1,328 research outputs found

    Printing as an Alternative Manufacturing Process for Printed Circuit Boards

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    Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics

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    The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.

    Robotic disassembly of electronic components to support end‐of‐life recycling of electric vehicles

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    This thesis reports on the research undertaken to analyse the factors affecting End-of-Life (EoL) recycling of future Electric Vehicles (EVs). The principle objective of the research is to generate an understanding of challenges and opportunities for the development and implementation of an automated robotic disassembly approach to aid with EoL management of electrical and electronic components within EVs. The research contributions are considered in three main parts. The first part contains a review of advancement in the development of automotive technology, and in particular the alternative fuel vehicles. A review of existing industrial recycling technologies and processes has been conducted which highlighted a number of key challenges in the adoption of current recycling technologies for EVs. The review concludes that there is a need to develop novel recycling technologies and processes to deal with the increased part complexity and material mixture in such vehicles. In this context, the second part of the research details a framework for EoL management of EV components. This framework presents a comprehensive automated robotic disassembly approach in which three specific steps are defined, namely manual disassembly to develop an understanding of product design, initial automated disassembly to test process capability, and optimisation and validation to improve repeatability and efficiency of the robotic disassembly operations. The framework also includes the development of a multi-criteria decision-making tool that assesses the environmental, technological and economic benefits of such robotic disassembly approach. The applicability of the research concepts has been demonstrated via three case studies. The results have highlighted the applicability of the automated robotic disassembly approach in a variety of scenarios of different design complexity and recovery rate. The results indicate that the adoption of this robotic disassembly enhances the pre-concentration of Strategically Important Materials (SIMs) and leads to minimisation of environmental impacts and increased material recovery value

    A method of comparing the costs of platform and unique product design

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    Thesis (S.M.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999.Includes bibliographical references (leaf 34).by Adam J. King.S.M

    Spring contact probes: wear characteristics testing for electrical and mechanical parameters

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    The study considers the development and evaluation of spring contact probes used for automated testing of printed circuit boards (PCBs) and assemblies. It considers the evolution of circuit technology which originated from the introduction of the thermionic valve at the beginning of the century. Since the introduction of the integrated circuit in the 1960's, the industry has seen considerable advances in integrated and printed circuit miniaturisation with its associated effect on the testability of the completed assembly. The close spacing between the tracks and pads within the printed circuit board, which is possibly loaded on both sides with integrated circuits and other components with fine pitch termination spacings, has initiated the rapid development of a specialised electronic test industry to ensure product quality. [Continues.

    Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views

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    Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the soldering conditions. These characteristics have posted a challenging task to develop an effective machine vision with acceptable level of classification accuracy. This research aims to investigate a new methodology of inspecting solder joint through analysis of the combined image from two viewing directions; one from orthogonal view while the other from oblique view. The concept based on the physics of surface tension, contact angle and slant angle of solder joint fillet

    A Lunar Surface System Supportability Technology Development Roadmap

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    This paper discusses the establishment of a Supportability Technology Development Roadmap as a guide for developing capabilities intended to allow NASA's Constellation program to enable a supportable, sustainable and affordable exploration of the Moon and Mars. Presented is a discussion of "supportability", in terms of space facility maintenance, repair and related logistics and a comparison of how lunar outpost supportability differs from the International Space Station. Supportability lessons learned from NASA and Department of Defense experience and their impact on a future lunar outpost is discussed. A supportability concept for future missions to the Moon and Mars that involves a transition from a highly logistics dependent to a logistically independent operation is discussed. Lunar outpost supportability capability needs are summarized and a supportability technology development strategy is established. The resulting Lunar Surface Systems Supportability Strategy defines general criteria that will be used to select technologies that will enable future flight crews to act effectively to respond to problems and exploit opportunities in a environment of extreme resource scarcity and isolation. This strategy also introduces the concept of exploiting flight hardware as a supportability resource. The technology roadmap involves development of three mutually supporting technology categories, Diagnostics Test & Verification, Maintenance & Repair, and Scavenging & Recycling. The technology roadmap establishes two distinct technology types, "Embedded" and "Process" technologies, with different implementation and thus different criteria and development approaches. The supportability technology roadmap addresses the technology readiness level, and estimated development schedule for technology groups that includes down-selection decision gates that correlate with the lunar program milestones. The resulting supportability technology roadmap is intended to develop a set of technologies with widest possible capability and utility with a minimum impact on crew time and training and remain within the time and cost constraints of the Constellation progra

    Genetic algorithm for automatic optical inspection

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    Detector Technologies for CLIC

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    The Compact Linear Collider (CLIC) is a high-energy high-luminosity linear electron-positron collider under development. It is foreseen to be built and operated in three stages, at centre-of-mass energies of 380 GeV, 1.5 TeV and 3 TeV, respectively. It offers a rich physics program including direct searches as well as the probing of new physics through a broad set of precision measurements of Standard Model processes, particularly in the Higgs-boson and top-quark sectors. The precision required for such measurements and the specific conditions imposed by the beam dimensions and time structure put strict requirements on the detector design and technology. This includes low-mass vertexing and tracking systems with small cells, highly granular imaging calorimeters, as well as a precise hit-time resolution and power-pulsed operation for all subsystems. A conceptual design for the CLIC detector system was published in 2012. Since then, ambitious R&D programmes for silicon vertex and tracking detectors, as well as for calorimeters have been pursued within the CLICdp, CALICE and FCAL collaborations, addressing the challenging detector requirements with innovative technologies. This report introduces the experimental environment and detector requirements at CLIC and reviews the current status and future plans for detector technology R&D.Comment: 152 pages, 116 figures; published as CERN Yellow Report Monograph Vol. 1/2019; corresponding editors: Dominik Dannheim, Katja Kr\"uger, Aharon Levy, Andreas N\"urnberg, Eva Sickin
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