Asynchronous Early Output Dual-Bit Full Adders Based on Homogeneous and Heterogeneous Delay-Insensitive Data Encoding

This paper presents the designs of asynchronous early output dual-bit full adders without and with redundant logic (implicit) corresponding to homogeneous and heterogeneous delay-insensitive data encoding. For homogeneous delay-insensitive data encoding only dual-rail i.e. 1-of-2 code is used, and for heterogeneous delay-insensitive data encoding 1-of-2 and 1-of-4 codes are used. The 4-phase return-to-zero protocol is used for handshaking. To demonstrate the merits of the proposed dual-bit full adder designs, 32-bit ripple carry adders (RCAs) are constructed comprising dual-bit full adders. The proposed dual-bit full adders based 32-bit RCAs incorporating redundant logic feature reduced latency and area compared to their non-redundant counterparts with no accompanying power penalty. In comparison with the weakly indicating 32-bit RCA constructed using homogeneously encoded dual-bit full adders containing redundant logic, the early output 32-bit RCA comprising the proposed homogeneously encoded dual-bit full adders with redundant logic reports corresponding reductions in latency and area by 22.2% and 15.1% with no associated power penalty. On the other hand, the early output 32-bit RCA constructed using the proposed heterogeneously encoded dual-bit full adder which incorporates redundant logic reports respective decreases in latency and area than the weakly indicating 32-bit RCA that consists of heterogeneously encoded dual-bit full adders with redundant logic by 21.5% and 21.3% with nil power overhead. The simulation results obtained are based on a 32/28nm CMOS process technology

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Measurements, Models, Systems and Design

531 s.

Communications techniques and equipment: A compilation

This Compilation is devoted to equipment and techniques in the field of communications. It contains three sections. One section is on telemetry, including articles on radar and antennas. The second section describes techniques and equipment for coding and handling data. The third and final section includes descriptions of amplifiers, receivers, and other communications subsystems

Survey of Inter-satellite Communication for Small Satellite Systems: Physical Layer to Network Layer View

Small satellite systems enable whole new class of missions for navigation, communications, remote sensing and scientific research for both civilian and military purposes. As individual spacecraft are limited by the size, mass and power constraints, mass-produced small satellites in large constellations or clusters could be useful in many science missions such as gravity mapping, tracking of forest fires, finding water resources, etc. Constellation of satellites provide improved spatial and temporal resolution of the target. Small satellite constellations contribute innovative applications by replacing a single asset with several very capable spacecraft which opens the door to new applications. With increasing levels of autonomy, there will be a need for remote communication networks to enable communication between spacecraft. These space based networks will need to configure and maintain dynamic routes, manage intermediate nodes, and reconfigure themselves to achieve mission objectives. Hence, inter-satellite communication is a key aspect when satellites fly in formation. In this paper, we present the various researches being conducted in the small satellite community for implementing inter-satellite communications based on the Open System Interconnection (OSI) model. This paper also reviews the various design parameters applicable to the first three layers of the OSI model, i.e., physical, data link and network layer. Based on the survey, we also present a comprehensive list of design parameters useful for achieving inter-satellite communications for multiple small satellite missions. Specific topics include proposed solutions for some of the challenges faced by small satellite systems, enabling operations using a network of small satellites, and some examples of small satellite missions involving formation flying aspects.Comment: 51 pages, 21 Figures, 11 Tables, accepted in IEEE Communications Surveys and Tutorial