Design of automatic vision-based inspection system for solder joint segmentation

Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under different illumination conditions. Design/methodology/approach: An illumination normalization approach is applied to an image, which can effectively and efficiently eliminate the effect of uneven illumination while keeping the properties of the processed image the same as in the corresponding image under normal lighting conditions. Consequently special lighting and instrumental setup can be reduced in order to detect solder joints. These normalised images are insensitive to illumination variations and are used for the subsequent solder joint detection stages. In the segmentation approach, the PCB image is transformed from an RGB color space to a YIQ color space for the effective detection of solder joints from the background. Findings: The segmentation results show that the proposed approach improves the performance significantly for images under varying illumination conditions. Research limitations/implications: This paper proposes a front-end system for the automatic detection, localisation, and segmentation of solder joint defects. Further research is required to complete the full system including the classification of solder joint defects. Practical implications: The methodology presented in this paper can be an effective method to reduce cost and improve quality in production of PCBs in the manufacturing industry. Originality/value: This research proposes the automatic location, identification and segmentation of solder joints under different illumination conditions

Visual Inspection System To Detect Connector Tilts In PCBAs [TS156. V844 2005 f rb] [Microfiche 7845].

Sistem pemeriksaan visual automatic memainkan peranan penting dalam bahagian tapisan kualiti di industri eletronik. AVI’s are playing important roles in quality inspection in the electronic industry

Inspection of the integrity of surface mounted integrated circuits on a printed circuit board using vision

Machine vision technology has permeated many areas of industry, and automated inspection systems are playing increasingly important roles in many production processes. Electronic manufacturing is a good example of the integration of vision based feedback in manufacturing and the assembly of surface mount PCBs is typical of the technology involved. There are opportunities to use machine vision during different stages of the surface mount process. The problem in the inspection of solder joints on surface mount printed circuit board is much more difficult than many other inspection problems. In this thesis, an approach for inspecting surface mounted integrated circuits (SMICs) is presented. It is based on the variance of intensity values of pixels in an image. This method is able to cope with 4 kinds of soldering defects in SMICs. A set of modules for the system is proposed. The computer program which performs the image processing and analyzing has been written in C. It has been linked with a number of image processing routines from MAVIS1 to perform some image processing tasks, and the result is a compact executable module which works under MS-DOS2 3.30

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.Framework of the IQONIC Project; European Union’s Horizon 2020 Research and Innovation Program

AUTOMATIC OPTICAL INSPECTION-BASED PCB FAULT DETECTION USING IMAGE PROCESSING

Increased Printed Circuit Board (PCB) route complexity and density combined with the growing demand for low-scale rapid prototyping has increased the desire for Automated Optical Inspection (AOI) that reduces prototyping time and production costs by detecting defects early in the production process. Traditional defect detection method of human visual inspection is not only error prone but is also time-consuming given the growing complex and dense circuitry of modern-day electronics. Electric contact-based testing, either in the form of a bed of nails testing fixture or a flying probe system, is costly for low-rate rapid prototyping. An AOI is a non-contact test method using an image processing algorithm that quickly detects and reports failures within the PCB layer based on the captured image. A low-cost AOI system has been created using commercial off-the-shelf components specifically for low-rate production prototyping testing allowing testing of varying layers or various electronic designs without additional setup cost. Once the AOI system is physically configured, the image processing defect detection algorithm compares the test image with a defect-free reference image or by a set of pre-defined rules generated through Electronic Design and Analysis software. Detected defects are then classified into two main categories: fatal and potential. Fatal defects lead to the board\u27s rejection, while potential defects alert the operator to determine if the board should be rejected or will still satisfy pre-defined prototyping criteria. The specifications of an imaging system, camera sensor, imaging lens, and illumination set-up used in the creation of the AOI were designed considering a test PCB article already in production. The algorithm utilized is based on a non-reference defect detection method utilizing mathematical morphology-based image processing techniques to detect defects in the PCB under test

X‐ray microscopy and automatic detection of defects in through silicon vias in three‐dimensional integrated circuits

Through silicon vias (TSVs) are a key enabling technology for interconnection and realization of complex three-dimensional integrated circuit (3D-IC) components. In order to perform failure analysis without the need of destructive sample preparation, x-ray microscopy (XRM) is a rising method of analyzing the internal structure of samples. However, there is still a lack of evaluated scan recipes or best practices regarding XRM parameter settings for the study of TSVs in the current state of literature. There is also an increased interest in automated machine learning and deep learning approaches for qualitative and quantitative inspection processes in recent years. Especially deep learning based object detection is a well-known methodology for fast detection and classification capable of working with large volumetric XRM datasets. Therefore, a combined XRM and deep learning object detection workflow for automatic micrometer accurate defect location on liner-TSVs was developed throughout this work. Two measurement setups including detailed information about the used parameters for either full IC device scan or detailed TSV scan were introduced. Both are able to depict delamination defects and finer structures in TSVs with either a low or high resolution. The combination of a 0.4 objective with a beam voltage of 40 kV proved to be a good combination for achieving optimal imaging contrast for the full-device scan. However, detailed TSV scans have demonstrated that the use of a 20 objective along with a beam voltage of 140 kV significantly improves image quality. A database with 30,000 objects was created for automated data analysis, so that a well-established object recognition method for automated defect analysis could be integrated into the process analysis. This RetinaNet-based object detection method achieves a very strong average precision of 0.94. It supports the detection of erroneous TSVs in both top view and side view, so that defects can be detected at different depths. Consequently, the proposed workflow can be used for failure analysis, quality control or process optimization in R&D environments

Visual Inspection System To Detect Connector Tilts In Pcbas

Sistem pemeriksaan visual automatic memainkan peranan penting dalam bahagian tapisan kualiti di industri eletronik. AVI’s are playing important roles in quality inspection in the electronic industry

Automatic surface defect quantification in 3D

Three-dimensional (3D) non-contact optical methods for surface inspection are of significant interest to many industrial sectors. Many aspects of manufacturing processes have become fully automated resulting in high production volumes. However, this is not necessarily the case for surface defect inspection. Existing human visual analysis of surface defects is qualitative and subject to varying interpretation. Automated 3D non-contact analysis should provide a robust and systematic quantitative approach. However, different 3D optical measurement technologies use different physical principles, interact with surfaces and defects in diverse ways, leading to variation in measurement data. Instrument s native software processing of the data may be non-traceable in nature, leading to significant uncertainty about data quantisation. Sub-millimetric level surface defect artefacts have been created using Rockwell and Vickers hardness testing equipment on various substrates. Four different non-contact surface measurement instruments (Alicona InfiniteFocus G4, Zygo NewView 5000, GFM MikroCAD Lite and Heliotis H3) have been utilized to measure different defect artefacts. The four different 3D optical instruments are evaluated by calibrated step-height created using slipgauges and reference defect artefacts. The experimental results are compared to select the most suitable instrument capable of measuring surface defects in robust manner. This research has identified a need for an automatic tool to quantify surface defect and thus a mathematical solution has been implemented for automatic defect detection and quantification (depth, area and volume) in 3D. A simulated defect softgauge with a known geometry has been developed in order to verify the implemented algorithm and provide mathematical traceability. The implemented algorithm has been identified as a traceable, highly repeatable, and high speed solution to quantify surface defect in 3D. Various industrial components with suspicious features and solder joints on PCB are measured and quantified in order to demonstrate applicability