High-Performance Energy-Efficient and Reliable Design of Spin-Transfer Torque Magnetic Memory

In this dissertation new computing paradigms, architectures and design philosophy are proposed and evaluated for adopting the STT-MRAM technology as highly reliable, energy efficient and fast memory. For this purpose, a novel cross-layer framework from the cell-level all the way up to the system- and application-level has been developed. In these framework, the reliability issues are modeled accurately with appropriate fault models at different abstraction levels in order to analyze the overall failure rates of the entire memory and its Mean Time To Failure (MTTF) along with considering the temperature and process variation effects. Design-time, compile-time and run-time solutions have been provided to address the challenges associated with STT-MRAM. The effectiveness of the proposed solutions is demonstrated in extensive experiments that show significant improvements in comparison to state-of-the-art solutions, i.e. lower-power, higher-performance and more reliable STT-MRAM design

A Study on Performance and Power Efficiency of Dense Non-Volatile Caches in Multi-Core Systems

In this paper, we present a novel cache design based on Multi-Level Cell Spin-Transfer Torque RAM (MLC STTRAM) that can dynamically adapt the set capacity and associativity to use efficiently the full potential of MLC STTRAM. We exploit the asymmetric nature of the MLC storage scheme to build cache lines featuring heterogeneous performances, that is, half of the cache lines are read-friendly, while the other is write-friendly. Furthermore, we propose to opportunistically deactivate ways in underutilized sets to convert MLC to Single-Level Cell (SLC) mode, which features overall better performance and lifetime. Our ultimate goal is to build a cache architecture that combines the capacity advantages of MLC and performance/energy advantages of SLC. Our experiments show an improvement of 43% in total numbers of conflict misses, 27% in memory access latency, 12% in system performance, and 26% in LLC access energy, with a slight degradation in cache lifetime (about 7%) compared to an SLC cache

Exploring Spin-transfer-torque devices and memristors for logic and memory applications

As scaling CMOS devices is approaching its physical limits, researchers have begun exploring newer devices and architectures to replace CMOS. Due to their non-volatility and high density, Spin Transfer Torque (STT) devices are among the most prominent candidates for logic and memory applications. In this research, we first considered a new logic style called All Spin Logic (ASL). Despite its advantages, ASL consumes a large amount of static power; thus, several optimizations can be performed to address this issue. We developed a systematic methodology to perform the optimizations to ensure stable operation of ASL. Second, we investigated reliable design of STT-MRAM bit-cells and addressed the conflicting read and write requirements, which results in overdesign of the bit-cells. Further, a Device/Circuit/Architecture co-design framework was developed to optimize the STT-MRAM devices by exploring the design space through jointly considering yield enhancement techniques at different levels of abstraction. Recent advancements in the development of memristive devices have opened new opportunities for hardware implementation of non-Boolean computing. To this end, the suitability of memristive devices for swarm intelligence algorithms has enabled researchers to solve a maze in hardware. In this research, we utilized swarm intelligence of memristive networks to perform image edge detection. First, we proposed a hardware-friendly algorithm for image edge detection based on ant colony. Next, we designed the image edge detection algorithm using memristive networks

Reliable and Energy Efficient MLC STT-RAM Buffer for CNN Accelerators

We propose a lightweight scheme where the formation of a data block is changed in such a way that it can tolerate soft errors significantly better than the baseline. The key insight behind our work is that CNN weights are normalized between -1 and 1 after each convolutional layer, and this leaves one bit unused in half-precision floating-point representation. By taking advantage of the unused bit, we create a backup for the most significant bit to protect it against the soft errors. Also, considering the fact that in MLC STT-RAMs the cost of memory operations (read and write), and reliability of a cell are content-dependent (some patterns take larger current and longer time, while they are more susceptible to soft error), we rearrange the data block to minimize the number of costly bit patterns. Combining these two techniques provides the same level of accuracy compared to an error-free baseline while improving the read and write energy by 9% and 6%, respectively

