Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications

Im Rahmen der vorliegenden Dissertation zum Thema „Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications“ wurde auf Basis einer 130 nm SiGe BiCMOS Technologie ein Through-Silicon Via (TSV) Technologiemodul zur Herstellung elektrischer Durchkontaktierungen für die Anwendung im Millimeterwellen und Sub-THz Frequenzbereich entwickelt. TSVs wurden mittels elektromagnetischer Simulationen modelliert und in Bezug auf ihre elektrischen Eigenschaften bis in den sub-THz Bereich bis zu 300 GHz optimiert. Es wurden die Wechselwirkungen zwischen Modellierung, Fertigungstechnologie und den elektrischen Eigenschaften untersucht. Besonderes Augenmerk wurde auf die technologischen Einflussfaktoren gelegt. Daraus schlussfolgernd wurde das TSV Technologiemodul entwickelt und in eine SiGe BiCMOS Technologie integriert. Hierzu wurde eine Via-Middle Integration gewählt, welche eine Freilegung der TSVs von der Wafer Rückseite erfordert. Durch die geringe Waferdicke von ca. 75 μm wird einen Carrier Wafer Handling Prozess verwendet. Dieser Prozess wurde unter der Randbedingung entwickelt, dass eine nachfolgende Bearbeitung der Wafer innerhalb der BiCMOS Pilotlinie erfolgen kann. Die Rückseitenbearbeitung zielt darauf ab, einen Redistribution Layer auf der Rückseite der BiCMOS Wafer zu realisieren. Hierzu wurde ein Prozess entwickelt, um gleichzeitig verschiedene TSV Strukturen mit variablen Geometrien zu realisieren und damit eine hohe TSV Design Flexibilität zu gewährleisten. Die TSV Strukturen wurden von DC bis über 300 GHz charakterisiert und die elektrischen Eigenschaften extrahiert. Dabei wurde gezeigt, dass TSV Verbindungen mit sehr geringer Dämpfung <1 dB bis 300 GHz realisierbar sind und somit ausgezeichnete Hochfrequenzeigenschaften aufweisen. Zuletzt wurden vielfältige Anwendungen wie das Grounding von Hochfrequenzschaltkreisen, Interposer mit Waveguides und 300 GHz Antennen dargestellt. Das Potential für Millimeterwellen Packaging und 3D Integration wurde evaluiert. TSV Technologien sind heutzutage in vielen Anwendungen z.B. im Bereich der Systemintegration von Digitalschaltkreisen und der Spannungsversorgung von integrierten Schaltkreisen etabliert. Im Rahmen dieser Arbeit wurde der Einsatz von TSVs für Millimeterwellen und dem sub-THz Frequenzbereich untersucht und die Anwendung für den sub-THz Bereich bis 300 GHz demonstriert. Dadurch werden neue Möglichkeiten der Systemintegration und des Packaging von Höchstfrequenzsystemen geschaffen.:Bibliographische Beschreibung List of symbols and abbreviations Acknowledgement 1. Introduction 2. FEM Modeling of BiCMOS & Interposer Through-Silicon Vias 3. Fabrication of BiCMOS & Silicon Interposer with TSVs 4. Characterization of BiCMOS Embedded Through-Silicon Vias 5. Applications 6. Conclusion and Future Work 7. Appendix 8. Publications & Patents 9. Bibliography 10. List of Figures and Table

6-DoF Navigation Systems for Autonomous Underwater Vehicles

Austri

Charakterisierung funktionaler Nanomaterialien für biomagnetische Sensoren und Atemanalyse

