Design and evaluation of buffered triple modular redundancy in interleaved-multi-threading processors

Fault management in digital chips is a crucial aspect of functional safety. Significant work has been done on gate and microarchitecture level triple modular redundancy, and on functional redundancy in multi-core and simultaneous-multi-threading processors, whereas little has been done to quantify the fault tolerance potential of interleaved-multi-threading. In this study, we apply the temporal-spatial triple modular redundancy concept to interleaved-multi-threading processors through a design solution that we call Buffered triple modular redundancy, using the soft-core Klessydra-T03 as the basis for our experiments. We then illustrate the quantitative findings of a large fault-injection simulation campaign on the fault-tolerant core and discuss the vulnerability comparison with previous representative fault-tolerant designs. The results show that the obtained resilience is comparable to a full triple modular redundancy at the cost of execution cycle count overhead instead of hardware overhead, yet with higher achievable clock frequency

A high resolution data conversion and digital processing for high energy physics calorimeter detectors readout

L'abstract è presente nell'allegato / the abstract is in the attachmen

Improved Fault Tolerant SRAM Cell Design & Layout in 130nm Technology

Technology scaling of CMOS devices has made the integrated circuits vulnerable to single event radiation effects. Scaling of CMOS Static RAM (SRAM) has led to denser packing architectures by reducing the size and spacing of diffusion nodes. However, this trend has led to the increase in charge collection and sharing effects between devices during an ion strike, making the circuit even more vulnerable to a specific single event effect called the single event multiple-node upset (SEMU). In nanometer technologies, SEMU can easily disrupt the data stored in the memory and can be more hazardous than a single event single-node upset. During the last decade, most of the research efforts were mainly focused on improving the single event single-node upset tolerance of SRAM cells by using novel circuit techniques, but recent studies relating to angular radiation sensitivity has revealed the importance of SEMU and Multi Bit Upset (MBU) tolerance for SRAM cells. The research focuses on improving SEMU tolerance of CMOS SRAM cells by using novel circuit and layout level techniques. A novel SRAM cell circuit & layout technique is proposed to improve the SEMU tolerance of 6T SRAM cells with decreasing feature size, making it an ideal candidate for future technologies. The layout is based on strategically positioning diffusion nodes in such a way as to provide charge cancellation among nodes during SEMU radiation strikes, instead of charge build-up. The new design & layout technique can improve the SEMU tolerance levels by up to 20 times without sacrificing on area overhead and hence is suitable for high density SRAM designs in commercial applications. Finally, laser testing of SRAM based configuration memory of a Xilinx Virtex-5 FPGA is performed to analyze the behavior of SRAM based systems towards radiation strikes

EDAC software implementation to protect small satellites memory

Radiation is a well-known problem for satellites in space. It can produce different negative effects on electronic components which can provoke errors and failures. Therefore, mitigating these effects is especially important for the success of space missions. One of the techniques to increase the reliability of memory chips and reduce transient errors and permanent faults is Error Detection and Correction (EDAC). EDAC codes are characterised by the use of redundancy to detect and correct errors. This final project consists in the implementation of a software EDAC algorithm to protect the main memory of a microcontroller. The implementation requirements and the issues of software EDAC are described and the test results are commented

REAL TIME MICROPROCESSOR TECHNIQUES FOR A DIGITAL MULTITRACK TAPE RECORDER

Transport properties of a standard compact - cassette tape system are measured and software techniques devised to configure a low - cost,direct digital recording system. Tape - velocity variation is typically ± 10% of standard speed over tape lengths of 5 µm.with occasional variations of ±40%. Static tape - skew can result due to axial movement of the tape reel when it spools.Dynamic tape skew occurs and is primarily caused by tape - edge curvature with a constant contribution due to the transport mechanism.Spectral skew components range from 0.32 Hz to 8 Hz with magnitude normally within one 10 kbit/ sec- bit cell.The pinch roller works against the friction of the tape guides to cause tape deformation.Average values of tape deformation are 0.67 µm,0.85 µm and 1.08 µm for C60,C90 and C120 tape respectively. Parallel,software encoding / decoding algorithms have been developed for several channel codes.Adaptive software methods permit track data rates up to 3.33 k bits/sec in a rnultitrack system using a simple microcomputer.For a 4 - track system,raw error rates vary from 10ˉ⁷ at 500 bits/sec/track to 10ˉ⁵ at 3.33 kbits/sec/track.Adaptive software reduces skew - induced errors by 50%.A skew - correction technique has been developed and implemented on an 8 - track system at a track data rate of 10 k bits/sec. Real - time error correction gives a theoretical corrected error rate of 10ˉ¹¹for a raw error rate of 10ˉ⁷. Multiple track errors can cause mis - correction and interleaving is advised. Software algorithms have been devised for Reed - Solomon code. With a more powerful microprocessor this code m ay be combined with the above techniques in a layered error-correction scheme. The software techniques developed may be applied to N tracks with an N - bit computer.Recording density may be increased by using thin - film,multitrack heads and a faster computer.British Broadcasting Corporatio

A Structured Design Methodology for High Performance VLSI Arrays

abstract: The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.Dissertation/ThesisPh.D. Electrical Engineering 201

Custom Instruction Support for Modular Defense against Side-channel and Fault Attacks