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Energy-Aware Data Movement In Non-Volatile Memory Hierarchies

While technology scaling enables increased density for memory cells, the intrinsic high leakage power of conventional CMOS technology and the demand for reduced energy consumption inspires the use of emerging technology alternatives such as eDRAM and Non-Volatile Memory (NVM) including STT-MRAM, PCM, and RRAM. The utilization of emerging technology in Last Level Cache (LLC) designs which occupies a signifcant fraction of total die area in Chip Multi Processors (CMPs) introduces new dimensions of vulnerability, energy consumption, and performance delivery. To be specific, a part of this research focuses on eDRAM Bit Upset Vulnerability Factor (BUVF) to assess vulnerable portion of the eDRAM refresh cycle where the critical charge varies depending on the write voltage, storage and bit-line capacitance. This dissertation broaden the study on vulnerability assessment of LLC through investigating the impact of Process Variations (PV) on narrow resistive sensing margins in high-density NVM arrays, including on-chip cache and primary memory. Large-latency and power-hungry Sense Amplifers (SAs) have been adapted to combat PV in the past. Herein, a novel approach is proposed to leverage the PV in NVM arrays using Self-Organized Sub-bank (SOS) design. SOS engages the preferred SA alternative based on the intrinsic as-built behavior of the resistive sensing timing margin to reduce the latency and power consumption while maintaining acceptable access time. On the other hand, this dissertation investigates a novel technique to prioritize the service to 1) Extensive Read Reused Accessed blocks of the LLC that are silently dropped from higher levels of cache, and 2) the portion of the working set that may exhibit distant re-reference interval in L2. In particular, we develop a lightweight Multi-level Access History Profiler to effciently identify ERRA blocks through aggregating the LLC block addresses tagged with identical Most Signifcant Bits into a single entry. Experimental results indicate that the proposed technique can reduce the L2 read miss ratio by 51.7% on average across PARSEC and SPEC2006 workloads. In addition, this dissertation will broaden and apply advancements in theories of subspace recovery to pioneer computationally-aware in-situ operand reconstruction via the novel Logic In Interconnect (LI2) scheme. LI2 will be developed, validated, and re?ned both theoretically and experimentally to realize a radically different approach to post-Moore\u27s Law computing by leveraging low-rank matrices features offering data reconstruction instead of fetching data from main memory to reduce energy/latency cost per data movement. We propose LI2 enhancement to attain high performance delivery in the post-Moore\u27s Law era through equipping the contemporary micro-architecture design with a customized memory controller which orchestrates the memory request for fetching low-rank matrices to customized Fine Grain Reconfigurable Accelerator (FGRA) for reconstruction while the other memory requests are serviced as before. The goal of LI2 is to conquer the high latency/energy required to traverse main memory arrays in the case of LLC miss, by using in-situ construction of the requested data dealing with low-rank matrices. Thus, LI2 exchanges a high volume of data transfers with a novel lightweight reconstruction method under specific conditions using a cross-layer hardware/algorithm approach

