7 research outputs found

    Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

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    The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for this trend include fundamental physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a growing mismatch between transistors and interconnects regarding size, speed and power. Continued Moore's Law scaling will not come from technology scaling alone, and must involve improvements to design tools and development of new disruptive technologies such as 3D integration. 3D integration presents potential improvements to interconnect power and delay by translating the routing problem into a third dimension, and facilitates transistor density scaling independent of technology node. Furthermore, 3D IC technology opens up a new architectural design space of heterogeneously-integrated high-bandwidth CPUs. Vertical integration promises to provide the CPU architectures of the future by integrating high performance processors with on-chip high-bandwidth memory systems and highly connected network-on-chip structures. Such techniques can overcome the well-known CPU performance bottlenecks referred to as memory and communication wall. However the promising improvements to performance and energy efficiency offered by 3D CPUs does not come without cost, both in the financial investments to develop the technology, and the increased complexity of design. Two main limitations to 3D IC technology have been heat removal and TSV reliability. Transistor stacking creates increases in power density, current density and thermal resistance in air cooled packages. Furthermore the technology introduces vertical through silicon vias (TSVs) that create new points of failure in the chip and require development of new BEOL technologies. Although these issues can be controlled to some extent using thermal-reliability aware physical and architectural 3D design techniques, high performance embedded cooling schemes, such as micro-fluidic (MF) cooling, are fundamentally necessary to unlock the true potential of 3D ICs. A new paradigm is being put forth which integrates the computational, electrical, physical, thermal and reliability views of a system. The unification of these diverse aspects of integrated circuits is called Co-Design. Independent design and optimization of each aspect leads to sub-optimal designs due to a lack of understanding of cross-domain interactions and their impacts on the feasibility region of the architectural design space. Co-Design enables optimization across layers with a multi-domain view and thus unlocks new high-performance and energy efficient configurations. Although the co-design paradigm is becoming increasingly necessary in all fields of IC design, it is even more critical in 3D ICs where, as we show, the inter-layer coupling and higher degree of connectivity between components exacerbates the interdependence between architectural parameters, physical design parameters and the multitude of metrics of interest to the designer (i.e. power, performance, temperature and reliability). In this dissertation we present a framework for multi-domain co-simulation and co-optimization of 3D CPU architectures with both air and MF cooling solutions. Finally we propose an approach for design space exploration and modeling within the new Co-Design paradigm, and discuss the possible avenues for improvement of this work in the future

    Diseño CMOS de un sistema de visión “on-chip” para aplicaciones de muy alta velocidad

