On Fault Tolerance Methods for Networks-on-Chip

Technology scaling has proceeded into dimensions in which the reliability of manufactured devices is becoming endangered. The reliability decrease is a consequence of physical limitations, relative increase of variations, and decreasing noise margins, among others. A promising solution for bringing the reliability of circuits back to a desired level is the use of design methods which introduce tolerance against possible faults in an integrated circuit. This thesis studies and presents fault tolerance methods for network-onchip (NoC) which is a design paradigm targeted for very large systems-onchip. In a NoC resources, such as processors and memories, are connected to a communication network; comparable to the Internet. Fault tolerance in such a system can be achieved at many abstraction levels. The thesis studies the origin of faults in modern technologies and explains the classification to transient, intermittent and permanent faults. A survey of fault tolerance methods is presented to demonstrate the diversity of available methods. Networks-on-chip are approached by exploring their main design choices: the selection of a topology, routing protocol, and flow control method. Fault tolerance methods for NoCs are studied at different layers of the OSI reference model. The data link layer provides a reliable communication link over a physical channel. Error control coding is an efficient fault tolerance method especially against transient faults at this abstraction level. Error control coding methods suitable for on-chip communication are studied and their implementations presented. Error control coding loses its effectiveness in the presence of intermittent and permanent faults. Therefore, other solutions against them are presented. The introduction of spare wires and split transmissions are shown to provide good tolerance against intermittent and permanent errors and their combination to error control coding is illustrated. At the network layer positioned above the data link layer, fault tolerance can be achieved with the design of fault tolerant network topologies and routing algorithms. Both of these approaches are presented in the thesis together with realizations in the both categories. The thesis concludes that an optimal fault tolerance solution contains carefully co-designed elements from different abstraction levelsSiirretty Doriast

A Novel Encoding Scheme for Cross-Talk Effect Minimization Using Error Detecting and Correcting Codes

Abstract-In this paper a new bus encoding method presented for reducing crosstalk effects, which can avoid crosstalk and provide error-correcting as well. This method find a subset from cross talk avoidance code (CAC) to provide error correction which allows to reduce the crosstalk-induced delay with buses implementing an error detecting/correcting code. Here we propose Fibonacci representation of single error correcting codes using Hamming code to avoid crosstalk induced delay. Extra wires for checking bus are never required in the proposed method and it can also improve bus performance and reduce power dissipation. We give algorithms for obtaining optimal encodings and present a particular class of error free codes. Conversely other bus encoding techniques have been used to prevent crosstalk but don't correct error

Error Control Schemes for On-chip Communication Links: the energy-reliability trade-off

On-chip interconnection networks for future systems on chip (SoC) will have to deal with the increasing sensitivity of global wires to noise sources such as crosstalk or power supply noise. Hence, transient delay and logic faults are likely to reduce the reliability of across-chip communication. Given the reduced power budgets for SoCs, in this paper, we develop solutions for combined energy minimization and communication reliability control. Redundant bus coding is proved to be an effective technique for trading off energy against reliability, so that the most efficient scheme can be selected to meet predefined reliability requirements in a low signal-to-noise ratio regime. We model on-chip interconnects as noisy channels and evaluate the impact of two error recovery schemes on energy efficiency: correction at the receiver stage versus retransmission of corrupted data. The analysis is performed in a realistic SoC setting, and holds both for shared communication resources and for peer-to-peer links in a network of interconnects. We provide SoC designers with guidelines for the selection of energy efficient error-control schemes for communication architectures

Design of a fault tolerant airborne digital computer. Volume 1: Architecture

This volume is concerned with the architecture of a fault tolerant digital computer for an advanced commercial aircraft. All of the computations of the aircraft, including those presently carried out by analogue techniques, are to be carried out in this digital computer. Among the important qualities of the computer are the following: (1) The capacity is to be matched to the aircraft environment. (2) The reliability is to be selectively matched to the criticality and deadline requirements of each of the computations. (3) The system is to be readily expandable. contractible, and (4) The design is to appropriate to post 1975 technology. Three candidate architectures are discussed and assessed in terms of the above qualities. Of the three candidates, a newly conceived architecture, Software Implemented Fault Tolerance (SIFT), provides the best match to the above qualities. In addition SIFT is particularly simple and believable. The other candidates, Bus Checker System (BUCS), also newly conceived in this project, and the Hopkins multiprocessor are potentially more efficient than SIFT in the use of redundancy, but otherwise are not as attractive