The presented thesis is covering materials aspects for the development of magnetoelectric sensors for biomagnetic sensing and solid state sensors for breath monitoring. The electrophysiological signals of the human body and especially their irregularities provide extremely valuable information about the heart, brain or nerve malfunction in medical diagnostics. Similar and even more detailed information is contained in the generated biomagnetic fields which measurement offers improved diagnostics and treatment of the patients. A new type of room temperature operable magnetoelectric composite sensors is developed in the framework of the CRC1261 Magnetoelectric Sensors: From Composite Materials to Biomagnetic Diagnostics. This thesis focuses on the individual materials structure-property relations and their combination in magnetoelectric composite sensors studied by electron beam based techniques, at lengths scales ranging from micrometers to atomic resolution. The first part of this thesis highlights selected studies on the structural and analytic aspects of single phase materials and their composites using TEM as the primary method of investigation. With respect to the piezoelectric phase, alternatives to AlN have been thoroughly investigated to seek for improvement of specific sensor approaches. In this context, the alloying of Sc into the AlN matrix has been demonstrated to yield high quality films with improved piezoelectric and unprecedented ferroelectric properties grown under the control of deposition parameters. Lead-free titanate films with large piezo-coefficients at the verge of the morphotropic phase boundary as alternative to PZT films have been investigated in terms of crystal symmetry, defect structure and domains of cation ordering. New morphologies of ZnO and GaN semiconductors envisioned for a piezotronic-based sensor approach were subject of in-depth defect and analytical studies describing intrinsic defects and lattice strains upon deposition as well as hollow composite structures. When the dimensions of a materials are reduced, novel exciting properties such as in-plane piezoelectricity can arise in planar transition-metal dichalcogenides. Here, the turbostratic disorder in a few-layered MoSe2 film has been investigated by nanobeam electron diffraction and Fast Fourier Transformations. From the perspective of magnetic materials, the atomic structure of magnetostrictive multilayers of FeCo/TiN showing stability up to elevated temperatures has been analyzed in detail regarding the crystallographic relationship of heteroepitaxy in multilayer composites exhibiting individual layer thicknesses below 1 nm. Further, magnetic hard layers have been investigated in the context of exchange spring concepts and ME composites based on shape memory alloy substrates have been studied regarding structural changes implied by different annealing processes. The second part of this thesis introduces materials aspects and sensor studies on gas detection in the clinical context of breath analysis. The detection of specific vapors in the human breath is of medical relevance, since certain species can be enriched depending on the conditions and processes within the human body. Hence, they can be regarded as biomarkers for the patients condition of health. The selection of suitable materials and the gas measurement working principle are considered and selected studies on solid state sensors with different surface functionalization or targeted application on basis of ZnO or CuO-oxide and Fe-oxide species are presented

Photonic Crystal Directional Coupler Based Optomechanical Sensor

An extremely small ($6.5\times6.5\mu$m) optomechanical sensor is proposed that utilizes a photonic crystal (PC) etched onto silicon-on-insulator (SOI) using adapted complimentary metal-oxide-semiconductor fabrication technology. The destructive interference of light with the periodic structure can forbid its propagation inside the crystal across a range of frequencies and can be used to confine light near edge of a PC slab. By placing two PC edges near each other, a directional coupler is formed where light is periodically exchanged between the two waveguides. Wet-etching away the buried oxide residing beneath the photonic crystal directional coupler (PCDC), a membrane is formed. Exerting force on the PCDC alters the separation between the two PC edges and modulates the observed transmission at the coupler outputs. Buckle-mitigating structures are also demonstrated here which relieve the unpredictable compressive stress built into the top silicon layer of SOI during wafer fabrication. The PCDC sensors attempt to overcome some of the shortcomings of existing micromechanical sensors such as area constraints, material restrictions, stiction, and EM interference. PCDC sensors are also highly parallelizable due to their small size and wide optical bandwidth. PCDC sensors are envisaged to be used in microfluidic integration and are capable of 149kPa full scale pressure measurement ranges

Study of an off-grid wireless sensors with Li-Ion battery and Giant Magnetostrisctive Material

