Integration of planar Gunn diodes and HEMTs for high-power MMIC oscillators

This work has as main objective the integration of planar Gunn diodes and high electron mobility transistors (HEMTs) on the same chip for the realisation of high-power oscillators in the millimeter-wave regime. By integrating the two devices, we can reinforce the high frequency oscillations generated by the diode using a transistor-based amplifier. The integration of the planar Gunn diode and the pseudomorphic HEMT was initially attempted on a combined gallium arsenide (GaAs) wafer. In this approach, the active layers of the two devices were separated by a thick buffer layer. A second technique was examined afterwards where both devices were fabricated on the same wafer that included AlGaAs/InGaAs/GaAs heterostructures optimised for the fabrication of pHEMTs. The second approach demonstrated the successful implementation of both devices on the same substrate. Planar Gunn diodes with 1.3 μm anode-to-cathode separation (Lac) presented oscillations up to 87.6 GHz with a maximum power equal to -40 dBm. A new technique was developed for the fabrication of 70 nm long T-gates, improving the gain and the high frequency performance of the transistor. The pHEMT presented cut-off frequency (fT) equal to 90 GHz and 200 GHz maximum frequency of oscillation (fmax). The same side-by-side approach was applied afterwards for the implementation of both devices on an indium phosphide (InP) HEMT wafer for the first time. Planar Gunn diodes with Lac equal to 1 μm generated oscillations up to 204 GHz with -7.1 dBm maximum power. The developed 70 nm T-gate technology was applied for the fabrication of HEMTs with fT equal to 220 GHz and fmax equal to 330 GHz. In the end of this work, the two devices were combined in the same monolithic microwave integrated circuit (MMIC), where the diode was connected to the transistor based amplifier. The amplifier demonstrated a very promising performance with 10 dB of stable gain at 43 GHz. However, imperfections of the material caused large variations at the current density of the devices. As a consequence, no signals were detected at the output of the complete MMIC oscillators

Design and characterisation of millimetre wave planar Gunn diodes and integrated circuits

Heterojunction planar Gunn devices were first demonstrated by Khalid et al in 2007. This new design of Gunn device, or transferred electron device, was based on the well-established material system of GaAs as the oscillation media. The design did not only breakthrough the frequency record of GaAs for conventional Gunn devices, but also has several advantages over conventional Gunn devices, such as the possibility of making multiple oscillators on a single chip and compatibility with monolithic integrated circuits. However, these devices faced the challenge of producing high enough RF power for practical applications and circuit technology for integration. This thesis describes systematic work on the design and characterisations of planar Gunn diodes and the associated millimetre-wave circuits for RF signal power enhancement. Focus has been put on improving the design of planar Gunn diodes and developing high performance integrated millimetre-wave circuits for combining multiple Gunn diodes. Improvement of device design has been proved to be one of the key methods to increase the signal power. By introducing additional δ-doping layers, electron concentration in the channel increases and better Gunn domain formation is achieved, therefore higher RF power and frequency are produced. Combining multiple channels in the vertical direction within devices is another effective way to increase the output signal power as well as DC-to-RF conversion efficiency. In addition, an alternative material system, i.e. In0.23Ga0.77As, has also been studied for this purpose. Planar passive components, such as resonators, couplers, low pass filters (LPFs), and power combiners with high performance over 100 GHz have been developed. These components can be smoothly integrated with planar Gunn diodes for compact planar Gunn oscillators, and therefore contribute to RF power enhancement. In addition, several new measurement techniques for characterising oscillators and passive devices have also been developed during this work and will be included in this thesis

