Smart technologies for effective reconfiguration: the FASTER approach

Current and future computing systems increasingly require that their functionality stays flexible after the system is operational, in order to cope with changing user requirements and improvements in system features, i.e. changing protocols and data-coding standards, evolving demands for support of different user applications, and newly emerging applications in communication, computing and consumer electronics. Therefore, extending the functionality and the lifetime of products requires the addition of new functionality to track and satisfy the customers needs and market and technology trends. Many contemporary products along with the software part incorporate hardware accelerators for reasons of performance and power efficiency. While adaptivity of software is straightforward, adaptation of the hardware to changing requirements constitutes a challenging problem requiring delicate solutions. The FASTER (Facilitating Analysis and Synthesis Technologies for Effective Reconfiguration) project aims at introducing a complete methodology to allow designers to easily implement a system specification on a platform which includes a general purpose processor combined with multiple accelerators running on an FPGA, taking as input a high-level description and fully exploiting, both at design time and at run time, the capabilities of partial dynamic reconfiguration. The goal is that for selected application domains, the FASTER toolchain will be able to reduce the design and verification time of complex reconfigurable systems providing additional novel verification features that are not available in existing tool flows

Design of multimedia processor based on metric computation

Media-processing applications, such as signal processing, 2D and 3D graphics rendering, and image compression, are the dominant workloads in many embedded systems today. The real-time constraints of those media applications have taxing demands on today's processor performances with low cost, low power and reduced design delay. To satisfy those challenges, a fast and efficient strategy consists in upgrading a low cost general purpose processor core. This approach is based on the personalization of a general RISC processor core according the target multimedia application requirements. Thus, if the extra cost is justified, the general purpose processor GPP core can be enforced with instruction level coprocessors, coarse grain dedicated hardware, ad hoc memories or new GPP cores. In this way the final design solution is tailored to the application requirements. The proposed approach is based on three main steps: the first one is the analysis of the targeted application using efficient metrics. The second step is the selection of the appropriate architecture template according to the first step results and recommendations. The third step is the architecture generation. This approach is experimented using various image and video algorithms showing its feasibility

Toward Fault-Tolerant Applications on Reconfigurable Systems-on-Chip

L'abstract è presente nell'allegato / the abstract is in the attachmen

Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms

Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability