Design and Analysis of Electromagnetic Interference Filters and Shields

Electromagnetic interference (EMI) is a problem of rising prevalence as electronic devices become increasingly ubiquitous. EMI filters are low pass filters intended to prevent the conducted electric currents and radiated electromagnetic fields of a device from interfering with the proper operation of other devices. Shielding is a method, often complementary to filtering, that typically involves enclosing a device in a conducting box in order to prevent radiated EMI. This dissertation includes three chapters related to the use of filtering and shielding for preventing electromagnetic interference. The first chapter deals with improving the high frequency EMI filtering performance of surface mount capacitors on printed circuit boards (PCBs). At high frequencies, the impedance of a capacitor is dominated by a parasitic inductance, thus leading to poor high frequency filtering performance. Other researchers have introduced the concept of parasitic inductance cancellation and have applied this concept to improving the filtering performance of volumetrically large capacitors at frequencies up to 100 MHz. The work in this chapter applies the concept of parasitic inductance cancellation to much smaller surface mount capacitors at frequencies up to several gigahertz. The second chapter introduces a much more compact design for applying parasitic inductance cancellation to surface mount capacitors that uses inductive coupling between via pairs as well as coplanar traces. This new design is suited for PCBs having three or more layers including solid ground and/or power plane(s). This design is demonstrated to be considerably more effective in filtering high frequency noise due to crosstalk than a comparable conventional shunt capacitor filter configuration. Finally, chapter 3 presents a detailed analysis of the methods that are used to decompose the measure of plane wave shielding effectiveness into measures of absorption and reflection. Textbooks on electromagnetic compatibility commonly decompose shielding effectiveness into what is called the Schelkunoff decomposition in this work with terms called penetration loss, reflection loss, and the internal reflections correction term. In experimentally characterizing the shielding properties of materials, however, other decompositions are commonly used. This chapter analyzes the relationships between these different decompositions and two-port network parameters and shows that other decompositions offer terms that are better figures of merit than the terms of the Schelkunoff decomposition in experimental situations

Lead-free piezoceramics - Where to move on?

Lead-free piezoceramics aiming at replacing the market-dominant lead-based ones have been extensively searched for more than a decade worldwide. Some noteworthy outcomes such as the advent of commercial products for certain applications have been reported, but the goal, i.e., the invention of a lead-free piezocermic, the performance of which is equivalent or even superior to that of PZT-based piezoceramics, does not seem to be fulfilled yet. Nevertheless, the academic effort already seems to be culminated, waiting for a guideline to a future research direction. We believe that a driving force for a restoration of this research field needs to be found elsewhere, for example, intimate collaborations with related industries. For this to be effectively realized, it would be helpful for academic side to understand the interests and demands of the industry side as well as to provide the industry with new scientific insights that would eventually lead to new applications. Therefore, this review covers some of the issues that are to be studied further and deeper, so-to-speak, lessons from the history of piezoceramics, and some technical issues that could be useful in better understanding the industry demands. As well, the efforts made in the industry side will be briefly introduced for the academic people to catch up with the recent trends and to be guided for setting up their future research direction effectively.ope

Design and develop a MOS magnetic memory Final report, 11 Mar. - 11 Sep. 1966

Interface problems between plated wire magnetic memory and MO

High-frequency characterization of embedded components in printed circuit boards

The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance

Impedance Transformers

Non

Electromagnetic Interference and Compatibility

Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

This article presents a full-wave method to characterize lossy conductors in an interconnect setting. To this end, a novel and accurate differential surface admittance operator for cuboids based on entire domain basis functions is formulated. By combining this new operator with the augmented electric field integral equation, a comprehensive broadband characterization is obtained. Compared with the state of the art in differential surface admittance operator modeling, we prove the accuracy and improved speed of the novel formulation. Additional examples support these conclusions by comparing the results with commerical software tools and with measurements