New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs

Tesis por compendio[EN] Relevance of electronics towards safety of common devices has only been growing, as an ever growing stake of the functionality is assigned to them. But of course, this comes along the constant need for higher performances to fulfill such functionality requirements, while keeping power and budget low. In this scenario, industry is struggling to provide a technology which meets all the performance, power and price specifications, at the cost of an increased vulnerability to several types of known faults or the appearance of new ones. To provide a solution for the new and growing faults in the systems, designers have been using traditional techniques from safety-critical applications, which offer in general suboptimal results. In fact, modern embedded architectures offer the possibility of optimizing the dependability properties by enabling the interaction of hardware, firmware and software levels in the process. However, that point is not yet successfully achieved. Advances in every level towards that direction are much needed if flexible, robust, resilient and cost effective fault tolerance is desired. The work presented here focuses on the hardware level, with the background consideration of a potential integration into a holistic approach. The efforts in this thesis have focused several issues: (i) to introduce additional fault models as required for adequate representativity of physical effects blooming in modern manufacturing technologies, (ii) to provide tools and methods to efficiently inject both the proposed models and classical ones, (iii) to analyze the optimum method for assessing the robustness of the systems by using extensive fault injection and later correlation with higher level layers in an effort to cut development time and cost, (iv) to provide new detection methodologies to cope with challenges modeled by proposed fault models, (v) to propose mitigation strategies focused towards tackling such new threat scenarios and (vi) to devise an automated methodology for the deployment of many fault tolerance mechanisms in a systematic robust way. The outcomes of the thesis constitute a suite of tools and methods to help the designer of critical systems in his task to develop robust, validated, and on-time designs tailored to his application.[ES] La relevancia que la electrónica adquiere en la seguridad de los productos ha crecido inexorablemente, puesto que cada vez ésta copa una mayor influencia en la funcionalidad de los mismos. Pero, por supuesto, este hecho viene acompañado de una necesidad constante de mayores prestaciones para cumplir con los requerimientos funcionales, al tiempo que se mantienen los costes y el consumo en unos niveles reducidos. En este escenario, la industria está realizando esfuerzos para proveer una tecnología que cumpla con todas las especificaciones de potencia, consumo y precio, a costa de un incremento en la vulnerabilidad a múltiples tipos de fallos conocidos o la introducción de nuevos. Para ofrecer una solución a los fallos nuevos y crecientes en los sistemas, los diseñadores han recurrido a técnicas tradicionalmente asociadas a sistemas críticos para la seguridad, que ofrecen en general resultados sub-óptimos. De hecho, las arquitecturas empotradas modernas ofrecen la posibilidad de optimizar las propiedades de confiabilidad al habilitar la interacción de los niveles de hardware, firmware y software en el proceso. No obstante, ese punto no está resulto todavía. Se necesitan avances en todos los niveles en la mencionada dirección para poder alcanzar los objetivos de una tolerancia a fallos flexible, robusta, resiliente y a bajo coste. El trabajo presentado aquí se centra en el nivel de hardware, con la consideración de fondo de una potencial integración en una estrategia holística. Los esfuerzos de esta tesis se han centrado en los siguientes aspectos: (i) la introducción de modelos de fallo adicionales requeridos para la representación adecuada de efectos físicos surgentes en las tecnologías de manufactura actuales, (ii) la provisión de herramientas y métodos para la inyección eficiente de los modelos propuestos y de los clásicos, (iii) el análisis del método óptimo para estudiar la robustez de sistemas mediante el uso de inyección de fallos extensiva, y la posterior correlación con capas de más alto nivel en un esfuerzo por recortar el tiempo y coste de desarrollo, (iv) la provisión de nuevos métodos de detección para cubrir los retos planteados por los modelos de fallo propuestos, (v) la propuesta de estrategias de mitigación enfocadas hacia el tratamiento de dichos escenarios de amenaza y (vi) la introducción de una metodología automatizada de despliegue de diversos mecanismos de tolerancia a fallos de forma robusta y sistemática. Los resultados de la presente tesis constituyen un conjunto de herramientas y métodos para ayudar al diseñador de sistemas críticos en su tarea de desarrollo de diseños robustos, validados y en tiempo adaptados a su aplicación.[CA] La rellevància que l'electrònica adquireix en la seguretat dels productes ha crescut inexorablement, puix cada volta més aquesta abasta una major influència en la funcionalitat dels mateixos. Però, per descomptat, aquest fet ve acompanyat d'un constant necessitat de majors prestacions per acomplir els requeriments funcionals, mentre es mantenen els costos i consums en uns nivells reduïts. Donat aquest escenari, la indústria està fent esforços per proveir una tecnologia que complisca amb totes les especificacions de potència, consum i preu, tot a costa d'un increment en la vulnerabilitat a diversos tipus de fallades conegudes, i a la introducció de nous tipus. Per oferir una solució a les noves i creixents fallades als sistemes, els dissenyadors han recorregut a tècniques tradicionalment associades a sistemes crítics per a la seguretat, que en general oferixen resultats sub-òptims. De fet, les arquitectures empotrades modernes oferixen la possibilitat d'optimitzar les propietats de confiabilitat en habilitar la interacció dels nivells de hardware, firmware i software en el procés. Tot i això eixe punt no està resolt encara. Es necessiten avanços a tots els nivells en l'esmentada direcció per poder assolir els objectius d'una tolerància a fallades flexible, robusta, resilient i a baix cost. El treball ací presentat se centra en el nivell de hardware, amb la consideració de fons d'una potencial integració en una estratègia holística. Els esforços d'esta tesi s'han centrat en els següents aspectes: (i) la introducció de models de fallada addicionals requerits per a la representació adequada d'efectes físics que apareixen en les tecnologies de fabricació actuals, (ii) la provisió de ferramentes i mètodes per a la injecció eficient del models proposats i dels clàssics, (iii) l'anàlisi del mètode òptim per estudiar la robustesa de sistemes mitjançant l'ús d'injecció de fallades extensiva, i la posterior correlació amb capes de més alt nivell en un esforç per retallar el temps i cost de desenvolupament, (iv) la provisió de nous mètodes de detecció per cobrir els reptes plantejats pels models de fallades proposats, (v) la proposta d'estratègies de mitigació enfocades cap al tractament dels esmentats escenaris d'amenaça i (vi) la introducció d'una metodologia automatitzada de desplegament de diversos mecanismes de tolerància a fallades de forma robusta i sistemàtica. Els resultats de la present tesi constitueixen un conjunt de ferramentes i mètodes per ajudar el dissenyador de sistemes crítics en la seua tasca de desenvolupament de dissenys robustos, validats i a temps adaptats a la seua aplicació.Espinosa García, J. (2016). New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/73146TESISCompendi

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

High-level services for networks-on-chip

Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

Development Life Cycle

Security in the Software Life Cycle This article emphasizes how developers need to make additional, significant increases in their processes, by adding structure and repeatability to further the security and quality of their software. by Joe Jarzombek and Karen Mercedes Goertze