Bonding and adjoining technology: A compilation

This compilation covers NASA and AEC developed techniques covering bonding, brazing, and joining methods and technology

Update - Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bond technology developments continue to be a subject of technical interest to the NASA (National Aeronautics and Space Administration) NEPP (NASA Electronic Parts and Packaging Program) which funded this update. Based on this new research, additional copper bond wire vulnerabilities were found in the literature - Crevice corrosion, intrinsic degradation of palladium coated copper wire, congregation of palladium near ball bond interface leading to failure, residual aluminum pad metallization impact on device lifetimes, stitch cracking phenomena, package delamination's that have resulted in wire bond failures and device failure due to elemental sulfur. A search of the U.S.A. patent web site found 3 noteworthy patents on the following developments: claim of a certain IMC (Intermetallic Compound) thickness as a mitigation solution to chlorine corrosion; claim of using materials with different pHs to neutralize contaminants in a package containing copper wire bonds; and a discussion on ball shear test threshold values for different applications. In addition, an aerospace contractor of military hardware had a presentation on copper bond wires where it was reported that there was a parametric shift and noise susceptibility of devices with copper bond wires which affected legacy design performance. A review of silver bond wire (another emerging technology) technical papers found that an electromigration failure mechanism was evident in device applications that operate under high current conditions. More studies may need to be performed on a comprehensive basis. Research areas for consideration are suggested, however, these research and or qualification/standard test areas are not all inclusive and should not be construed as the element (s) that delivers any potential copper wire bond solution. A false sense of security may occur, whenever there is a reliance on passing any particular qualification, standard, or test protocol

A review of advances in pixel detectors for experiments with high rate and radiation

The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy

Semiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages

State of the art technologies for front-end hybrids

The front-end hybrids for solid state and gas detectors will be crucial components of the next generation particle detectors. Requirements such as high-density and high-speed interconnects, low mass, radiation resistance, high-current and high-power dissipation capabilities are examples of the challenges to be solved concurrently. The technologies for front-end hybrids developed at CERN are presented and future possibilities such as embedding active and passive circuits are described. Comments are made concerning the ability to use these technologies for large scale production by industry

A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress

Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive literature review from previous study. The strength on different interconnection materials of wire (gold and aluminum) and bond pad (copper and aluminum) after temperature cycle is investigated by using DMAIC methodology. The study is started with the reliability test with various Temperature Cycle (TC) stress and Failure Analysis testing was carried out to collect the wire pull strength value and ball shear strength value of different device

E-Textiles. Study of the interaction between devices, connection methods and substrates

It is common knowledge that textiles and textile products are available in different forms along the textile chain. However, right now, all the attention is paid to the relationship between these materials and the most recent developments in the world of electronics. When a garment is implementing electronic components, ranging from sensors to conductor paths, that are applied or integrated into the textile surface, it’s commonly called an E-Textile. Nowadays there is a continuous demand for these products because they can satisfy a great extent of needs without interfering too much with the user’s life or without the obligation of modifying too much the original product in the beginning. This study, however, focuses on analyzing the interaction and interactivity which allows electronic communication between the components present in the textiles. It is believed that there is a knowledge gap in these most recent developments. In this paper, a literature investigation is carried out using various databases, which resulted in different contributions to the researched subjects. Also, an overview of materials, production technologies and testing methods is given. The concepts of smart and e-textile, textile structure, conductive materials, electronic communication and connection are classified. The influencing factors on the properties of the material structure are presented and a discussion is made referring to the potentials and challenges related to e-textiles. Finally, a brief consideration of sustainability and environmental aspects is done and, in the end, the main conclusions of the investigation are stated. The main focus of the research lies in defining processes and material properties for improving connection techniques between the textiles and the electronic components, and also between the components themselves. Only limited research will be conducted on simulating the behavior of these technologies. Various ideas for applications exist, starting from ones of classical nature (flexural rigid materials), to 3d printed additive manufacturing or other ones of a textile nature in the form of embroidered conductor paths. Unluckily little research has been conducted on real applications. Therefore, the challenges are only identified, and future research directions are derive

A survey of carbon nanotube interconnects for energy efficient integrated circuits

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design