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    Falta palabras claveEsta Tesis presenta arquitecturas, circuitos y chips para el diseño de sensores de visión CMOS con procesamiento paralelo embebido. La Tesis reporta dos chips, en concreto: El chip Q-Eye; El chip Eye-RIS_VSoC.. Y dos sistemas de visión construidos con estos chips y otros sistemas “off-chip” adicionales, como FPGAs, en concreto: El sistema Eye-RIS_v1; El sistema Eye-RIS_v2. Estos chips y sistemas están concebidos para ejecutar tareas de visión a muy alta velocidad y con consumos de potencia moderados. Los sistemas resultantes son, además, compactos y por lo tanto ventajosos en términos del factor SWaP cuando se los compara con arquitecturas convencionales formadas por sensores de imágenes convencionales seguidos de procesadores digitales. La clave de estas ventajas en términos de SWaP y velocidad radica en el uso de sensores-procesadores, en lugar de meros sensores, en la interface de los sistemas de visión. Estos sensores-procesadores embeben procesadores programables de señal-mixta dentro del pixel y son capaces tanto de adquirir imágenes como de pre-procesarlas para extraer características, eliminar información redundante y reducir el número de datos que se transmiten fuera del sensor para su procesamiento ulterior. El núcleo de la tesis es el sensor-procesador Q-Eye, que se usa como interface en los sistemas Eye-RIS. Este sensor-procesador embebe una arquitectura de procesamiento formada por procesadores de señal-mixta distribuidos por pixel. Sus píxeles son por tanto estructuras multi-funcionales complejas. De hecho, son programables, incorporan memorias e interactúan con sus vecinos para realizar una variedad de operaciones, tales como: Convoluciones lineales con máscaras programables; Difusiones controladas por tiempo y nivel de señal, a través de un “grid” resistivo embebido en el plano focal; Aritmética de imágenes; Flujo de programación dependiente de la señal; Conversión entre los dominios de datos: imagen en escala de grises e imagen binaria; Operaciones lógicas en imágenes binarias; Operaciones morfológicas en imágenes binarias. etc. Con respecto a otros píxeles multi-función y sensores-procesadores anteriores, el Q-Eye reporta entre otras las siguientes ventajas: Mayor calidad de la imagen y mejores prestaciones de las funcionalidades embebidas en el chip; Mayor velocidad de operación y mejor gestión de la energía disponible; Mayor versatilidad para integración en sistemas de visión industrial. De hecho, los sistemas Eye-RIS son los primeros sistemas de visión industriales dotados de las siguientes características: Procesamiento paralelo distribuido y progresivo; Procesadores de señal-mixta fiables, robustos y con errores controlados; Programabilidad distribuida. La Tesis incluye descripciones detalladas de la arquitectura y los circuitos usados en el pixel del Q-Eye, del propio chip Q-Eye y de los sistemas de visión construidos en base a este chip. Se incluyen también ejemplos de los distintos chips en operaciónThis Thesis presents architectures, circuits and chips for the implementation of CMOS VISION SENSORS with embedded parallel processing. The Thesis reports two chips, namely: Q-eye chip; Eye-RIS_VSoC chip, and two vision systems realized by using these chips and some additional “off-chip” circuitry, such as FPGAs. These vision systems are: Eye-RIS_v1 system; Eye-RIS_v2 system. The chips and systems reported in the Thesis are conceived to perform vision tasks at very high speed and with moderate power consumption. The proposed vision systems are also compact and advantageous in terms of SWaP factors as compared with conventional architectures consisting of standard image sensor followed by digital processors. The key of these advantages in terms of SWaP and speed lies in the use of sensors-processors, rather than mere sensors, in the front-end interface of vision systems. These sensors-processors embed mixed-signal programmable processors inside the pixel. Therefore, they are able to acquire images and process them to extract the features, removing the redundant information and reducing the data throughput for later processing. The core of the Thesis is the sensor-processor Q-Eye, which is used as front-end in the Eye-RIS systems. This sensor-processor embeds a processing architecture composed by mixed-signal processors distributed per pixel. Then, its pixels are complex multi-functional structures. In fact, they are programmable, incorporate memories and interact with its neighbors in order to carry out a set of operations, including: Linear convolutions with programmable linear masks; Time- and signal-controlled diffusions (by means of an embedded resistive grid); Image arithmetic; Signal-dependent data scheduling; Gray-scale to binary transformation; Logic operation on binary images; Mathematical morphology on binary images, etc. As compared with previous multi-function pixels and sensors-processors, the Q-Eye brings among other the following advantages: Higher image quality and better performances of functionalities embedded on chip; Higher operation speed and better management of energy budget; More versatility for integration in industrial vision systems. In fact, the Eye-RIS systems are the first industrial vision systems equipped with the following characteristics: Parallel distributed and progressive processing; Reliable, robust mixed-signal processors with handled errors; Distributed programmability. This Thesis includes detailed descriptions of architecture and circuits used in the Q-Eye pixel, in the Q-Eye chip itself and in the vision systems developed based on this chip. Also, several examples of chips and systems in operation are presented

    Interconnect Planning for Physical Design of 3D Integrated Circuits

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    Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary BibliographyDreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliograph

    Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

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    Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

    Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

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    ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability

    Bus-driven floorplanning.