International audienceThe design of software countermeasures against active and passive adversaries is a challenging problem that has been addressed by many authors in recent years. The proposed solutions adopt a theoretical foundation (such as a leakage model) but often do not offer concrete reference implementations to validate the foundation. Contributing to the experimental dimension of this body of work, we propose a customized processor called SKIVA that supports experiments with the design of countermeasures against a broad range of implementation attacks. Based on bitslice programming and recent advances in the literature, SKIVA offers a flexible and modular combination of countermeasures against power-based and timing-based side-channel leakage and fault injection. Multiple configurations of side-channel protection and fault protection enable the programmer to select the desired number of shares and the desired redundancy level for each slice. Recurring and security-sensitive operations are supported in hardware through custom instruction-set extensions. The new instructions support bitslicing, secret-share generation, redundant logic computation, and fault detection. We demonstrate and analyze multiple versions of AES from a side-channel analysis and a fault-injection perspective, in addition to providing a detailed performance evaluation of the protected designs. To our knowledge, this is the first validated end-to-end implementation of a modular bitslice-oriented countermeasure

Analyse und Erweiterung eines fehler-toleranten NoC für SRAM-basierte FPGAs in Weltraumapplikationen

Data Processing Units for scientific space mission need to process ever higher volumes of data and perform ever complex calculations. But the performance of available space-qualified general purpose processors is just in the lower three digit megahertz range, which is already insufficient for some applications. As an alternative, suitable processing steps can be implemented in hardware on a space-qualified SRAM-based FPGA. However, suitable devices are susceptible against space radiation. At the Institute for Communication and Network Engineering a fault-tolerant, network-based communication architecture was developed, which enables the construction of processing chains on the basis of different processing modules within suitable SRAM-based FPGAs and allows the exchange of single processing modules during runtime, too. The communication architecture and its protocol shall isolate non SEU mitigated or just partial SEU mitigated modules affected by radiation-induced faults to prohibit the propagation of errors within the remaining System-on-Chip. In the context of an ESA study, this communication architecture was extended with further components and implemented in a representative hardware platform. Based on the acquired experiences during the study, this work analyses the actual fault-tolerance characteristics as well as weak points of this initial implementation. At appropriate locations, the communication architecture was extended with mechanisms for fault-detection and fault-differentiation as well as with a hardware-based monitoring solution. Both, the former measures and the extension of the employed hardware-platform with selective fault-injection capabilities for the emulation of radiation-induced faults within critical areas of a non SEU mitigated processing module, are used to evaluate the effects of radiation-induced faults within the communication architecture. By means of the gathered results, further measures to increase fast detection and isolation of faulty nodes are developed, selectively implemented and verified. In particular, the ability of the communication architecture to isolate network nodes without SEU mitigation could be significantly improved.Instrumentenrechner für wissenschaftliche Weltraummissionen müssen ein immer höheres Datenvolumen verarbeiten und immer komplexere Berechnungen ausführen. Die Performanz von verfügbaren qualifizierten Universalprozessoren liegt aber lediglich im unteren dreistelligen Megahertz-Bereich, was für einige Anwendungen bereits nicht mehr ausreicht. Als Alternative bietet sich die Implementierung von entsprechend geeigneten Datenverarbeitungsschritten in Hardware auf einem qualifizierten SRAM-basierten FPGA an. Geeignete Bausteine sind jedoch empfindlich gegenüber der Strahlungsumgebung im Weltraum. Am Institut für Datentechnik und Kommunikationsnetze wurde eine fehlertolerante netzwerk-basierte Kommunikationsarchitektur entwickelt, die innerhalb eines geeigneten SRAM-basierten FPGAs Datenverarbeitungsmodule miteinander nach Bedarf zu Verarbeitungsketten verbindet, sowie den Austausch von einzelnen Modulen im Betrieb ermöglicht. Nicht oder nur partiell SEU mitigierte Module sollen bei strahlungsbedingten Fehlern im Modul durch das Protokoll und die Fehlererkennungsmechanismen der Kommunikationsarchitektur isoliert werden, um ein Ausbreiten des Fehlers im restlichen System-on-Chip zu verhindern. Im Kontext einer ESA Studie wurde diese Kommunikationsarchitektur um Komponenten erweitert und auf einer repräsentativen Hardwareplattform umgesetzt. Basierend auf den gesammelten Erfahrungen aus der Studie, wird in dieser Arbeit eine Analyse der tatsächlichen Fehlertoleranz-Eigenschaften sowie der Schwachstellen dieser ursprünglichen Implementierung durchgeführt. Die Kommunikationsarchitektur wurde an geeigneten Stellen um Fehlerdetektierungs- und Fehlerunterscheidungsmöglichkeiten erweitert, sowie um eine hardwarebasierte Überwachung ergänzt. Sowohl diese Maßnahmen, als auch die Erweiterung der Hardwareplattform um gezielte Fehlerinjektions-Möglichkeiten zum Emulieren von strahlungsinduzierten Fehlern in kritischen Komponenten eines nicht SEU mitigierten Prozessierungsmoduls werden genutzt, um die tatsächlichen auftretenden Effekte in der Kommunikationsarchitektur zu evaluieren. Anhand der Ergebnisse werden weitere Verbesserungsmaßnahmen speziell zur schnellen Detektierung und Isolation von fehlerhaften Knoten erarbeitet, selektiv implementiert und verifiziert. Insbesondere die Fähigkeit, fehlerhafte, nicht SEU mitigierte Netzwerkknoten innerhalb der Kommunikationsarchitektur zu isolieren, konnte dabei deutlich verbessert werden