design space for efficient topologies using characterized models and a system-level floorplanner for evaluating placement and wire-energy. Prior to our contribution, building an energy model required careful analysis of transistor or gate implementations. To alleviate the burden, an automated linear regression-based methodology is proposed to rapidly extract energy models for many router designs. The resulting models are cycle accurate with low-complexity and found to be within 10% of gate-level energy simulations, and execute several orders of magnitude faster than gate-level simulations. A hardware description of the custom topology is generated using a parameterizable library and custom HDL generator. Fully reusable and scalable network components (switches, crossbars, arbiters, routing algorithms) are described using a template approach and are used to compose arbitrary topologies. A methodology for building and composing routers and topologies using a template engine is described. The entire flow is implemented as several demonstrable extensible tools with powerful visualization functionality. Several experiments are performed to demonstrate the design space exploration capabilities and compare it against a competing min-cut topology generation algorithm

Many-core and heterogeneous architectures: programming models and compilation toolchains

1noL'abstract è presente nell'allegato / the abstract is in the attachmentopen677. INGEGNERIA INFORMATInopartially_openembargoed_20211002Barchi, Francesc

Circuits and Systems Advances in Near Threshold Computing

Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout