1,897 research outputs found

    Product assurance technology for custom LSI/VLSI electronics

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    The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

    A 300-800MHz Tunable Filter and Linearized LNA applied in a Low-Noise Harmonic-Rejection RF-Sampling Receiver

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    A multiband flexible RF-sampling receiver aimed at software-defined radio is presented. The wideband RF sampling function is enabled by a recently proposed discrete-time mixing downconverter. This work exploits a voltage-sensing LNA preceded by a tunable LC pre-filter with one external coil to demonstrate an RF-sampling receiver with low noise figure (NF) and high harmonic rejection (HR). The second-order LC filter provides voltage pre-gain and attenuates the source noise aliasing, and it also improves the HR ratio of the sampling downconverter. The LNA consists of a simple amplifier topology built from inverters and resistors to improve the third-order nonlinearity via an enhanced voltage mirror technique. The RF-sampling receiver employs 8 times oversampling covering 300 to 800 MHz in two RF sub-bands. The chip is realized in 65 nm CMOS and the measured gain across the band is between 22 and 28 dB, while achieving a NF between 0.8 to 4.3 dB. The IIP2 varies between +38 and +49 dBm and the IIP3 between -14 dBm and -9 dBm, and the third and fifth order HR ratios are more than 60 dB. The LNA and downconverter consumes 6 mW, and the clock generator takes 12 mW at 800 MHz RF.\ud \u

    Negative Bias Temperature Instability And Charge Trapping Effects On Analog And Digital Circuit Reliability

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    Nanoscale p-channel transistors under negative gate bias at an elevated temperature show threshold voltage degradation after a short period of stress time. In addition, nanoscale (45 nm) n-channel transistors using high-k (HfO2) dielectrics to reduce gate leakage power for advanced microprocessors exhibit fast transient charge trapping effect leading to threshold voltage instability and mobility reduction. A simulation methodology to quantify the circuit level degradation subjected to negative bias temperature instability (NBTI) and fast transient charge trapping effect has been developed in this thesis work. Different current mirror and two-stage operation amplifier structures are studied to evaluate the impact of NBTI on CMOS analog circuit performances for nanoscale applications. Fundamental digital circuit such as an eleven-stage ring oscillator has also been evaluated to examine the fast transient charge transient effect of HfO2 high-k transistors on the propagation delay of ring oscillator performance. The preliminary results show that the negative bias temperature instability reduces the bandwidth of CMOS operating amplifiers, but increases the amplifier\u27s voltage gain at mid-frequency range. The transient charge trapping effect increases the propagation delay of ring oscillator. The evaluation methodology developed in this thesis could be extended to study other CMOS device and circuit reliability issues subjected to electrical and temperature stresses

    Negative Bias Temperature Instability And Charge Trapping Effects On Analog And Digital Circuit Reliability

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    Nanoscale p-channel transistors under negative gate bias at an elevated temperature show threshold voltage degradation after a short period of stress time. In addition, nanoscale (45 nm) n-channel transistors using high-k (HfO2) dielectrics to reduce gate leakage power for advanced microprocessors exhibit fast transient charge trapping effect leading to threshold voltage instability and mobility reduction. A simulation methodology to quantify the circuit level degradation subjected to negative bias temperature instability (NBTI) and fast transient charge trapping effect has been developed in this thesis work. Different current mirror and two-stage operation amplifier structures are studied to evaluate the impact of NBTI on CMOS analog circuit performances for nanoscale applications. Fundamental digital circuit such as an eleven-stage ring oscillator has also been evaluated to examine the fast transient charge transient effect of HfO2 high-k transistors on the propagation delay of ring oscillator performance. The preliminary results show that the negative bias temperature instability reduces the bandwidth of CMOS operating amplifiers, but increases the amplifier\u27s voltage gain at mid-frequency range. The transient charge trapping effect increases the propagation delay of ring oscillator. The evaluation methodology developed in this thesis could be extended to study other CMOS device and circuit reliability issues subjected to electrical and temperature stresses

    Static noise margin analysis for CMOS logic cells in near-threshold

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    The advancement of semiconductor technology enabled the fabrication of devices with faster switching activity and chips with higher integration density. However, these advances are facing new impediments related to energy and power dissipation. Besides, the increasing demand for portable devices leads the circuit design paradigm to prioritize energy efficiency instead of performance. Altogether, this scenario motivates engineers towards reducing the supply voltage to the near and subthreshold regime to increase the lifespan of battery-powered devices. Even though operating in these regime offer interesting energy-frequency trade-offs, it brings challenges concerning noise tolerance. As the supply voltage reduces, the available noise margins decrease, and circuits become more prone to functional failures. In addition, near and subthreshold circuits are more susceptible to manufacturing variability, hence further aggravating noise issues. Other issues, such as wire minimization and gate fan-out, also contribute to the relevance of evaluating the noise margin of circuits early in the design Accordingly, this work investigates how to improve the static noise margin of digital synchronous circuits that will operate at the near/subthreshold regime. This investigation produces a set of three original contributions. The first is an automated tool to estimate the static noise margin of CMOS combinational cells. The second contribution is a realistic static noise margin estimation methodology that considers process-voltage-temperature variations. Results show that the proposed methodology allows to reduce up to 70% of the static noise margin pessimism. Finally, the third contribution is the noise-aware cell design methodology and the inclusion of a noise evaluation of complex circuits during the logic synthesis. The resulting library achieved higher static noise margin (up to 24%) and less spread among different cells (up to 62%).Os avanços na tecnologia de semicondutores possibilitou que se fabricasse dispositivos com atividade de chaveamento mais rápida e com maior capacidade de integração de transistores. Estes avanços, todavia, impuseram novos empecilhos relacionados com a dissipação de potência e energia. Além disso, a crescente demanda por dispositivos portáteis levaram à uma mudança no paradigma de projeto de circuitos para que se priorize energia ao invés de desempenho. Este cenário motivou à reduzir a tensão de alimentação com qual os dispositivos operam para um regime próximo ou abaixo da tensão de limiar, com o objetivo de aumentar sua duração de bateria. Apesar desta abordagem balancear características de performance e energia, ela traz novos desafios com relação a tolerância à ruído. Ao reduzirmos a tensão de alimentação, também reduz-se a margem de ruído disponível e, assim, os circuitos tornam-se mais suscetíveis à falhas funcionais. Somado à este efeito, circuitos com tensões de alimentação nestes regimes são mais sensíveis à variações do processo de fabricação, logo agravando problemas com ruído. Existem também outros aspectos, tais como a miniaturização das interconexões e a relação de fan-out de uma célula digital, que incentivam a avaliação de ruído nas fases iniciais do projeto de circuitos integrados Por estes motivos, este trabalho investiga como aprimorar a margem de ruído estática de circuitos síncronos digitais que irão operar em tensões no regime de tensão próximo ou abaixo do limiar. Esta investigação produz um conjunto de três contribuições originais. A primeira é uma ferramenta capaz de avaliar automaticamente a margem de ruído estática de células CMOS combinacionais. A segunda contribuição é uma metodologia realista para estimar a margem de ruído estática considerando variações de processo, tensão e temperatura. Os resultados obtidos mostram que a metodologia proposta permitiu reduzir até 70% do pessimismo das margens de ruído estática, Por último, a terceira contribuição é um fluxo de projeto de células combinacionais digitais considerando ruído, e uma abordagem para avaliar a margem de ruído estática de circuitos complexos durante a etapa de síntese lógica. A biblioteca de células resultante deste fluxo obteve maior margem de ruído (até 24%) e menor variação entre diferentes células (até 62%)

    Statistical circuit simulations - from ‘atomistic’ compact models to statistical standard cell characterisation

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    This thesis describes the development and application of statistical circuit simulation methodologies to analyse digital circuits subject to intrinsic parameter fluctuations. The specific nature of intrinsic parameter fluctuations are discussed, and we explain the crucial importance to the semiconductor industry of developing design tools which accurately account for their effects. Current work in the area is reviewed, and three important factors are made clear: any statistical circuit simulation methodology must be based on physically correct, predictive models of device variability; the statistical compact models describing device operation must be characterised for accurate transient analysis of circuits; analysis must be carried out on realistic circuit components. Improving on previous efforts in the field, we posit a statistical circuit simulation methodology which accounts for all three of these factors. The established 3-D Glasgow atomistic simulator is employed to predict electrical characteristics for devices aimed at digital circuit applications, with gate lengths from 35 nm to 13 nm. Using these electrical characteristics, extraction of BSIM4 compact models is carried out and their accuracy in performing transient analysis using SPICE is validated against well characterised mixed-mode TCAD simulation results for 35 nm devices. Static d.c. simulations are performed to test the methodology, and a useful analytic model to predict hard logic fault limitations on CMOS supply voltage scaling is derived as part of this work. Using our toolset, the effect of statistical variability introduced by random discrete dopants on the dynamic behaviour of inverters is studied in detail. As devices scaled, dynamic noise margin variation of an inverter is increased and higher output load or input slew rate improves the noise margins and its variation. Intrinsic delay variation based on CV/I delay metric is also compared using ION and IEFF definitions where the best estimate is obtained when considering ION and input transition time variations. Critical delay distribution of a path is also investigated where it is shown non-Gaussian. Finally, the impact of the cell input slew rate definition on the accuracy of the inverter cell timing characterisation in NLDM format is investigated

    Techniques of Energy-Efficient VLSI Chip Design for High-Performance Computing

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    How to implement quality computing with the limited power budget is the key factor to move very large scale integration (VLSI) chip design forward. This work introduces various techniques of low power VLSI design used for state of art computing. From the viewpoint of power supply, conventional in-chip voltage regulators based on analog blocks bring the large overhead of both power and area to computational chips. Motivated by this, a digital based switchable pin method to dynamically regulate power at low circuit cost has been proposed to make computing to be executed with a stable voltage supply. For one of the widely used and time consuming arithmetic units, multiplier, its operation in logarithmic domain shows an advantageous performance compared to that in binary domain considering computation latency, power and area. However, the introduced conversion error reduces the reliability of the following computation (e.g. multiplication and division.). In this work, a fast calibration method suppressing the conversion error and its VLSI implementation are proposed. The proposed logarithmic converter can be supplied by dc power to achieve fast conversion and clocked power to reduce the power dissipated during conversion. Going out of traditional computation methods and widely used static logic, neuron-like cell is also studied in this work. Using multiple input floating gate (MIFG) metal-oxide semiconductor field-effect transistor (MOSFET) based logic, a 32-bit, 16-operation arithmetic logic unit (ALU) with zipped decoding and a feedback loop is designed. The proposed ALU can reduce the switching power and has a strong driven-in capability due to coupling capacitors compared to static logic based ALU. Besides, recent neural computations bring serious challenges to digital VLSI implementation due to overload matrix multiplications and non-linear functions. An analog VLSI design which is compatible to external digital environment is proposed for the network of long short-term memory (LSTM). The entire analog based network computes much faster and has higher energy efficiency than the digital one

    Silicon-on-Insulator Power Management Integrated Circuit for Thin-Film Solid-State Lithium-Ion Micro-Batteries

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    This thesis presents the design and implementation of a power management integrated circuit (IC) that is capable of both current and voltage charging thin-film, solid-state, lithium-ion micro-batteries. The power management system has been fabricated using a single-poly, 0.35-ìm, partially-depleted, silicon-on-insulator process (PD-SOI). The system contains a temperature stable current charger (current generator and a 4-bit current-mode DAC), a regulated voltage supply (voltage amplifier), and a voltage monitoring circuit (2-bit flash ADC). Experimental results of the first version of the power management system show proper functionality was obtained. The current charger produced a 2% worst-case variation in output current over the temperature range 0–100°C. The regulated voltage output was measured to be 4.4 V and the digital outputs of the flash ADC transitioned at 3.45 and 4.76 V

    The Characterization of a CMOS Radiation Hardened-by-Design Circuit Technique

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    This thesis presents the analysis, implementation and testing of a circuit-level radiation hardened-by-design (RHBD) technique first presented in [1]. Radiation effects heavily influence the cost and design of electronics bound for radiation-rich environments such as in nuclear reactors or space. The circuit-level RHBD technique is presented as a cost-effective way to mitigate total-ionizing dose (TID) radiation in digital complementary metal-oxide-semiconductor (CMOS) transistor circuits. These claims are analyzed and experimentally tested. Devices from a relatively old and a newer semiconductor fabrication process are tested to investigate the impact of device scaling on the RHBD technique’s effectiveness. A rad-tolerant frequency synthesizer that implements this technique is discussed. Challenges in the project included implementing efficient testing procedures at the radiation test facilities. Testing time was limited and in-situ­ test methodologies utilizing LabView programs were used effectively

    A Charge-Recycling Scheme and Ultra Low Voltage Self-Startup Charge Pump for Highly Energy Efficient Mixed Signal Systems-On-A-Chip

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    The advent of battery operated sensor-based electronic systems has provided a pressing need to design energy-efficient, ultra-low power integrated circuits as a means to improve the battery lifetime. This dissertation describes a scheme to lower the power requirement of a digital circuit through the use of charge-recycling and dynamic supply-voltage scaling techniques. The novel charge-recycling scheme proposed in this research demonstrates the feasibility of operating digital circuits using the charge scavenged from the leakage and dynamic load currents inherent to digital design. The proposed scheme efficiently gathers the “ground-bound” charge into storage capacitor banks. This reclaimed charge is then subsequently recycled to power the source digital circuit. The charge-recycling methodology has been implemented on a 12-bit Gray-code counter operating at frequencies of less than 50 MHz. The circuit has been designed in a 90-nm process and measurement results reveal more than 41% reduction in the average energy consumption of the counter. The total energy savings including the power consumed for the generation of control signals aggregates to an average of 23%. The proposed methodology can be applied to an existing digital path without any design change to the circuit but with only small loss to the performance. Potential applications of this scheme are described, specifically in wide-temperature dynamic power reduction and as a source for energy harvesters. The second part of this dissertation deals with the design and development of a self-starting, ultra-low voltage, switched-capacitor (SC) DC-DC converter that is essential to an energy harvesting system. The proposed charge-pump based SC-converter operates from 125-mV input and thus enables battery-less operation in ultra-low voltage energy harvesters. The charge pump does not require any external components or expensive post-fabrication processing to enable low-voltage operation. This design has been implemented in a 130-nm CMOS process. While the proposed charge pump provides significant efficiency enhancement in energy harvesters, it can also be incorporated within charge recycling systems to facilitate adaptable charge-recycling levels. In total, this dissertation provides key components needed for highly energy-efficient mixed signal systems-on-a-chip
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