285 research outputs found

    Configurable 3D-integrated focal-plane sensor-processor array architecture

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    A mixed-signal Cellular Visual Microprocessor architecture with digital processors is described. An ASIC implementation is also demonstrated. The architecture is composed of a regular sensor readout circuit array, prepared for 3D face-to-face type integration, and one or several cascaded array of mainly identical (SIMD) processing elements. The individual array elements derived from the same general HDL description and could be of different in size, aspect ratio, and computing resources

    COMPARISON OF FEASIBILITY OF RISK MONITORING IN BUILDINGS IN TWO WIRELESS SENSOR NETWORK: MICA MOTE AND MEMS

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    In this paper feasibility of risk monitoring of buildings in two wireless sensor network is presented,firstly by using MICA Mote and then by MEMS.Also,it will be verified that the MEMS sensors are superior as it provides high quality sensor data and no data loss as compared to MICA Mote.In order to assess earthquakes the structures is monitored firstly by using a smart sensor based on the Berkeley Moteplatform.The Mote has on-board microprocessor and ready-made wireless communication capabilities. In this paper, the performance of the Mote is investigated through shakingtable tests employing a two-story steel structur. The feasibility of risk monitoring for buildings is also discussed.In building monitoring using MEMS,a low power wireless network employing capacitive MEMS which is custom-developed,3D accelerated sensor and a low power readout ASIC is used at the sensor nodes.After the the earthquake, the plastic hinge activation of structure is being measured using MEM sensor either periodically or on demand by the base station.During an earthquake the accelerometers are used to measure the seismic response of the structure. The seismic response is recorded by the accelerometer based on the local acceleration data and remote triggering from the base station.The base station is based on acceleration data from multiple sensors across the structure.In a 800 MHZ band,a low power architecture had been implemented over an 802.15.4 MAC

    Contactless Testing of Circuit Interconnects

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    Silicon Germanium SRAM and ROM Designs for Wide Temperature Range Space Applications

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    This thesis presents a design flow from specifications and feature requirements to embeddable blocks of SRAM and ROM designs from 64 bytes to 1 kilobyte that are suitable for lunar environments. The design uses the IBM SiGe 5AM BiCMOS 0.5 micron process for a synchronous memory system capable of operating at a clock frequency of 25 MHz. Radiation mitigation techniques are discussed and implemented to harden the design against total ionizing dose (TID), single-event upset (SEU), and single-event latch-up (SEL). The memory arrays are also designed to operate over the wide temperature range of -180 °C to 125 °C. Design, simulation, and physical layout are evaluated throughout the process. Modeling of the memory arrays for static timing analysis (STA) is done to allow easy integration of the design into a typical RTL design flow. System simulation data is incorporated into block-level simulations to validate the memory timing models. Hardware testing over five iterations of the memory array designs demonstrates the functionality of the design as well as validates the design specifications

    Iddq testing of a CMOS 10-bit charge scaling digital-to-analog converter

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    This work presents an effective built-in current sensor (BICS), which has a very small impact on the performance of the circuit under test (CUT). The proposed BICS works in two-modes the normal mode and the test mode. In the normal mode the BICS is isolated from the CUT due to which there is no performance degradation of the CUT. In the testing mode, our BICS detects the abnormal current caused by permanent manufacturing defects. Further more our BICS can also distinguish the type of defect induced (Gate-source short, source-drain short and drain-gate short). Our BICS requires neither an external voltage source nor current source. Hence the BICS requires less area and is more efficient than the conventional current sensors. The circuit under test is a 10-bit digital to analog converter using charge-scaling architecture

    Low-Power High-Performance Ternary Content Addressable Memory Circuits

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    Ternary content addressable memories (TCAMs) are hardware-based parallel lookup tables with bit-level masking capability. They are attractive for applications such as packet forwarding and classification in network routers. Despite the attractive features of TCAMs, high power consumption is one of the most critical challenges faced by TCAM designers. This work proposes circuit techniques for reducing TCAM power consumption. The main contribution of this work is divided in two parts: (i) reduction in match line (ML) sensing energy, and (ii) static-power reduction techniques. The ML sensing energy is reduced by employing (i) positive-feedback ML sense amplifiers (MLSAs), (ii) low-capacitance comparison logic, and (iii) low-power ML-segmentation techniques. The positive-feedback MLSAs include both resistive and active feedback to reduce the ML sensing energy. A body-bias technique can further improve the feedback action at the expense of additional area and ML capacitance. The measurement results of the active-feedback MLSA show 50-56% reduction in ML sensing energy. The measurement results of the proposed low-capacitance comparison logic show 25% and 42% reductions in ML sensing energy and time, respectively, which can further be improved by careful layout. The low-power ML-segmentation techniques include dual ML TCAM and charge-shared ML. Simulation results of the dual ML TCAM that connects two sides of the comparison logic to two ML segments for sequential sensing show 43% power savings for a small (4%) trade-off in the search speed. The charge-shared ML scheme achieves power savings by partial recycling of the charge stored in the first ML segment. Chip measurement results show that the charge-shared ML scheme results in 11% and 9% reductions in ML sensing time and energy, respectively, which can be improved to 19-25% by using a digitally controlled charge sharing time-window and a slightly modified MLSA. The static power reduction is achieved by a dual-VDD technique and low-leakage TCAM cells. The dual-VDD technique trades-off the excess noise margin of MLSA for smaller cell leakage by applying a smaller VDD to TCAM cells and a larger VDD to the peripheral circuits. The low-leakage TCAM cells trade off the speed of READ and WRITE operations for smaller cell area and leakage. Finally, design and testing of a complete TCAM chip are presented, and compared with other published designs