High efficiency and high frequency resonant tunneling diode sources

Terahertz (THz) technology has been generating a lot of interest due to the numerous potential applications for systems working in this previously unexplored frequency range. THz radiation has unique properties suited for high capacity communication systems and non-invasive, non-ionizing properties that when coupled with a fairly good spatial resolution are unparalleled in its sensing capabilities for use in biomedical, industrial and security fields. However, in order to achieve this potential, effective and efficient ways of generating THz radiation are required. Devices which exhibit negative differential resistance (NDR) in their current-voltage (I – V) characteristics can be used for the generation of these radio frequency (RF) signals. Among them, the resonant tunnelling diode (RTD) is considered to be one of the most promising solid-state sources for millimeter and submillimeter wave radiation, which can operate at room temperature. However, the main limitations of RTD oscillators are producing high output power and increasing the DC-to-RF conversion efficiency. Although oscillation frequencies of up to 1.98 THz have been already reported, the output power is in the range of micro-Watts and conversion efficiencies are under 1 %. This thesis describes the systematic work done on the design, fabrication, and characterization of RTD-based oscillators in monolithic microwave/millimeter-wave integrated circuits (MMIC) that can produce high output power and have a high conversion efficiency at the same time. At the device level, parasitic oscillations caused by the biasing line inductance when the diode is biased in the NDR region prevents accurate characterization and compromises the maximum RF power output. In order to stabilise the NDR devices, a common method is the use of a suitable resistor connected across the device, to make the differential resistance in the NDR region positive. However, this approach severely hinders the diode’s performance in terms of DC-to-RF conversion efficiency. In this work, a new DC bias decoupling circuit topology has been developed to enable accurate, direct measurements of the device’s NDR characteristic and when implemented in an oscillator design provides over a 10-fold improvement in DC-to-RF conversion efficiency. The proposed method can be adapted for higher frequency and higher power devices and could have a major impact with regards to the adoption of RTD technology, especially for portable devices where power consumption must be taken into consideration. RF and DC characterization of the device were used in the realization on an accurate large-signal model of the RTD. S-parameter measurements were used to determine an accurate small-signal model for the device’s capacitance and inductance, while the extracted DC characteristics where used to replicate the I-V characteristics. The model is able to replicate the non-stable behavior of RTD devices when biased in the NDR region and the RF characteristics seen in oscillator circuits. It is expected that the developed model will serve in future optimization processes of RTD devices in millimeter and submillimeter wave applications. Finally, a wireless data transmission link operating in the Ka-band (26.5 GHz – – 40 GHz) using two RTDs operating as a transmitter and receiver is presented in this thesis. Wireless error-free data transfer of up to 2 gigabits per second (Gbit/s) was achieved at a transmission distance of 15 cm. In summary, this work makes important contributions to the accurate characterization, and modeling of RTDs and demonstrates the feasibility of this technology for use in future portable wireless communication systems and imaging setups

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Monolithic microwave/millimetrewave integrated circuit resonant tunnelling diode dources with around a milliwatt output power

Resonant tunnelling diode (RTD) oscillators are considered to be one of the most promising solid-state terahertz sources which can operate at room temperature. The main limitation of RTD oscillators up to now is their low output power. For the published terahertz (THz) RTD oscillators, the output power is in the range of micro-Watts. This thesis describes systematic work on RTD device modelling, and on the design, fabrication and measurement of high power monolithic microwave integrated circuit (MMIC) RTD oscillators. The RTD device consists of a narrow bandgap layer (quantum well) sandwiched between two thin wide bandgap layers (barriers). When the device is biased, electrons with kinetic energy lower than the barriers may tunnel through the double barrier-quantum well (DBQW) structure, and the device exhibits a negative differential resistance (NDR) in this case. To investigate this phenomenon, a new numerical model based on quantum mechanics was developed. The model involves self-consistent solving of the Schrodinger equation until the quasi-eigen energy state converges. This model is expected to serve to optimize the RTD device structure for millimetre-wave and terahertz applications. Besides RTD device modelling, the fabrication process for single devices and for MMIC RTD oscillator circuits was developed and optimized on this project. Optical lithography, wet/dry etching and metallization were the main fabrication techniques utilized. For device sizes of a few square microns, the fabrication process required the development of new steps, i.e, via opening through polyimide. The fabrication process was optimized and high yield was obtained. On this project, one of the challenges was to realize RTD oscillators in the form of MMICs, aiming at about 100 GHz with milli-Watts output power, in accordance with a recently proposed power combining circuit topology. To accomplish such an oscillator, proper design of passive components was essential. On this project, these components included 50 coplanar waveguides (CPW), shorted CPW stubs, metal-insulator-metal (MIM) capacitors and thin _lm resistors. The design procedure for these components is described, and their performance characterized by DC or scattering parameter measurements as appropriate. Two types of MMIC RTD oscillator layouts were designed, fabricated and characterized. Details are described in this thesis. Measurement results showed that for the fabricated 75 GHz oscillator, the output power obtained was -0.2 dBm (0.96 mW), and for the 86 GHz oscillator, the measured output power was -4.6 dBm (0.35 mW), both of which, to the author's knowledge, were the highest power for published indium phosphide (InP)-based RTD oscillators operating in the W-band frequency range