Architecture of a Silicon Strip Beam Position Monitor

A collaboration between Fermilab and the Institute for High Energy Physics (IHEP), Beijing, has developed a beam position monitor for the IHEP test beam facility. This telescope is based on 5 stations of silicon strip detectors having a pitch of 60 microns. The total active area of each layer of the detector is about 12x10 cm2. Readout of the strips is provided through the use of VA1` ASICs mounted on custom hybrid printed circuit boards and interfaced to Adapter Cards via copper-over-kapton flexible circuits. The Adapter Cards amplify and level-shift the signal for input to the Fermilab CAPTAN data acquisition nodes for data readout and channel configuration. These nodes deliver readout and temperature data from triggered events to an analysis computer over gigabit Ethernet links.Comment: Submitted to TWEPP 201

Active pixel sensor with intra-pixel charge transfer

An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node

Method of acquiring an image from an optical structure having pixels with dedicated readout circuits

An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node

Development of an image converter of radical design

A long term investigation of thin film sensors, monolithic photo-field effect transistors, and epitaxially diffused phototransistors and photodiodes to meet requirements to produce acceptable all solid state, electronically scanned imaging system, led to the production of an advanced engineering model camera which employs a 200,000 element phototransistor array (organized in a matrix of 400 rows by 500 columns) to secure resolution comparable to commercial television. The full investigation is described for the period July 1962 through July 1972, and covers the following broad topics in detail: (1) sensor monoliths; (2) fabrication technology; (3) functional theory; (4) system methodology; and (5) deployment profile. A summary of the work and conclusions are given, along with extensive schematic diagrams of the final solid state imaging system product

CMOS-Compatible Room-Temperature Rectifier Toward Terahertz Radiation Detection

In this paper, we present a new rectifying device, compatible with the technology of CMOS image sensors, suitable for implementing a direct-conversion detector operating at room temperature for operation at up to terahertz frequencies. The rectifying device can be obtained by introducing some simple modifications of the charge-storage well in conventional CMOS integrated circuits, making the proposed solution easy to integrate with the existing imaging systems. The rectifying device is combined with the different elements of the detector, composed of a 3D high-performance antenna and a charge-storage well. In particular, its position just below the edge of the 3D antenna takes maximum advantage of the high electric field concentrated by the antenna itself. In addition, the proposed structure ensures the integrity of the charge-storage well of the detector. In the structure, it is not necessary to use very scaled and costly technological nodes, since the CMOS transistor only provides the necessary integrated readout electronics. On-wafer measurements of RF characteristics of the designed junction are reported and discussed. The overall performances of the entire detector in terms of noise equivalent power (NEP) are evaluated by combining low-frequency measurements of the rectifier with numerical simulations of the 3D antenna and the semiconductor structure at 1 THz, allowing prediction of the achievable NEP

Single chip camera device having double sampling operation

A single chip camera device is formed on a single substrate including an image acquisition portion for control portion and the timing circuit formed on the substrate. The timing circuit also controls the photoreceptors in a double sampling mode in which are reset level is first read and then after an integration time a charged level is read

Results from the Commissioning of the ATLAS Pixel Detector with Cosmic data

The ATLAS pixel detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. With approximately 80 million readout channels, the ATLAS silicon pixel detector is a high-acceptance, high-resolution, low-noise tracking device. Providing the desired refinement in charged track pattern recognition capability in order to meet the stringent track reconstruction requirements, the pixel detector largely defines the ability of ATLAS to effectively resolve primary and secondary vertices and perform efficient flavor tagging essential for discovery of new physics. Being the last sub-system installed in ATLAS by July 2007, the pixel detector was successfully connected, commissioned, and tested in situ while meeting an extremely tight schedule, and was ready to take data upon the projected turn-on of the LHC. Since fall 2008, the pixel detector has been included in the combined ATLAS detector operation, collecting cosmic muon data. Details from the pixel detector installation and commissioning, as well as details on calibration procedures and the results obtained with collected cosmic data, are presented along with a summary of the detector status.Comment: To be published in the proceedings of DPF-2009, Detroit, MI, July 2009, eConf C090726. Contents: 9 pages, 13 figures, 9 reference

Improving the Readout of Semiconducting Qubits

Semiconducting qubits are a promising platform for quantum computers. In particular, silicon spin qubits have made a number of advancements recently including long coherence times, high-fidelity single-qubit gates, two-qubit gates, and high-fidelity readout. However, all operations likely require improvement in fidelity and speed, if possible, to realize a quantum computer. Readout fidelity and speed, in general, are limited by circuit challenges centered on extracting low signal from a device in a dilution refrigerator connected to room temperature amplifiers by long coaxial cables with relatively high capacitance. Readout fidelity specifically is limited by the time it takes to reliably distinguish qubit states relative to the characteristic decay time of the excited state, T1. This dissertation explores the use of heterojunction bipolar transistor (HBT) circuits to amplify the readout signal of silicon spin qubits at cryogenic temperatures. The cryogenic amplification approach has numerous advantages including low implementation overhead, low power relative to the available cooling power, and high signal gain at the mixing chamber stage leading to around a factor of ten speedup in readout time for a similar signal-to-noise ratio. The faster readout time generally increases fidelity, since it is much faster than the T1 time. Two HBT amplification circuits have been designed and characterized. One design is a low-power, base-current biased configuration with non-linear gain (CB-HBT), and the second is a linear-gain, AC-coupled configuration (AC-HBT). They can operate at powers of 1 and 10 μW, respectfully, and not significantly heat electrons. The noise spectral density referred to the input for both circuits is around 15 to 30 fA/√Hz, which is low compared to previous cases such as the dual-stage, AC-coupled HEMT circuit at ~ 70 fA/√Hz. Both circuits achieve charge sensitivity between 300 and 400 μe/√Hz, which approaches the best alternatives (e.g., RF-SET at ~ 140 μe/√Hz) but with much less implementation overhead. For the single-shot latched charge readout performed, both circuits achieve high-fidelity readout in times \u3c 10 μs with bit error rates \u3c 10-3, which is a great improvement over previous work at \u3e 70 μs. The readout speed-up in principle also reduces the production of errors due to excited state relaxation by a factor of ~ 10. All of these results are possible with relatively simple, low-power transistor circuits which can be mounted close to the qubit device at the mixing chamber stage of the dilution refrigerator