Scalable algorithms for software based self test using formal methods

textTransistor scaling has kept up with Moore's law with a doubling of the number of transistors on a chip. More logic on a chip means more opportunities for manufacturing defects to slip in. This, in turn, has made processor testing after manufacturing a significant challenge. At-speed functional testing, being completely non-intrusive, has been seen as the ideal way of testing chips. However for processor testing, generating instruction level tests for covering all faults is a challenge given the issue of scalability. Data-path faults are relatively easier to control and observe compared to control-path faults. In this research we present a novel method to generate instruction level tests for hard to detect control-path faults in a processor. We initially map the gate level stuck-at fault to the Register Transfer Level (RTL) and build an equivalent faulty RTL model. The fault activation and propagation constraints are captured using Control and Data Flow Graphs of the RTL as a Liner Temporal Logic (LTL) property. This LTL property is then negated and given to a Bounded Model Checker based on a Bit-Vector Satisfiability Module Theories (SMT) solver. From the counter-example to the property we can extract a sequence of instructions that activates the gate level fault and propagates the fault effect to one of the observable points in the design. Other than the user supplying instruction constraints, this approach is completely automatic and does not require any manual intervention. Not all the design behaviors are required to generate a test for a fault. We use this insight to scale our previous methodology further. Underapproximations are design abstractions that only capture a subset of the original design behaviors. The use of RTL for test generation affords us two types of under-approximations: bit-width reduction and operator approximation. These are abstractions that perform reductions based on semantics of the RTL design. We also explore structural reductions of the RTL, called path based search, where we search through error propagation paths incrementally. This approach increases the size of the test generation problem step by step. In this way the SMT solver searches through the state space piecewise rather than doing the entire search at once. Experimental results show that our methods are robust and scalable for generating functional tests for hard to detect faults.Electrical and Computer Engineerin

Bridging the Testing Speed Gap: Design for Delay Testability

The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a design for delay testability technique such that high-speed ICs can be tested using inexpensive, low-speed ATE. Also extensions for possible full BIST of delay faults are addresse

Software-based self-testing for a risc processor

Software-based self-testing (SBST) has been touted as the effective way to test the processors effectively, with reasonable test coverage, plus the advantages of at-speed testing, and without performance degradation in terms of area and power. Previous work has been done on combining SBST with partial scan logic insertion at Register Transfer Language (RTL) level for a 16-bit RISC processor design. In this project, focus will be done on test coverage improvement without the use of scan logic

Test Strategies for Low Power Devices

Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German

At-Speed Logic BIST for IP Cores

This paper describes a flexible logic BIST scheme that features high fault coverage achieved by fault-simulation guided test point insertion, real at-speed test capability for multi-clock designs without clock frequency manipulation, and easy physical implementation due to the use of a low-speed SE signal. Application results of this scheme to two widely used IP cores are also reported.Design, Automation and Test in Europe (DATE05), 7-11 March 2005, Munich, German

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration

Design for Test and Hardware Security Utilizing Tester Authentication Techniques

Design-for-Test (DFT) techniques have been developed to improve testability of integrated circuits. Among the known DFT techniques, scan-based testing is considered an efficient solution for digital circuits. However, scan architecture can be exploited to launch a side channel attack. Scan chains can be used to access a cryptographic core inside a system-on-chip to extract critical information such as a private encryption key. For a scan enabled chip, if an attacker is given unlimited access to apply all sorts of inputs to the Circuit-Under-Test (CUT) and observe the outputs, the probability of gaining access to critical information increases. In this thesis, solutions are presented to improve hardware security and protect them against attacks using scan architecture. A solution based on tester authentication is presented in which, the CUT requests the tester to provide a secret code for authentication. The tester authentication circuit limits the access to the scan architecture to known testers. Moreover, in the proposed solution the number of attempts to apply test vectors and observe the results through the scan architecture is limited to make brute-force attacks practically impossible. A tester authentication utilizing a Phase Locked Loop (PLL) to encrypt the operating frequency of both DUT/Tester has also been presented. In this method, the access to the critical security circuits such as crypto-cores are not granted in the test mode. Instead, a built-in self-test method is used in the test mode to protect the circuit against scan-based attacks. Security for new generation of three-dimensional (3D) integrated circuits has been investigated through 3D simulations COMSOL Multiphysics environment. It is shown that the process of wafer thinning for 3D stacked IC integration reduces the leakage current which increases the chip security against side-channel attacks