L'abstract è presente nell'allegato / the abstract is in the attachmen

Single-Chip Scanning Probe Microscopes

Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. The present research demonstrates, for the first time, that all of the mechanical and electrical components that are required for the SPM to capture an image can be scaled and integrated onto a single CMOS chip. Principles of microsystem design are applied to produce single-chip instruments that acquire images of underlying samples on their own, without the need for off-chip scanners or sensors. Furthermore, it is shown that the instruments enjoy a multitude of performance benefits that stem from CMOS-MEMS integration and volumetric scaling of scanners by a factor of 1 million. This dissertation details the design, fabrication and imaging results of the first single-chip contact-mode AFMs, with integrated piezoresistive strain sensing cantilevers and scanning in three degrees-of-freedom (DOFs). Static AFMs and quasi-static AFMs are both reported. This work also includes the development, fabrication and imaging results of the first single-chip dynamic AFMs, with integrated flexural resonant cantilevers and 3 DOF scanning. Single-chip Amplitude Modulation AFMs (AM-AFMs) and Frequency Modulation AFMs (FM-AFMs) are both shown to be capable of imaging samples without the need for any off-chip sensors or actuators. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, mechanical, and thermal effects. To the best of the author’s knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed. The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region. Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An “isothermal electrothermal scanner” is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors. In the thesis, models are developed to guide the design of single-chip SPMs and to provide an interpretation of experimental results. The modelling efforts include lumped element model development for each component of single-chip SPMs in the electrical, thermal and mechanical domains. In addition, noise models are developed for various components of the instruments, including temperature-based position sensors, piezoresistive cantilevers, and digitally controlled positioning devices

Smart Materials and Devices for Energy Harvesting

This book is devoted to energy harvesting from smart materials and devices. It focusses on the latest available techniques recently published by researchers all over the world. Energy Harvesting allows otherwise wasted environmental energy to be converted into electric energy, such as vibrations, wind and solar energy. It is a common experience that the limiting factor for wearable electronics, such as smartphones or wearable bands, or for wireless sensors in harsh environments, is the finite energy stored in onboard batteries. Therefore, the answer to the battery “charge or change” issue is energy harvesting because it converts the energy in the precise location where it is needed. In order to achieve this, suitable smart materials are needed, such as piezoelectrics or magnetostrictives. Moreover, energy harvesting may also be exploited for other crucial applications, such as for the powering of implantable medical/sensing devices for humans and animals. Therefore, energy harvesting from smart materials will become increasingly important in the future. This book provides a broad perspective on this topic for researchers and readers with both physics and engineering backgrounds

The Anticoincidence Detector onboard the Athena X-Ray observatory

The Anticoincidence Detector onboard the Athena X-Ray observator

Applications of the thermal wave technique in liquid thermal conductivity measurements and flow field diagnostics

The thermal wave technique has been explored for the use of liquid thermal conductivity measurement and flow property diagnostics in this dissertation. For liquid thermal conductivity measurements, an experimental technique based on the thermal wave approach is developed. A stainless steel strip functions as both a heating element and a sealing cover for a chamber containing a test liquid. A periodic current passing through this metal strip generates a periodic Joule heating source. An infrared detector measures the temperature response at the front surface of the stainless steel strip. The phase and magnitude of the temperature response were measured by a lock-in amplifier at various frequencies. A one-dimensional, two-layered transient heat conduction model is developed to predict the temperature response. The phase information of this temperature response shows high sensitivity to the change of thermal properties of the liquid layer and is employed to match experimental data to find the thermal properties of the test liquid. The measured thermal conductivities of water and ethylene glycol agree quite well with data from the literature and support the validity of this measurement technique. An aqueous fluid consisting of gold nanoparticles was also tested and anomalous thermal conductivity enhancement was observed. Our measurement results also showed a divergence of thermal transport behavior between nanofluids and pure liquids. This suggests a need to carefully examine the role of the measurement technique in the heat transfer experimental studies of nanofluids. For the study of flow property diagnostics, a heat transfer system with a periodic boundary condition in a steady flow field is examined. Due to linearity and homogeneity of the heat transfer system under certain conditions, a thermal wave field generated by a periodic heating flux at the boundary of the flow field may be used to detect important flow field parameters, such as the velocity gradient at the wall, and therefore, the wall shear stress. A wall shear stress sensor design with a heater and two temperature sensors on a silicon dioxide substrate is analyzed. The heater with a periodic heating source generates an oscillating temperature field which interacts with the flow field. The temperature sensors pick up the temperature response that contains information on the velocity gradient at the wall. Based on the above sensor design, a two-dimensional conjugate heat convection model is developed with a periodic heating flux at the solid/fluid interface and a linear velocity profile in the fluid domain. Two designs are studied, one with a silicon heat sink under the silicon dioxide substrate and another without the heat sink. The effects of the two main design parameters, the operating frequency and the distance between the heater and the temperature sensor, are discussed. A reasonable sensitivity of the phase information to the velocity gradient suggests a practical sensor design. A preliminary experimental test on a water channel flow has been conducted to support the concept of applying the thermal wave method to wall shear stress measurements