Design of Low Power SRAM Cell Using 10Transistors

The primary aim of electronics is to design low power devices due to the frequent usage of powered widget. The memory cell operation containing low voltage consumption hasbecome a major interest in designing of memory cells due to its applications in very low energy computing.Due to specification modifications in scaled methodologies, the only critical method isstable operation of SRAM for the success of low voltage design of SRAM. Along with the power and voltage consumption, due to unwanted switching actions of transistors, the access time of the SRAM is also considered as a complex parameter and it is used for different blocks like, designed SRAM cell, access transistors, pre-charge circuit, decoders and sense amplifiers.The conventional 6T SRAM are unable toachievethe less delay and sub threshold operation. The proposed design is designed by using the sleep transistor circuits. The sleep transistor circuits are turned to be ON in active state and in OFF state during passive state.A supply voltage of 1.8V is used which enough for low power applications in energy computing. The designed SRAM cell has conducting pMOS circuit, which can also reduces the total power dissipation. The designed 10T SRAM cell reduces 40.56% of total power and 17.86% of total delay compared with the conventional 6T SRAM cell.The structured SRAM cell is reproduced by utilizing Cadence device of 180nm innovation

Design Of A Nonvolatile 8T1R SRAM Cell For Instant-On Operation

Now-a-days, Energy consumption is the major key factor in Memories. By switching the circuit in off mode and with an lower voltages, leads to decrease in an power dissipation of the circuit. Compared to DRAM SRAM’S are mostly used because of their data retaining capability. The major advantage of using SRAM’s rather than DRAM’S is that, they are providing fast power-on/off speeds. Hence SRAM’s are more preferred over DRAM’s for better instant-on operation. Generally SRAM’s are classified in to two types namely volatile and non-volatile SRAM’s. A non-volatile SRAM enables chip to achieve performance factors and also provides an restore operation which will be enabled by an restore signal to restore the data and also power-up operation is performed. This paper describes about novel NVSRAM circuit which produces better “instant-on operation” compared to previous techniques used in SRAM’s. In addition to normal 6T SRAM core, we are using RRAM circuitry (Resistive RAM) to provide better instant-on operation. By comparing the performance factors with 8T2R and 9T2R, 8T1R design performs the best in the Nano meter scale. Thus this paper provides better performances in power, energy, propagation delay and area factors as compared with other designs

Product assurance technology for procuring reliable, radiation-hard, custom LSI/VLSI electronics

Advanced measurement methods using microelectronic test chips are described. These chips are intended to be used in acquiring the data needed to qualify Application Specific Integrated Circuits (ASIC's) for space use. Efforts were focused on developing the technology for obtaining custom IC's from CMOS/bulk silicon foundries. A series of test chips were developed: a parametric test strip, a fault chip, a set of reliability chips, and the CRRES (Combined Release and Radiation Effects Satellite) chip, a test circuit for monitoring space radiation effects. The technical accomplishments of the effort include: (1) development of a fault chip that contains a set of test structures used to evaluate the density of various process-induced defects; (2) development of new test structures and testing techniques for measuring gate-oxide capacitance, gate-overlap capacitance, and propagation delay; (3) development of a set of reliability chips that are used to evaluate failure mechanisms in CMOS/bulk: interconnect and contact electromigration and time-dependent dielectric breakdown; (4) development of MOSFET parameter extraction procedures for evaluating subthreshold characteristics; (5) evaluation of test chips and test strips on the second CRRES wafer run; (6) two dedicated fabrication runs for the CRRES chip flight parts; and (7) publication of two papers: one on the split-cross bridge resistor and another on asymmetrical SRAM (static random access memory) cells for single-event upset analysis