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    Law Hoi Ying.Thesis (M.Phil.)--Chinese University of Hong Kong, 2005.Includes bibliographical references (leaves 101-106).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- VLSI Design Cycle --- p.2Chapter 1.2 --- Physical Design Cycle --- p.6Chapter 1.3 --- Floorplanning --- p.10Chapter 1.3.1 --- Floorplanning Objectives --- p.11Chapter 1.3.2 --- Common Approaches --- p.12Chapter 1.3.3 --- Interconnect-Driven Floorplanning --- p.14Chapter 1.4 --- Motivations and Contributions --- p.15Chapter 1.5 --- Organization of the Thesis --- p.17Chapter 2 --- Literature Review on 2D Floorplan Representations --- p.18Chapter 2.1 --- Types of Floorplans --- p.18Chapter 2.2 --- Floorplan Representations --- p.20Chapter 2.2.1 --- Slicing Floorplan --- p.21Chapter 2.2.2 --- Non-slicing Floorplan --- p.22Chapter 2.2.3 --- Mosaic Floorplan --- p.30Chapter 2.3 --- Summary --- p.35Chapter 3 --- Literature Review on 3D Floorplan Representations --- p.37Chapter 3.1 --- Introduction --- p.37Chapter 3.2 --- Problem Formulation --- p.38Chapter 3.3 --- Previous Work --- p.38Chapter 3.4 --- Summary --- p.42Chapter 4 --- Literature Review on Bus-Driven Floorplanning --- p.44Chapter 4.1 --- Problem Formulation --- p.44Chapter 4.2 --- Previous Work --- p.45Chapter 4.2.1 --- Abutment Constraint --- p.45Chapter 4.2.2 --- Alignment Constraint --- p.49Chapter 4.2.3 --- Bus-Driven Floorplanning --- p.52Chapter 4.3 --- Summary --- p.53Chapter 5 --- Multi-Bend Bus-Driven Floorplanning --- p.55Chapter 5.1 --- Introduction --- p.55Chapter 5.2 --- Problem Formulation --- p.56Chapter 5.3 --- Methodology --- p.57Chapter 5.3.1 --- Shape Validation --- p.58Chapter 5.3.2 --- Bus Ordering --- p.65Chapter 5.3.3 --- Floorplan Realization --- p.72Chapter 5.3.4 --- Simulated Annealing --- p.73Chapter 5.3.5 --- Soft Block Adjustment --- p.75Chapter 5.4 --- Experimental Results --- p.75Chapter 5.5 --- Summary --- p.77Chapter 6 --- Bus-Driven Floorplanning for 3D Chips --- p.80Chapter 6.1 --- Introduction --- p.80Chapter 6.2 --- Problem Formulation --- p.81Chapter 6.3 --- The Representation --- p.82Chapter 6.3.1 --- Overview --- p.82Chapter 6.3.2 --- Review of TCG --- p.83Chapter 6.3.3 --- Layered Transitive Closure Graph (LTCG) --- p.84Chapter 6.3.4 --- Aligning Blocks --- p.85Chapter 6.3.5 --- Solution Perturbation --- p.87Chapter 6.4 --- Simulated Annealing --- p.92Chapter 6.5 --- Soft Block Adjustment --- p.92Chapter 6.6 --- Experimental Results --- p.93Chapter 6.7 --- Summary --- p.94Chapter 6.8 --- Acknowledgement --- p.95Chapter 7 --- Conclusion --- p.99Bibliography --- p.10

    ABSTRACT Block Alignment in 3D Floorplan Using Layered TCG

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    In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as technology advances into the deep submicron era. 3D chip is a feasible solution to these problems. It has been shown that interconnect lengths can be greatly reduced in 3D ICs. In this paper, a novel 3D floorplan representation namely Layered Transitive Closure Graph (LTCG) is proposed, which is based on the Transitive Closure Graph (TCG) representation for 2D non-slicing floorplans. In LTCG, we can impose topological relationships between both blocks of the same layer and blocks of different layers. Experimental results have shown that LTCG is very promising for multi-layer floorplanning and can handle the inter-layer alignment problem effectively. Categories and Subject Descriptors B.7.2 [Integrated Circuites]: Design aids—Placement and routing;J.6[Computer Applications]: Computer-aided design—Computer-aide
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