ENERGY EFFICIENCY EXPLORATION OF COARSE-GRAIN RECONFIGURABLE ARCHITECTURE WITH EMERGING NONVOLATILE MEMORY

With the rapid growth in consumer electronics, people expect thin, smart and powerful devices, e.g. Google Glass and other wearable devices. However, as portable electronic products become smaller, energy consumption becomes an issue that limits the development of portable systems due to battery lifetime. In general, simply reducing device size cannot fully address the energy issue. To tackle this problem, we propose an on-chip interconnect infrastructure and pro- gram storage structure for a coarse-grained reconfigurable architecture (CGRA) with emerging non-volatile embedded memory (MRAM). The interconnect is composed of a matrix of time-multiplexed switchboxes which can be dynamically reconfigured with the goal of energy reduction. The number of processors performing computation can also be adapted. The use of MRAM provides access to high-density storage and lower memory energy consumption versus more standard SRAM technologies. The combination of CGRA, MRAM, and flexible on-chip interconnection is considered for signal processing. This application domain is of interest based on its time-varying computing demands. To evaluate CGRA architectural features, prototype architectures have been pro- totyped in a field-programmable gate array (FPGA). Measurements of energy, power, instruction count, and execution time performance are considered for a scalable num- ber of processors. Applications such as adaptive Viterbi decoding and Reed Solomon coding are used for evaluation. To complete this thesis, a time-scheduled switchbox was integrated into our CGRA model. This model was prototyped on an FPGA. It is shown that energy consumption can be reduced by about 30% if dynamic design reconfiguration is performed

Facilitating Emerging Non-volatile Memories in Next-Generation Memory System Design: Architecture-Level and Application-Level Perspectives

This dissertation focuses on three types of emerging NVMs, spin-transfer torque RAM (STT-RAM), phase change memory (PCM), and metal-oxide resistive RAM (ReRAM). STT-RAM has been identified as the best replacement of SRAM to build large-scale and low-power on-chip caches and also an energy-efficient alternative to DRAM as main memory. PCM and ReRAM have been considered to be promising technologies for building future large-scale and low-power main memory systems. This dissertation investigates two aspects to facilitate them in next-generation memory system design, architecture-level and application-level perspectives. First, multi-level cell (MLC) STT-RAM based cache design is optimized by using data encoding and data compression. Second, MLC STT-RAM is utilized as persistent main memory for fast and energy-efficient local checkpointing. Third, the commonly used database indexing algorithm, B+tree, is redesigned to be NVM-friendly. Forth, a novel processing-in-memory architecture built on ReRAM based main memory is proposed to accelerate neural network applications

Improving Phase Change Memory (PCM) and Spin-Torque-Transfer Magnetic-RAM (STT-MRAM) as Next-Generation Memories: A Circuit Perspective

In the memory hierarchy of computer systems, the traditional semiconductor memories Static RAM (SRAM) and Dynamic RAM (DRAM) have already served for several decades as cache and main memory. With technology scaling, they face increasingly intractable challenges like power, density, reliability and scalability. As a result, they become less appealing in the multi/many-core era with ever increasing size and memory-intensity of working sets. Recently, there is an increasing interest in using emerging non-volatile memory technologies in replacement of SRAM and DRAM, due to their advantages like non-volatility, high device density, near-zero cell leakage and resilience to soft errors. Among several new memory technologies, Phase Change Memory (PCM) and Spin-Torque-Transfer Magnetic-RAM (STT-MRAM) are most promising candidates in building main memory and cache, respectively. However, both of them possess unique limitations that preventing them from being effectively adopted. In this dissertation, I present my circuit design work on tackling the limitations of PCM and STT-MRAM. At bit level, both PCM and STT-MRAM suffer from excessive write energy, and PCM has very limited write endurance. For PCM, I implement Differential Write to remove large number of unnecessary bit-writes that do not alter the stored data. It is then extended to STT-MRAM as Early Write Termination, with specific optimizations to eliminate the overhead of pre-write read. At array level, PCM enjoys high density but could not provide competitive throughput due to its long write latency and limited number of read/write circuits. I propose a Pseudo-Multi-Port Bank design to exploit intra-bank parallelism by recycling and reusing shared peripheral circuits between accesses in a time-multiplexed manner. On the other hand, although STT-MRAM features satisfactory throughput, its conventional array architecture is constrained on density and scalability by the pitch of the per-column bitline pair. I propose a Common-Source-Line Array architecture which uses a shared source-line along the row, essentially leaving only one bitline per column. For these techniques, I provide circuit level analyses as well as architecture/system level and/or process/device level discussions. In addition, relevant background and work are thoroughly surveyed and potential future research topics are discussed, offering insights and prospects of these next-generation memories