    Wireless Sensor System for Recycling

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    The motivation of this thesis was to research and design a prototype model of a wireless sensor network application, to be used as an automated detection infrastructure in recycling environment. The initial idea was to measure the level of the surface in a recycling container and transmit the information through a wireless communication system. The prototype is an initial step for recycling companies for building an automated detection network. Background of the research strongly supports the accomplished prototype. Study includes description of wireless environment with its problems and challenges. It proceeds with consideration of suitable wireless standards and considers most convenient sensor methods for recycling environment. Eventually document presents the prototype combining the studied entities. As a result, the prototype has two main operating parts: the wireless communication network and sensors. The network was realized with ZigBee standard by using two radio chips as communication nodes. Second communication node is attached to a recycling container and combined with two ultrasound sensors. This node includes a soft-ware algorithm, which is polling the state of the sensors regularly and deciding if the container is full. The node proceeds to transmission of the information to other communication node. This node is connected to computer and will transmit the information to be used by the recycling organization.fi=OpinnÀytetyö kokotekstinÀ PDF-muodossa.|en=Thesis fulltext in PDF format.|sv=LÀrdomsprov tillgÀngligt som fulltext i PDF-format

    Test analysis & fault simulation of microfluidic systems

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    This work presents a design, simulation and test methodology for microfluidic systems, with particular focus on simulation for test. A Microfluidic Fault Simulator (MFS) has been created based around COMSOL which allows a fault-free system model to undergo fault injection and provide test measurements. A post MFS test analysis procedure is also described.A range of fault-free system simulations have been cross-validated to experimental work to gauge the accuracy of the fundamental simulation approach prior to further investigation and development of the simulation and test procedure.A generic mechanism, termed a fault block, has been developed to provide fault injection and a method of describing a low abstraction behavioural fault model within the system. This technique has allowed the creation of a fault library containing a range of different microfluidic fault conditions. Each of the fault models has been cross-validated to experimental conditions or published results to determine their accuracy.Two test methods, namely, impedance spectroscopy and Levich electro-chemical sensors have been investigated as general methods of microfluidic test, each of which has been shown to be sensitive to a multitude of fault. Each method has successfully been implemented within the simulation environment and each cross-validated by first-hand experimentation or published work.A test analysis procedure based around the Neyman-Pearson criterion has been developed to allow a probabilistic metric for each test applied for a given fault condition, providing a quantitive assessment of each test. These metrics are used to analyse the sensitivity of each test method, useful when determining which tests to employ in the final system. Furthermore, these probabilistic metrics may be combined to provide a fault coverage metric for the complete system.The complete MFS method has been applied to two system cases studies; a hydrodynamic “Y” channel and a flow cytometry system for prognosing head and neck cancer.Decision trees are trained based on the test measurement data and fault conditions as a means of classifying the systems fault condition state. The classification rules created by the decision trees may be displayed graphically or as a set of rules which can be loaded into test instrumentation. During the course of this research a high voltage power supply instrument has been developed to aid electro-osmotic experimentation and an impedance spectrometer to provide embedded test

    Programmable CMOS Analog-to-Digital Converter Design and Testability

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    In this work, a programmable second order oversampling CMOS delta-sigma analog-to-digital converter (ADC) design in 0.5”m n-well CMOS processes is presented for integration in sensor nodes for wireless sensor networks. The digital cascaded integrator comb (CIC) decimation filter is designed to operate at three different oversampling ratios of 16, 32 and 64 to give three different resolutions of 9, 12 and 14 bits, respectively which impact the power consumption of the sensor nodes. Since the major part of power consumed in the CIC decimator is by the integrators, an alternate design is introduced by inserting coder circuits and reusing the same integrators for different resolutions and oversampling ratios to reduce power consumption. The measured peak signal-to-noise ratio (SNR) for the designed second order delta-sigma modulator is 75.6dB at an oversampling ratio of 64, 62.3dB at an oversampling ratio of 32 and 45.3dB at an oversampling ratio of 16. The implementation of a built-in current sensor (BICS) which takes into account the increased background current of defect-free circuits and the effects of process variation on ΔIDDQ testing of CMOS data converters is also presented. The BICS uses frequency as the output for fault detection in CUT. A fault is detected when the output frequency deviates more than ±10% from the reference frequency. The output frequencies of the BICS for various model parameters are simulated to check for the effect of process variation on the frequency deviation. A design for on-chip testability of CMOS ADC by linear ramp histogram technique using synchronous counter as register in code detection unit (CDU) is also presented. A brief overview of the histogram technique, the formulae used to calculate the ADC parameters, the design implemented in 0.5”m n-well CMOS process, the results and effectiveness of the design are described. Registers in this design are replaced by 6T-SRAM cells and a hardware optimized on-chip testability of CMOS ADC by linear ramp histogram technique using 6T-SRAM as register in CDU is presented. The on-chip linear ramp histogram technique can be seamlessly combined with ΔIDDQ technique for improved testability, increased fault coverage and reliable operation
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