6T-SRAM 1Mb Design with Test Structures and Post Silicon Validation

abstract: Static random-access memories (SRAM) are integral part of design systems as caches and data memories that and occupy one-third of design space. The work presents an embedded low power SRAM on a triple well process that allows body-biasing control. In addition to the normal mode operation, the design is embedded with Physical Unclonable Function (PUF) [Suh07] and Sense Amplifier Test (SA Test) mode. With PUF mode structures, the fabrication and environmental mismatches in bit cells are used to generate unique identification bits. These bits are fixed and known as preferred state of an SRAM bit cell. The direct access test structure is a measurement unit for offset voltage analysis of sense amplifiers. These designs are manufactured using a foundry bulk CMOS 55 nm low-power (LP) process. The details about SRAM bit-cell and peripheral circuit design is discussed in detail, for certain cases the circuit simulation analysis is performed with random variations embedded in SPICE models. Further, post-silicon testing results are discussed for normal operation of SRAMs and the special test modes. The silicon and circuit simulation results for various tests are presented.Dissertation/ThesisMasters Thesis Electrical Engineering 201

A Review on Enhancement of SRAM Memory Cell

In this field research paper explores the design and analysis of Static Random Access Memory (SRAMs) that focuses on optimizing delay and power. CMOS SRAM cell consumes very little power and has less read and write time. Higher cell ratios will decrease the read and write time and improve stability. PMOS semiconductor unit with fewer dimensions reduces the ability consumption. During this paper, 6T SRAM cell is implemented with reduced power and performance is good according to read and write time, delay and power consumption. It's been noticed typically that increased memory capability will increase the bit-line parasitic capacitance that successively slows down voltage sensing, to avoid this drawback use optimized scaling techniques and more, get improve performance of the design. Memories are a core part of most of the electronic systems. Performance in terms of speed and power dissipation is the major area of concern in today's memory technology. During this paper SRAM cells supported 6T, 9T, and 8T configurations are compared based on performance for reading and write operations. During this paper completely different static random access memory is designed to satisfy low power, high-performance circuit and also the extensive survey on options of various static random access memory (SRAM) designs were reported. Improve performance static random access memory based on designing a low power SRAM cell structure with optimum write access power

Power Efficient Data-Aware SRAM Cell for SRAM-Based FPGA Architecture

The design of low-power SRAM cell becomes a necessity in today\u27s FPGAs, because SRAM is a critical component in FPGA design and consumes a large fraction of the total power. The present chapter provides an overview of various factors responsible for power consumption in FPGA and discusses the design techniques of low-power SRAM-based FPGA at system level, device level, and architecture levels. Finally, the chapter proposes a data-aware dynamic SRAM cell to control the power consumption in the cell. Stack effect has been adopted in the design to reduce the leakage current. The various peripheral circuits like address decoder circuit, write/read enable circuits, and sense amplifier have been modified to implement a power-efficient SRAM-based FPGA

Temperature Variation Operation of Mixed-VT 3T GC-eDRAM for Low Power Applications in 2Kbit Memory Array

Embedded memories were once utilized to transfer information between the CPU and the main memory. The cache storage in most traditional computers was static-random-access-memory (SRAM). Other memory technologies, such as embedded dynamic random-access memory (eDRAM) and spin-transfer-torque random-access memory (STT-RAM), have also been used to store cache data. The SRAM, on the other hand, has a low density and severe leakage issues, and the STT-RAM has high latency and energy consumption when writing. The gain-cell eDRAM (GC-eDRAM), which has a higher density, lower leakage, logic compatibility, and is appropriate for two-port operations, is an attractive option. To speed up data retrieval from the main memory, future processors will require larger and faster-embedded memories. Area overhead, power overhead, and speed performance are all issues with the existing architecture. A unique mixed-V_T 3T GC-eDRAM architecture is suggested in this paper to improve data retention times (DRT) and performance for better energy efficiency in embedded memories. The GC-eDRAM is simulated using a standard complementary-metal-oxide-semiconductor (CMOS) with a 130nm technology node transistor. The performance of a 2kbit mixed-V_T 3T GC-eDRAM array were evaluated through corner process simulations. Each memory block is designed and simulated using Mentor Graphics Software. The array, which is based on the suggested bit-cell, has been successfully operated at 400Mhz under a 1V supply and takes up almost 60-75% less space than 6T SRAM using the same technology. When compared to the existing 6T and 4T ULP SRAMs (others' work), the retention power of the proposed GC-eDRAM is around 80-90% lower